Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Embedded Passives Technology Implementation in RF Applications
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
wiring boards. This paper describes the technology and presents a case study demon
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. read more
Full-Wave Electromagnetic Simulation of PWB Structures
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into a
.. read more
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. read more
Implementation of Embedded Resistor Trimming for PWB Manufacturing
In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be
contained in smaller circuit areas requires that some of the passive components (re
.. read more
Improving Yield and Profitability with Laser Drilled Blind Microvias
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled m
.. read more
The Influence of Fluid Dynamics on Plating Electrolyte for the Successful Production of Blind Micro-Vias: Laboratory Investigations Leading to Optimized...
Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper
ions into the vias. This mass transport limitation is demonstrated by a rough
.. read more
Laminate Materials with Low Dielectric Properties
Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with
improved dielectric properties. This paper focuses on new laminate materials with po
.. read more
Laser Direct Imaging A Solution for Fine Line Imaging
The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major
changes in printed wiring board designs. Higher layer counts,increasing circuit
.. read more
Laser Direct Structuring as an Innovative Alternative for Traditional Lithography
The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for
Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Str
.. read more
Laser Drillable Prepreg Alternative to Coated Copper for HDI Applications
There is a contingent in the industry that feels reinforced substrates are needed to meet the performance
requirements of HDI microvia technology. Concerns that non-reinforced resin coated foil
.. read more
Laser Drilling MicroVias
There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integr
.. read more
Latest Developments in Integrated Polymer Photonic Waveguides in PWB's
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of ph
.. read more
Low Transmission Loss Cyanate Ester Materials with Loose Cross-Linked Structure
A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and
alloyed with polymers was developed to provide low dielectric constant (Dk) and low
.. read more
Making Better Decisions on the Plant Floor using SCADA Systems
With the printed circuit board becoming increasingly complex,there is an ever-growing need to implement
manufacturing standards that ensure high productivity at even higher yields. Factors such
.. read more
Fully Automated,Clean Manufacturing Environment for High Yield Ultra Fine Line (UFL) Production
??Machine Technology designed for the manufacture of Ultra Fine Line product
??Machine design provides clean production environment
??Latest State of the Art,Horizontal Wet Processing Equipment
.. read more
SI - A Multifunctional Polyimide for Use in Flex Circuitry
Polyimides have proven their performance in electronic applications demanding high strength,increased durability,
broader temperature ranges and exceptional chemical resistance. They serve as t
.. read more
A New Lamination Method: Heating the Laminates Through Metal Separators Equipped with Electrical Heating Medium
Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain
identical chemo -rheological properties to yield dimensionally stable laminates. A prep
.. read more
New Positive Working Dry Film Resist
We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen
.. read more
New State-of-Art Dry Film Technology for Fine Lines in High Yield
Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding
fine line requirements.
Advantages for volume production of fine features below 50?
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more
Novel Base Material for Microvias in PWBs by Using Unique Glass Fiber
The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. Industry experience has proven tha
.. read more
Optical Interconnection Technology on the Printed Circuit Board Level
An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time
.. read more
Optical Packaging and Interconnection - A New Wave?
The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropp
.. read more
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. read more
PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing
A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vec
.. read more
Processing Thin Core Capacitor Materials
Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensur
.. read more
Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production
In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. In the paper
.. read more
Solid Solder Deposit (SSDs),For Advanced Packaging Applications
Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices. As the trend towards finer pitch surface m
.. read more
Embedded Passives Technology Implementation in RF Applications
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
wiring boards. This paper describes the technology and presents a case study demon
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. read more
Full-Wave Electromagnetic Simulation of PWB Structures
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into a
.. read more
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. read more
Implementation of Embedded Resistor Trimming for PWB Manufacturing
In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be
contained in smaller circuit areas requires that some of the passive components (re
.. read more
Improving Yield and Profitability with Laser Drilled Blind Microvias
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled m
.. read more
The Influence of Fluid Dynamics on Plating Electrolyte for the Successful Production of Blind Micro-Vias: Laboratory Investigations Leading to Optimized...
Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper
ions into the vias. This mass transport limitation is demonstrated by a rough
.. read more
Laminate Materials with Low Dielectric Properties
Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with
improved dielectric properties. This paper focuses on new laminate materials with po
.. read more
Laser Direct Imaging A Solution for Fine Line Imaging
The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major
changes in printed wiring board designs. Higher layer counts,increasing circuit
.. read more
Laser Direct Structuring as an Innovative Alternative for Traditional Lithography
The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for
Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Str
.. read more
Laser Drillable Prepreg Alternative to Coated Copper for HDI Applications
There is a contingent in the industry that feels reinforced substrates are needed to meet the performance
requirements of HDI microvia technology. Concerns that non-reinforced resin coated foil
.. read more
Laser Drilling MicroVias
There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integr
.. read more
Latest Developments in Integrated Polymer Photonic Waveguides in PWB's
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of ph
.. read more
Low Transmission Loss Cyanate Ester Materials with Loose Cross-Linked Structure
A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and
alloyed with polymers was developed to provide low dielectric constant (Dk) and low
.. read more
Making Better Decisions on the Plant Floor using SCADA Systems
With the printed circuit board becoming increasingly complex,there is an ever-growing need to implement
manufacturing standards that ensure high productivity at even higher yields. Factors such
.. read more
Fully Automated,Clean Manufacturing Environment for High Yield Ultra Fine Line (UFL) Production
??Machine Technology designed for the manufacture of Ultra Fine Line product
??Machine design provides clean production environment
??Latest State of the Art,Horizontal Wet Processing Equipment
.. read more
SI - A Multifunctional Polyimide for Use in Flex Circuitry
Polyimides have proven their performance in electronic applications demanding high strength,increased durability,
broader temperature ranges and exceptional chemical resistance. They serve as t
.. read more
A New Lamination Method: Heating the Laminates Through Metal Separators Equipped with Electrical Heating Medium
Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain
identical chemo -rheological properties to yield dimensionally stable laminates. A prep
.. read more
New Positive Working Dry Film Resist
We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen
.. read more
New State-of-Art Dry Film Technology for Fine Lines in High Yield
Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding
fine line requirements.
Advantages for volume production of fine features below 50?
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more
Novel Base Material for Microvias in PWBs by Using Unique Glass Fiber
The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. Industry experience has proven tha
.. read more
Optical Interconnection Technology on the Printed Circuit Board Level
An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time
.. read more
Optical Packaging and Interconnection - A New Wave?
The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropp
.. read more
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. read more
PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing
A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vec
.. read more
Processing Thin Core Capacitor Materials
Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensur
.. read more
Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production
In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. In the paper
.. read more
Solid Solder Deposit (SSDs),For Advanced Packaging Applications
Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices. As the trend towards finer pitch surface m
.. read more