Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Copper Electroplating Technology for Microvia Filling
This paper describes a copper electroplating enabling technology for filling microvias.
Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u
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Enhancing Interlaminar Bond Strength for High Performance Resin Systems and Liquid Photoimageable Soldermasks with an Organo-metallic Copper Surface Treatment Process
The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability
high layer count multlayer interconnect devices is moving rapidly. PWB f
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PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
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Peroxy-Sulfuric Oxide Replacements – A Pathway to Improved Technology for Fine Line Processes
Traditional reduced black oxide processes for inner layer bonding have been superseded by a newer generation of peroxidesulfuric
texturing processes. These lower cost processes,based on an orga
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High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
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Advanced Microvia Design
Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics
bring the real advantage to light. This talk will highlight the procedu
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Automatic Generation of RC Network Models for a BGA Package
The need for dynamic compact models for Integrated Circuits (ICs) is a well-recognized problem in electronics cooling
simulations of electronic systems. Simplified thermal models have been repo
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Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
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Insertion Loss,Eye Pattern and Crosstalk Analysis of Mixed Dielectric Striplines (Simulation and Measurement)
As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their
design constraints using FR4. While there are a host of alternative mat
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FPGA on Board
Whilst the number of new ASIC designs has decreased over the last couple of years,there has been a dramatic increase in the
number of FPGA designs implemented. Not only have the number of desig
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Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
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Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
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Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
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Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
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Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
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Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress
The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects
of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff
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A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
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Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
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Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
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Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
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Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder
The continued functional densification and integration in networking products is driving the need to study large form factor
printed circuit boards that use high I/O packages (either ceramics c
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Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
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Design and Development of a High Performance Wirebond BGA Package
As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities
exist to support these applications with higher performance wire bonded pa
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Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
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Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
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