Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
Reduction of Hazardous Substances vs. Recycling
Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as
lead or halogens. The unintended consequences are huge in terms of diversion of reso
.. read more
Assessing Circuit Pack Design and Assembly for Environmental Performance and Sustainability
Circuit pack assembly involves the use of numerous materials and processes of environmental concern,including
electronic components and associated assembly operations. It is necessary to be abl
.. read more
Life-Cycle Comparison of Energy Use during the Application of Lead-Free Solders
The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally
significant within the solder product life-cycle. Wide differences in the mel
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Mechanical Reliability of Fine Pitch Packages for use in Server and Mobile Electronic Packages
In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in
manufacturing and field usage. Appropriate test methods,including four point ben
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more
Robotic Selective Soldering,an Enabling Soldering Technique
Wave and reflow soldering are well known,successfully proven mass soldering techniques. They offer the ability to
solder printed circuit boards in high volumes quickly with low defect levels,pr
.. read more
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. read more
SMT Rework Machines – Capability,Repeatability and Verification of In-Service Performance
SMT rework machines are vital tools to many production engineers. They can be used to correct process errors and
repair test failures. They can also be used to service and upgrade products retu
.. read more
Flexible Rules Based Thermal Profiling for Surface Mount Rework
Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to
accurately mimic original reflow oven profiles at a localized rework site. Features suc
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more
Using Heuristics to Identify Maverick Lots at In-Circuit Test
Yield and defect levels in the manufacturing of high-complexity and high-reliability Printed Circuit Board
Assemblies (PCBAs) are extremely sensitive to variations in the process,component qual
.. read more
Lessons Learned from the IPC-2501 Testbed Prototype Performance Test at a Motorola Factory
The IPC 2501 Web Service Definition for the exchange of XML data provides an XML middleware integration
environment that enables the deployment of IPC Computer Aided Manufacturing using XML (CA
.. read more
PCB Equipment Communication Standards Today and Tomorrow
All manufacturers in the printed circuit board (PCB) industry have experienced lack of reliability,maintenance,and
performance problems with their machines. These challenges decrease manufactur
.. read more
Advances in Shop Floor Equipment Communication Standards for Final Assembly and Packaging
The Final assembly and packaging area experiences similar integration issues as the Printed Wiring Board –
PWB manufacturing industry. Communications between production equipment is based on di
.. read more
Recent Developments in MSD Control
This paper discusses some of the new challenges
associated with MSD Control in PCB assembly
plants and offers a solution to reduce manufacturing
costs and improve quality by automating this cri
.. read more
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. read more
MSD Control in a High Reliability Production Environment
The Information and Electronic Warfare Systems
business of BAE SYSTEMS Information and
Electronic Systems Integration,Inc. (“BAE
SYSTEMS IEWS”),a subsidiary of BAE SYSTEMS
North America,is invo
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more
Analytical Imaging Techniques for Hard Die Coated Assemblies
With the advent of hard die coated microelectronic assemblies; the ability to perform visual inspections for quality control
and failure analysis has been seriously hindered. Analysts have had
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more
HDPUG's Reliability Testing and Data Analysis of High-Density Packages Lead-Free Solder Joints
Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu,
and OSP finishes are investigated in this study. Emphasis is placed on the determ
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
Reduction of Hazardous Substances vs. Recycling
Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as
lead or halogens. The unintended consequences are huge in terms of diversion of reso
.. read more
Assessing Circuit Pack Design and Assembly for Environmental Performance and Sustainability
Circuit pack assembly involves the use of numerous materials and processes of environmental concern,including
electronic components and associated assembly operations. It is necessary to be abl
.. read more
Life-Cycle Comparison of Energy Use during the Application of Lead-Free Solders
The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally
significant within the solder product life-cycle. Wide differences in the mel
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Mechanical Reliability of Fine Pitch Packages for use in Server and Mobile Electronic Packages
In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in
manufacturing and field usage. Appropriate test methods,including four point ben
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more
Robotic Selective Soldering,an Enabling Soldering Technique
Wave and reflow soldering are well known,successfully proven mass soldering techniques. They offer the ability to
solder printed circuit boards in high volumes quickly with low defect levels,pr
.. read more
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. read more
SMT Rework Machines – Capability,Repeatability and Verification of In-Service Performance
SMT rework machines are vital tools to many production engineers. They can be used to correct process errors and
repair test failures. They can also be used to service and upgrade products retu
.. read more
Flexible Rules Based Thermal Profiling for Surface Mount Rework
Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to
accurately mimic original reflow oven profiles at a localized rework site. Features suc
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more
Using Heuristics to Identify Maverick Lots at In-Circuit Test
Yield and defect levels in the manufacturing of high-complexity and high-reliability Printed Circuit Board
Assemblies (PCBAs) are extremely sensitive to variations in the process,component qual
.. read more
Lessons Learned from the IPC-2501 Testbed Prototype Performance Test at a Motorola Factory
The IPC 2501 Web Service Definition for the exchange of XML data provides an XML middleware integration
environment that enables the deployment of IPC Computer Aided Manufacturing using XML (CA
.. read more
PCB Equipment Communication Standards Today and Tomorrow
All manufacturers in the printed circuit board (PCB) industry have experienced lack of reliability,maintenance,and
performance problems with their machines. These challenges decrease manufactur
.. read more
Advances in Shop Floor Equipment Communication Standards for Final Assembly and Packaging
The Final assembly and packaging area experiences similar integration issues as the Printed Wiring Board –
PWB manufacturing industry. Communications between production equipment is based on di
.. read more
Recent Developments in MSD Control
This paper discusses some of the new challenges
associated with MSD Control in PCB assembly
plants and offers a solution to reduce manufacturing
costs and improve quality by automating this cri
.. read more
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. read more
MSD Control in a High Reliability Production Environment
The Information and Electronic Warfare Systems
business of BAE SYSTEMS Information and
Electronic Systems Integration,Inc. (“BAE
SYSTEMS IEWS”),a subsidiary of BAE SYSTEMS
North America,is invo
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more
Analytical Imaging Techniques for Hard Die Coated Assemblies
With the advent of hard die coated microelectronic assemblies; the ability to perform visual inspections for quality control
and failure analysis has been seriously hindered. Analysts have had
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more
HDPUG's Reliability Testing and Data Analysis of High-Density Packages Lead-Free Solder Joints
Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu,
and OSP finishes are investigated in this study. Emphasis is placed on the determ
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more