Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Strategy for Deriving Maximum Profits by Inventory Minimization
Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in
.. read more
Tapping the Hidden Potential for Quality Improvement and Cost Reduction in PCB Manufacturing
Automation,change and complexity have become the normal working environment in the PCB market. With this change has come the realization that high tech manufacturing,technological innovation an
.. read more
TDR and VNA Techniques for PCB Characterization
A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be ext
.. read more
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. read more
Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?
Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. These increasing demands man
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more
Transmission Line Basics,Why Use 'Em At All
It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a
.. read more
Trimming and Printing of Embedded Resistors Using Demand-Mode Ink-Jet Technology and Conductive Polymer
This paper presents a method both to enhance the yield of embedded resistor processes and to print embedded resistors using drop-on-demand ink-jet device capable of dispensing a precise volume
.. read more
The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards
Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes
.. read more
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more
Using Personal Digital Assistants from Alaska to Zanzibar the Dielectric Constant and Dissipation Factors of Non-Woven Aramid/FR4 Laminates For a...
Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. Reliable design o
.. read more
Vertical,Continuous Plating Equipment for Printed Circuit Boards
New vertical continuous plating equipment has been developed while taking into consideration production and environmental requirements. The vertical continuous plating equipment conveys printed
.. read more
X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment
As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major cont
.. read more
New Process for Advanced Packages (PBGA,CBGA,CSP,and New MLF,LLP,and LGA)
The latest types of components launched by the leading component manufacturers have increased the need for process control in rework. These packages are referred to by the generic name Land Gri
.. read more
AOI Performance in the EMS Environment: A Two Year Review
Automated Optical Inspection (AOI) equipment has become an option for electronics manufacturers who are considering how to improve performance on the production line. During the last few years
.. read more
Application Assessment of High Throughput Flip Chip Assembly for a High Lead-Eutectic Solder Cap Interconnect System Using No-Flow Underfill Materials
Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. In many cases,assembly processes are not capable of providing the high throughputs needed
.. read more
Assembly of Flip Chips Utilizing Wafer Applied Underfill
Wafer-applied underfills are key to the widespread acceptance of flip chip technology. This NIST-ATP funded consortium is developing the materials and processes for achieving a wafer-applied un
.. read more
Automated SPC for the Reflow Process
This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performan
.. read more
Applicability of Bi-42Sn-1Ag Solder for Consumer Products
Eutectic Bi-42Sn solder is a low melting point alternative to lead-based solders,particularly for low cost,consumer electronics. In earlier work,the mechanical properties of this solder have be
.. read more
Automation Systems and their Return on Investment
Like many other phrases carelessly thrown around by economists and business consultants,Return on Investment has become the overused acronym ROI,and has gained popularity so quickly that engine
.. read more
Board Design and Assembly Process Evaluation for 0201 Components on PCBs
As 0402 has become a common package for printed circuit board (PCB) assembly,research and development on mounting 0201 components is emerging as an important topic in the field of surface mount
.. read more
Automating the Control of Moisture-Sensitive Components Benefits and ROI Analysis
The control of moisture-sensitive devices (MSDs) prior to SMT reflow is a critical assembly issue that has a direct impact on final product reliability and customer satisfaction as well as manu
.. read more
Paste Inspection Study
Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more
AOI/AXI Combinational Inspection Strategy
The purpose of this study is to understand the capability of both AOI and AXI machines and where the two could be combined to increase the inspection coverage,reduce the overall cycle time of t
.. read more
Comparative Properties of Optically Clear Epoxy Encapsulants
Three epoxy systems were evaluated for physical and optical properties. The three systems chosen for the study were selected on the basis of their optical clarity,color and chemistry. Three dis
.. read more
Continuous Improvement Strategies for Automated X-ray Inspection
Automated X-ray inspection (AXI) is more often a part of an effective test strategy for today's PCBAs1 because of the benefits it provides manufacturers in meeting challenges resulting from2:
•
.. read more
CSP Underfill,Processing,and Reliability
The use of Chip Scale Packaging (CSP) is rapidly expanding,particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these app
.. read more
Developing SPC Methods for use with AOI Equipment in a Contract Manufacturing Environment
In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce
.. read more
Strategy for Deriving Maximum Profits by Inventory Minimization
Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in
.. read more
Tapping the Hidden Potential for Quality Improvement and Cost Reduction in PCB Manufacturing
Automation,change and complexity have become the normal working environment in the PCB market. With this change has come the realization that high tech manufacturing,technological innovation an
.. read more
TDR and VNA Techniques for PCB Characterization
A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be ext
.. read more
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. read more
Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?
Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. These increasing demands man
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more
Transmission Line Basics,Why Use 'Em At All
It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a
.. read more
Trimming and Printing of Embedded Resistors Using Demand-Mode Ink-Jet Technology and Conductive Polymer
This paper presents a method both to enhance the yield of embedded resistor processes and to print embedded resistors using drop-on-demand ink-jet device capable of dispensing a precise volume
.. read more
The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards
Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes
.. read more
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more
Using Personal Digital Assistants from Alaska to Zanzibar the Dielectric Constant and Dissipation Factors of Non-Woven Aramid/FR4 Laminates For a...
Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. Reliable design o
.. read more
Vertical,Continuous Plating Equipment for Printed Circuit Boards
New vertical continuous plating equipment has been developed while taking into consideration production and environmental requirements. The vertical continuous plating equipment conveys printed
.. read more
X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment
As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major cont
.. read more
New Process for Advanced Packages (PBGA,CBGA,CSP,and New MLF,LLP,and LGA)
The latest types of components launched by the leading component manufacturers have increased the need for process control in rework. These packages are referred to by the generic name Land Gri
.. read more
AOI Performance in the EMS Environment: A Two Year Review
Automated Optical Inspection (AOI) equipment has become an option for electronics manufacturers who are considering how to improve performance on the production line. During the last few years
.. read more
Application Assessment of High Throughput Flip Chip Assembly for a High Lead-Eutectic Solder Cap Interconnect System Using No-Flow Underfill Materials
Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. In many cases,assembly processes are not capable of providing the high throughputs needed
.. read more
Assembly of Flip Chips Utilizing Wafer Applied Underfill
Wafer-applied underfills are key to the widespread acceptance of flip chip technology. This NIST-ATP funded consortium is developing the materials and processes for achieving a wafer-applied un
.. read more
Automated SPC for the Reflow Process
This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performan
.. read more
Applicability of Bi-42Sn-1Ag Solder for Consumer Products
Eutectic Bi-42Sn solder is a low melting point alternative to lead-based solders,particularly for low cost,consumer electronics. In earlier work,the mechanical properties of this solder have be
.. read more
Automation Systems and their Return on Investment
Like many other phrases carelessly thrown around by economists and business consultants,Return on Investment has become the overused acronym ROI,and has gained popularity so quickly that engine
.. read more
Board Design and Assembly Process Evaluation for 0201 Components on PCBs
As 0402 has become a common package for printed circuit board (PCB) assembly,research and development on mounting 0201 components is emerging as an important topic in the field of surface mount
.. read more
Automating the Control of Moisture-Sensitive Components Benefits and ROI Analysis
The control of moisture-sensitive devices (MSDs) prior to SMT reflow is a critical assembly issue that has a direct impact on final product reliability and customer satisfaction as well as manu
.. read more
Paste Inspection Study
Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more
AOI/AXI Combinational Inspection Strategy
The purpose of this study is to understand the capability of both AOI and AXI machines and where the two could be combined to increase the inspection coverage,reduce the overall cycle time of t
.. read more
Comparative Properties of Optically Clear Epoxy Encapsulants
Three epoxy systems were evaluated for physical and optical properties. The three systems chosen for the study were selected on the basis of their optical clarity,color and chemistry. Three dis
.. read more
Continuous Improvement Strategies for Automated X-ray Inspection
Automated X-ray inspection (AXI) is more often a part of an effective test strategy for today's PCBAs1 because of the benefits it provides manufacturers in meeting challenges resulting from2:
•
.. read more
CSP Underfill,Processing,and Reliability
The use of Chip Scale Packaging (CSP) is rapidly expanding,particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these app
.. read more
Developing SPC Methods for use with AOI Equipment in a Contract Manufacturing Environment
In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce
.. read more