Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
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High-Bandwidth Coaxial PWB Transmission Line Probe
The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the
electrical characterization of printed wiring board (PWB) transmission lines is de
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Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards to a Real-Life Product
Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two
decades. However,increasing PCB densities continually put pressur
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Real Life Applications of Nanotechnology in Electronics
Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National
Nanotechnology Initiative is matched by initiatives in Europe and Asia. B
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Polymer-Ceramic Nanocomposites Based on New Concepts for Embedded Capacitor
Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric
constant was above 80 at 1 MHz and the specific capacitance was successfu
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Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
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Loss Tangent and Dielectric Constant of Solder Mask Measured with Split-Post Dielectric Resonators
As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials
becomes critical for design modeling. Understanding these properties and their de
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The Executive Dashboard: Fact or Fiction
Information Technology has come a long way from the humble payroll accounting system to integrated suite of business
applications,ostensibly to assist corporations to manage their businesses mo
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Business Cycles in the Electronic Equipment Food Chain - Growth Comparisons and Forecasts for Process Consumables & Equipment,Passive Components,Semiconductors and Electronic Equipment
Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics
“food chain.” Double ordering,inventory building and component outag
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Reference Designs Leading PWB Fabricators to Future Technology
New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the
supply chain,the PWB fabricator is often the last link that will learn wh
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PCB Design for Flipchip Components
The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when
more and more power and functionality is being offered in ever smaller packa
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A Comparison of PCB Adhesion Test Methods and Adhesion Promoters
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the
advent of lead free soldering processes that severely stress the mechan
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The Importance of CTE in Multi-Layer Registration and Improved Measurement Methods
The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit
boards (MLB) comprising approximately 40% of the market. One of the mos
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Embedding Passive and Active Components in PCB - Solution For Miniaturization
The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component
placement. The embedding of the passive components inside the PCB has already
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Novel Substrate for Use as Embedded Capacitance: An Easy to Process Higher Dk Material
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled
and filled materials were characterized in regards to performance,reliabi
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Trimming Embedded Resistors Using Available PWB Equipment Technology
By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers
can obtain laser trim results similar to the trimming obtained using a specia
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The Latest Technical Trend of Dry Film Photo Resist
This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing
high-density package substrates and chip on films (COF).
1) High resolution
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The Development of Dry Film Photoresist with 15um Lines and Spaces Resolution for Semi-Additive Processing
Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs.
Circuitization of these substrates uses copper pattern plating follow
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High Yields and Low Costs Liquid Resists
In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that
results in the production of a printed wiring board. This imaging manufa
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Practical Lead-Free Implementation
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that
many electronics assemblers will be transitioning their soldering proces
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Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
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Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
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A Study on Coplanar Structures for High Speed Transmission
Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit
designs that employ coplanar structure,either for both single-end and
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Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
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High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
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