IPC Adds Nimonik as New Global Standards Subscription Distributor

Effective June 1, 2024, IPC entered into a distribution agreement with Nimonik, a regulatory and standards compliance software company. Nimonik is now able to offer IPC standards products in hard-copy and electronic media format through their online retail store or via an annual subscription.

IPC standards are accepted worldwide as the key manufacturing standards for the printed board and electronics manufacturing industries and they are associated with nearly every stage of the electronic product development cycle. Today, IPC's collection of industry standards and guidelines exceeds 300 active multilingual standards and is used by more than 3,600 companies worldwide.

“Nimonik is honoured to announce our partnership with IPC, a global industry association dedicated to enabling reliable, high-quality electronics by developing the trusted standards that drive the global electronics industry's success,” said Jonathan Brun, Nimonik CEO. “Now, Nimonik customers will have the opportunity to access IPC subscriptions, complementing our existing offerings and providing a complete package for our users."

“IPC is thrilled to add Nimonik to our list of global standards subscription distributors,” said John W. Mitchell, IPC president and CEO. “Companies now have expanded access to IPC standards documents with the addition of this organization; IPC members can purchase a subscription to IPC standards via a well-established online platform.”

To learn more about Nimonik’s , visit www.nimonik.com or their online retail store at https://standards.nimonik.com/.

IPC Midwest EMS Leadership Roundtable: Leveling Up Your Business

Date
-

July 9, 2024 | 4:00 pm – 8:00 pm
Location: Arc-Tronics, Inc.
1150 Pagni Dr
Elk Grove Village, IL 60007
www.arc-tronics.com

Hosted by: Arc-Tronics, Inc.

Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue. Following a presentation on the current EMS market and revenue tiers in the industry, participants will discuss how to reach the next level and grow their business. The discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. Every roundtable ends with unique takeaways. 

Complimentary registration includes:

  • Peer-led roundtable discussions
  • Updates on relevant EMS industry studies/reports
  • Recap of business resources available
  • Reception and dinner
  • Peer networking, partnership building
  • Facility tour (no photography allowed)

Hosted with the support and cooperation of Arc-Tronics, Inc.
Street parking is available, limited parking is available behind the building.

Have questions? Email Mark Wolfe at MarkWolfe@ipc.org.

Arc-Tronics, Inc.

1150 Pagni Dr.
Elk Grove Village, IL 60007
United States

Arc-Tronics, Inc.

Arc-Tronics, Inc.
1150 Pagni Dr.
Elk Grove Village, IL 60007
United States

Chemicals Management for Electronics - USA 2024

Date
-

IPC will be in Boston, MA on June 24th and 25th to keep on top of chemical management and its implication for achieving sustainability initiatives. IPC is proud to be a sponsor for this event and IPC members receive a 15% discount on registration. This event is hybrid – so we hope to see you there in person or on screen.

Hyatt Regency Boston Harbor

101 Harborside Drive
Boston, MA 02128
United States

Hyatt Regency Boston Harbor

Hyatt Regency Boston Harbor
101 Harborside Drive
Boston, MA 02128
United States

IPC's Collaborative Approach to Advocating for Sustainable Electronics

Jun 03, 2024
| By Kelly Scanlon

The call for sustainability in the electronics industry reverberates globally, marking a pivotal moment in our history. With a commitment to fostering change, IPC is actively engaged in empowering manufacturers to navigate this transformative journey. Through industry standards, workforce training, certification programs, and advocacy efforts, IPC champions a collaborative approach to address sustainability challenges head-on. As Dr. John W. Mitchell, president and CEO of IPC, underscores in the latest issue of PCB007 Magazine, the industry's future hinges on concerted efforts to build electronics sustainably, embracing conscientious lifecycle management and resource efficiency. IPC will continue to facilitate dialogue and innovation to shape a more sustainable future for all. Read more in PCB007 Magazine. IPC Contact: Kelly Scanlon

IPC Applauds White House’s Microelectronics Strategy

Jun 03, 2024

Key Summary

• The White House released a National Strategy on Microelectronics Research aligned with the CHIPS Act
• The strategy outlines ambitious U.S. microelectronics objectives for the next five years
• IPC welcomed the focus on advanced packaging, test, and assembly
• The strategy highlights the need for a supportive ecosystem including materials, substrates, and interconnects
• IPC’s 2021 advanced packaging report was cited as a guiding reference
• IPC plans to use the strategy to reinforce its silicon to systems advocacy

In March, the White House Office of Science and Technology Policy (OSTP) unveiled a strategy aimed at catalyzing microelectronics innovation in the United States. Aligned with the bipartisan CHIPS Act, the National Strategy on Microelectronics Research sets forth ambitious objectives for the coming five years. IPC was pleased to see advanced packaging, test, and assembly mentioned, and the emphasis on fostering a supportive ecosystem including materials, substrates, and interconnect technology was on target. IPC’s 2021 report on advanced packaging was also cited as a guiding reference. You can be sure IPC will refer to this strategy often as our advocacy continues, emphasizing a “silicon-to-systems” approach. IPC Contact:  Rich Cappetto

Q:
What is the purpose of the National Strategy on Microelectronics Research?
A:

It aims to accelerate U.S. microelectronics innovation over the next five years in alignment with the CHIPS Act.
 

Q:
Why is IPC supportive of the new strategy?
A:

IPC welcomed the inclusion of advanced packaging, test, and assembly, which are critical components of a strong microelectronics ecosystem.
 

Q:
What parts of the ecosystem does the strategy emphasize?
A:

It stresses the importance of materials, substrates, and interconnect technologies to support innovation and manufacturing.
 

Q:
How is IPC connected to the strategy’s development?
A:

OSTP cited IPC’s 2021 advanced packaging report as a reference, reflecting IPC’s contributions to industry guidance.
 

Q:
How will IPC use the strategy going forward?
A:

IPC will rely on it in ongoing advocacy to promote a silicon to systems approach across the electronics manufacturing landscape.

EU Chips Research Funding Bridges Lab-to-Fab Gap

Jun 03, 2024

Key Summary

• EU allocates first Chips Act funding to pilot lines supporting lab-to-fab semiconductor innovation
• Imec, CEA-Leti and Fraunhofer selected to lead pilot line development
• Pilot lines enable faster commercialization of next-generation semiconductor technologies
• One pilot line dedicated to advanced heterogeneous systems integration
• Initiative strengthens Europe’s long-term competitiveness in semiconductor research and production

 

In early April, the European Commission took another step in advancing semiconductor technology by allocating the first tranche of funding for “pilot lines” under the European Chips Act. Managed by the Chips Joint Undertaking, which oversees the EU's investment in chips research, this allocation marks a pivotal moment in the region's technological advancement. Following a rigorous selection process, Imec, CEA-Leti, and Fraunhofer have emerged as key players among the Research and Technology Organizations (RTOs) entrusted with running these pilot lines. These lines will serve as crucial bridges “from lab to fab,” facilitating the transition of cutting-edge technologies from conception to commercialization. One of the pilot lines will specifically focus on advanced heterogeneous systems integration, highlighting the EU's commitment to fostering innovation across diverse domains within the semiconductor industry. Read the press release from Chips Joint Undertaking. IPC Contact: Alison James.

Q:
What is the purpose of the EU’s pilot line funding?
A:

The pilot lines are meant to bridge the gap between research breakthroughs and commercial semiconductor production, helping new technologies move from early development into practical manufacturing.
 

Q:
Which organizations were selected to operate the pilot lines?
A:

Imec, CEA-Leti, and Fraunhofer were chosen through a competitive evaluation process and will lead several pilot lines across different areas of semiconductor innovation.
 

Q:
Why is heterogeneous systems integration a focus area?
A:

Heterogeneous integration enables combining multiple technologies within a single package, improving performance and efficiency. This area is crucial for advanced chips used in AI, automotive and high-performance computing.
 

Q:
How does this initiative support the EU Chips Act?
A:

The funding directly contributes to the Chips Act goal of strengthening Europe’s semiconductor ecosystem by expanding R&D capacity and improving pathways to manufacturing.
 

Q:
What does this mean for Europe’s semiconductor competitiveness?
A:

By investing early in commercialization infrastructure, the EU aims to reduce reliance on foreign production, accelerate innovation and strengthen its role in the global semiconductor supply chain.

IPC Evaluating Potential Impact of New U.S. EPA Rule on Methylene Chloride

Jun 03, 2024

Key Summary

• EPA finalized a TSCA risk management rule banning most commercial, industrial, and all consumer uses of methylene chloride
• Some applications may continue but must follow strict Workplace Chemical Protection Program requirements
• Electronics manufacturing is directly affected due to restrictions on equipment, appliance, and component manufacturing uses
• EPA will allow time-limited exemptions only for critical uses with no feasible safer alternatives
• IPC is evaluating industry impacts and directing members to EPA’s June 4 webinar for implementation details

The U.S. EPA recently finalized a risk management rule for methylene chloride under the Toxic Substances Control Act (TSCA). The rule seeks to ban all consumer and most commercial and industrial uses of methylene chloride, including uses in electrical equipment, appliance, and component manufacturing. The applications that EPA is allowing to continue will be subject to new mandates under a Workplace Chemical Protection Program. IPC is currently working to understand the potential impacts of this rule on the electronics manufacturing industry. To provide an overview of the EPA’s final regulatory action and implementation timeframes, the EPA is hosting a webinar on Tuesday, June 4, 2024, at 1:00 PM EDT. IPC members are encouraged to read the final rule and register for the webinar to learn more about this important change. IPC Contact: Kelly Scanlon.

Q:
What does the new EPA rule do?
A:

It bans all consumer uses and most commercial and industrial uses of methylene chloride while imposing new safety mandates on any uses that remain allowed.
 

Q:
Why is this rule important to electronics manufacturers?
A:

Because EPA’s restrictions apply to uses in electrical equipment, appliance, and component manufacturing, which may disrupt existing processes.
 

Q:
Will any methylene chloride uses continue under the rule?
A:

Yes, but only under strict Workplace Chemical Protection Program requirements or through limited exemptions for essential uses without viable alternatives.
 

Q:
What is the purpose of the EPA webinar on June 4?
A:

To explain the final rule, timelines, remaining allowed uses, and employer obligations under the new regulatory framework.
 

Q:
How is IPC supporting its members?
A:

IPC is reviewing the rule’s implications for electronics manufacturing and encouraging members to read the final rule and attend the EPA webinar.

James Will to Lead USPAE as New Executive Director

Effective May 28, 2024, James Will joined the U.S. Partnership for Assured Electronics (USPAE) as the association’s new executive director. USPAE is an IPC subsidiary that focuses on partnership with the U.S. Government to support a more robust defense electronics industrial base. Over its short history, USPAE has steered more than $30 million to industry for high priority projects.

As executive director of USPAE, Will is responsible for growing the organization to help ensure the U.S. Government has access to trusted, secure, and resilient electronics supply chains. One of the organization’s signature programs is the Defense Business Accelerator (DBX), which aims to revolutionize how the Department of Defense (DOD) drives dual-use technology development by harnessing the size and speed of the commercial market to accelerate the growth of a resilient dual-use electronics ecosystem.

 An engineer by training, Will comes to USPAE with a strong technical and operational background in the electronics industry and is active in industry organizations, including the National Defense Industrial Association (NDIA) and International Microelectronics Assembly and Packaging Society (iMAPS). His background includes leading and supporting enterprise A&D programs, from foundry to packaged and qualified high-reliability components. As a contractor to the Department of Energy National Nuclear Security Administration, he supported trusted foundry, semiconductor products and components, and assurance interests. Will, most recently, led aerospace and defense business development for SkyWater Technology Foundry. His additional commercial experience includes roles at Motorola and Infineon, from engineer to engineering management, including involvement in a 300mm fab startup.  

“I am excited to build USPAE’s role as a trusted third party that connects industry and U.S. Government stakeholders to promote an assured electronics supply chain,” said Will.  “Strengthening public-private sector collaboration is critical to both U.S. national security and economic growth. I am honored to leverage my experience developing solutions for the aerospace and defense industries to further USPAE’s mission of building a robust domestic ecosystem for electronics manufacturing.”

“With Jim’s extensive background in driving innovation and adopting solutions throughout the electronics supply chain, he is uniquely qualified in growing and positioning USPAE to help ensure the U.S. Government has access to trusted, secure, and resilient electronics,” said John Mitchell, USPAE Chairman of the Board. “Jim is well-respected in the defense manufacturing community, and we’re thrilled to have him at the helm of USPAE.”

For more information on USPAE, visit www.USPAE.org or send inquiries to info@uspae.org.

New IPC Video Urges “Silicon-to-Systems” Approach to CHIPS Funding

May 28, 2024

by Michelle Mermelstein, IPC Director of Media Engagement 

A new video released today by IPC says “focusing on chips just isn’t enough” when it comes to ensuring America’s resilience and security. Instead, the U.S. Government should take a comprehensive “silicon-to-systems” approach to its CHIPS for America and defense electronics programs.

 

With animation and graphics, the video tells the story of how electronic systems are at the heart of everything – from cars to computers to phones and medical devices. The video was produced to help IPC share data supporting the need to recognize the value in the entire electronics ecosystem beyond just silicon chips.

In Washington and around the world, IPC is urging policymakers to take measures such as providing funding for defense purchases of “trusted” printed circuit boards (PCBs); enacting tax incentives for purchases of domestic PCBs; developing more skilled workers and career pathways in electronics; and using CHIPS Act funding to ramp up production of related essentials such as integrated circuit substrates and “advanced packaging.” 

IPC is promoting the video to targeted audiences via its social media accounts, email newsletters, and other communications channels. IPC members and partners are encouraged to help spread the word by sharing the video with their professional networks, elected officials, and local leaders to help explain the need for the “silicon-to-systems” approach.

 

North American PCB Industry Sales Up 9.4 Percent in April

IPC releases PCB industry results for April 2024

IPC announced today the April 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.06.

Total North American PCB shipments in April 2024 were up 9.4 percent compared to the same month last year. Compared to the preceding month, April shipments were up 18.6 percent.

PCB bookings in April were up 2.6 percent compared to the same month last year. April bookings were up 2.9 percent compared to the preceding month.

“Over the last few months, the PCB sector has demonstrated solid performance,” said Shawn DuBravac, IPC’s chief economist. “Strong PCB shipments this month pulled the Book-to-Bill down from its recent high last month.”

April 2024 PCB book to bill ratio chart 1
April 2024 book to bill ration chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

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