North American PCB Industry Sales Up 5.6 Percent in February

IPC Releases PCB Industry Results for February 2023

IPC announced today the February 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.

Total North American PCB shipments in February 2023 were up 5.6 percent compared to the same month last year. Compared to the preceding month, February shipments were up 16.4 percent.

PCB bookings in February were up 1.5 percent compared to the same month last year. February bookings were up 7.8 percent compared to the preceding month.

“Shipments were strong in February and are tracking above 2021 levels for the year,” said Shawn DuBravac, IPC’s chief economist. “However, despite a strong February, order volume remains down through the first two months.”

February 2023 PCB book to bill chart 1
February 2023 PCB book to bill chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

 

North American EMS Industry Up 5.1 Percent in February

IPC releases EMS industry results for February 2023

IPC announced today the February 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.30.

Total North American EMS shipments in February 2023 were up 5.1 percent compared to the same month last year. Compared to the preceding month, February shipments decreased 4.9 percent.

EMS bookings in February decreased 5.4 percent year-over-year and decreased 16.4 percent from the previous month.

“The EMS sector has started the year on a slow note, with orders slipping in the first few months of the year as economic headwinds take hold,” said Shawn DuBravac, IPC’s chief economist.

February 2023 EMS book to bill chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

IPC WINTERCOM 2024

Date
-
World Trade Center Barcelona

View the detailed event programme below for guidance on meeting rooms and times:

Monday - 22 January

Tuesday - 23 January

Wednesday - 24 January

Thursday - 25 January

Event venue map

WinterCom event venue map

 

Thanks to the IPC WinterCom 2024 Sponsors

 

 

 

Join colleagues from around the globe for a week of active participation in IPC standards development committee meetings during IPC WinterCom 2024, Barcelona, Spain, January 22 - 25, 2024.

IPC WinterCom 2024 is a new event to support IPC standards development committees in face-to-face sessions. During the weeklong series of meetings, the global electronics manufacturing industry will meet to develop and maintain the IPC standards they use to build electronics better.

Committee meeting topics will include materials, design, PCB fabrication, PCB assembly, Factory of the Future, e-textiles and all of the most widely used IPC standards will be discussed.

This event is open and free to both IPC members and nonmembers with an interest in IPC standards development committee meetings, from newcomers to IPC standards to longtime industry committee participants and leaders.

IPC appreciates your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors.

We look forward to welcoming you to Barcelona in January!

Committee Meetings Schedule 

8:00 am-8:45 am | Welcome Remarks and Keynote Session, Port Vell Room Networking Area

9:00 am-5:30 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

The group will be resolving comments for Revision K.

9:00 am-12:00 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

5-21N: Cold Joining/Press-fit Task Group
The 5-21N task group is responsible for the handbook that explains accepted industry practices for users of IPC-9797. The handbook details the process techniques, equipment, materials, tests and acceptance requirements for the production of acceptable press-fit hardware.

During this meeting, the task group will provide an update on the development of content for IPC-HDBK-9798A, review action items assigned during previous meetings and review work that has been prepared by A-teams (A-teams topics: sustainability, cross-section, rework).

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
2-17A: IPC-CFX Standard Task Group
The 2-17A task group is responsible for the management of IPC-2591, Connected Factory Exchange, which establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

During this meeting, representatives from the task group A-Team will provide updates on progress made to date for IPC-2591, Version 2.0, which will be released in 2024. Some of these updates include the addition of capabilities for hand soldering stations and wave soldering, additional communications to support sustainability data exchange and a supporting IPC-CFX implementation guideline.

1:30 pm-5:30 pm
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
The 7-31FHV task group is looking at high voltage cable applications in the electric mobility industry.

The task group will be developing content for the High Voltage Addendum.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

D-25A: High Speed High Frequency Communication Devices Subcommittee
Task group developing requirements for mechanical properties, electrical test conditions, interconnections and plug-in technologies for high-speed connections in high reliability applications, such as automotive.

During this meeting, the task group will provide an overview of the work has been done so far in development of IPC-3711, review action items and define a common understanding of some electrical test conditions and parameters.

3:30 pm–5:30 pm
2-19A: Critical Components Traceability Task Group
The 2-19A task group is responsible for the management of IPC-1782, Standard for Manufacturing and Supply Chain Traceability of Electronic Products, which establishes minimum requirements for traceability of items throughout the entire supply chain.

This task group recently released IPC-1782B and is seeking industry input on schemas to collect IPC-1782 data and additional needs to expand the standard to other operations.

8:00 am-8:45 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am-10:15 am
5-21H: Bottom Termination Components (BTC) Task Group
The 5-21H task group is maintaining IPC-7093, a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metalized terminations that are an integral part of the component body.

During this meeting, the task group will provide an update on the development of content for IPC-7093, review main changes have been made so far for the next revision and brainstorm additional needs for further development.

2-12A: Generic Requirements for Digital Twin Task Group
The 2-12A task group is responsible for maintaining IPC-2551, International Standard for Digital Twin Architecture, which stipulates and defines Digital Twin properties, types, complexities and readiness levels.

This meeting will provide a review of the content of this standard and how it applies to real-world use cases and an opportunity for industry to provide input on expansion of the standard for additional use cases.

9:00 am-12:00 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

During this meeting, the task group will be resolving comments for Revision K.

7-25A: Automated Optical Inspection Process Control Standard Task Group
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.

During this meeting, representatives from the task group A-Team will provide an update on the development of content for IPC-9716, which is scheduled for release this year, and explain areas of the draft that would benefit from additional contributions from industry. The group leadership will also introduce a new standards project for AOI process control for IC substrates and how to participate in that initiative.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. A visit to EURECAT's plastronics pilot plant is planned as an afternoon activity. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

9:00 am-5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

10:30 am–12:00 pm
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
The 2-12B task group is responsible for maintaining IPC/DAC -2552, General Electronic Components Model Based Definition (MBD) Standard, a set of specification elements for components and parts as part of a digital model-based standard for digital design of board-level assemblies and to support virtual manufacturing.

During this meeting, task group leadership will provide updates on its progress on the next version of this standard as well as an explanation on the benefits of this standard to industry.

IPC-V-TSL-MVIA-EU: Micro Via Task Group
The IPC-V-TSL-MVIA-EU has been raised in 2022 to address microvia reliability in the European HDI PCB supply chain. The objectives of the subcommittee are to gather experts from EU high-rel electronics manufacturing industry, to execute a specific first work proposal, as well as to identify future ones, and to strengthen EU industry presence in IPC standardization on microvias. The leadership of the subcommittee will provide the motivation for the ongoing work, and include a call to participate. Newcomers are welcome!

10:30 am–5:30 pm
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
This Task Group is responsible for maintaining an addendum to J-STD-001 and IPC-A-610 to enable users to specify a standardized set of acceptance criteria unique to assemblies used in the automotive industry.

During this meeting, the task group will be preparing content for the Final Draft for Industry Review.

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
5-22AS: Space and Military Electronic Assemblies Task Group
The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

The J-STD-001 Space Addendum is ready for Final Draft for Industry Review, during this meeting the group will discuss the next steps.

1:30 pm–3:15 pm
D-31B: IPC-2221/2222 Task Group
This task group is reviewing the latest IPC-2221C revision release and establishing goals for an Amendment 1 to IPC-2221C and a revision to the IPC-2226A standard for HDI/Microvia Design.

2-12C: Cybersecurity Protection Standard Task Group
The 2-12C task group is responsible for maintaining IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain, which establishes requirements to provide assurance that products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to cybersecurity incidents.

During this meeting, task group leadership provide updates on the status of a first amendment to IPC-1792 as well as a white paper on how to implement the standard, both of which are scheduled for release this year.

1:30 pm–5:30 pm
5-33A: Conformal Coating Task Group
The 5-33A task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.

The committee will review tests methods, in particular Dielectric Withstanding Voltage, Thermal Shock and Moisture and Insulation Resistance.

Discussion on their suitability in their current form, and to canvass opinions about any needs for revisions. Previous discussion have been conducted on the MIR test, and will recap those conclusions.

3:15 pm–4:15 pm
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

During this meeting, the group will be discussing the content and seeking input from industry.

3:30 pm-5:30 pm
D-33-AP: Ultra HDI Subcommittee
This subcommittee is developing a white paper outlining the need for future design and fabrication guidelines for printed boards utilizing conductors/spacings below 50 µm and dielectric spacings below 75 µm that are manufactured with semi-additive and modified semi-additive processing.

2-12D: Digital Sustainability Credentials Standard Task Group
The 2-12D task group is responsible for developing IPC-2553 Global Standard for Digital Sustainability Credentials, which establishes the framework, content definition and secure interoperability mechanism that provides the needed ability to exchange factors that influence environmental sustainability, without the risk of IP leakage, in a way that scales from the original source of materials, through to the final product.

During this meeting, attendees will learn about the concepts behind this new standard and how it will apply to real-world usage. Representatives from the task group A-Team will also provide an update on the development of content for the standard and plans it is developing for a proof-of-concept project for this standard using IPC-CFX.

4:30 pm–5:30 pm
7-34: Repairability Subcommittee
The 7-34 subcommittee is responsible for the maintenance of IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies.

During this meeting, the task group will be seeking input from industry on the recently released Revision D.

8:00 am-8:45 | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–12:00 pm
D-33A and 7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
With the publication of IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards, this joint task group effort will be focusing on industry submissions of photographs for the upcoming Revision M to IPC-A-600, Acceptability of Printed Boards.

D-84A: Plastronics Accelerated Reliability Testing Task Group
The D-84A task group is responsible for the development of IPC-9206 Guidelines for Accelerated Reliability Testing of 3D Plastronics Parts, to enable users to specify a standardized set of testing guidelines to verify the reliability of 3D plastronics end products, such as in-mold electronics and laser surface activated molded integrated devices.

During this meeting, the task group will continue the development phase by reviewing the latest working draft content provided by the A-Teams on high temperature, thermal cycling, and vibration testing guidelines. Discussions on the classification system, applicable testing and definitions.

B-10A: Plastic Chip Carrier Cracking Task Group
The B-10A task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components.

This committee is at the inception of the review and revise of the J-STD-033 and would like to get additional active volunteer support from industry.

D-70: E-Textiles Committee
Task groups within this committee are responsible for maintaining and developing IPC standards for conductive yarn functionality; printed electronics e-textiles reliability; woven, knitted and braided e-textiles functionality; embroidered e-textiles design; reliability of e-textiles wearables and multiple new IPC Test Methods to support requirements in these standards.

During this meeting, leaders from each of the task groups will provide updates on their progress, including IPC-8921A (woven, knitted and braided e-textiles), IPC-8981 (e-textiles wearables reliability) and its 14 new IPC Test Methods, IPC-8961 (e-textiles guideline), IPC/JPCA-8911 (conductive yarn) and IPC-8953 (embroidered e-textiles design requirements). Attendees will learn how they can participate in any of these activities and learn about or propose new e-textiles standards activities.

9:00 am–4:30 pm
7-31F: IPC/WHMA-A-620 Task Group
This task group is responsible for maintaining IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

During this meeting, the task group will be resolving comments for Revision F.

9:00 am–5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–5:30 pm
D-33AA: IPC-6012 Automotive Addendum
The D-33AA task group is chartered with maintaining an addendum to the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, that will provide specific requirements for printed boards in automotive applications.

During this meeting, the task group will provide an update on the development of content for IPC-6012FA, review current working draft and work that has been prepared by A-teams (A-teams topics: microvia, CAF, high-voltage test method, metal base printed boards, end of the life test method).

1-14: DFX Standards Subcommittee
The 1-14 subcommittee is developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

This session will focus on reviewing proposed changes to the IPC-2231A in preparation for FDIR.

D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will review the working draft and resolve a pending discussion on definitions. The group will focus on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

4:30 pm–5:30 pm
7-31J: IPC-A-630 Task Group
The 7-31J task group is responsible for the maintenance of IPC-A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures and IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

During this meeting, the group will be reviewing the Final Draft for Industry Review.

8:00 am–9:00 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–3:00 pm
V-EUTG: European Training Group
This is the European Training Group/Committee for ALL IPC Training Programs. Meeting open to ALL training committee members, EU and International. V-EUTG is responsible for reviewing course content, including program translations, and providing recommendations for the training and certification programs.

During this meeting, the group leadership will provide updates on status of certification programs, translation activities and available resources, followed by discussions and comments disposition (if applicable) for each committee: 7-31BT – 610 Training, 5-22BT – 001 Training, 7-31FT- 620 Training, 7-34T – 7711/7721 Training, D-33AT &7-31AT – 6012 & 600 Training, V-TPTG – Training Programs Translation Group. Attendees will learn how they can join a training committee and participate in any of these activities.

9:00 am–12:00 pm
D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will continue to review the working draft focusing on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

9:00 am-12:00 pm
2-40: Documentation Committee

This meeting of the 2-40 Documentation Committee is to review proposed changes to the IPC-261x series of documentation documents, including a proposed new document that synthesizes the content of IPC-2611, IPC-2612, IPC-2612-1, IPC-2614, and IPC-2615, and IPC-D-325.

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:15 pm
5-21JND: Solder Paste Printing Task Group
This task group is responsible for the maintenance of IPC-7527 Requirements for Solder Paste Application.

During this meeting, the task group will review the updates on the working draft for Revision A in preparation for going into Final Draft for Industry Review (FDIR) after the meeting.

1:30 pm–5:30 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

3:15 pm-5:30 pm
7-31N: Manual Magnification Aides Task Group

The 7-31N task group is responsible for IPC-9904 providing guidelines for manual magnification.

During this meeting, the group will be developing content for IPC-9904.

8:00 am-8:45 am | Welcome Remarks and Keynote Session, Port Vell Room Networking Area

9:00 am-5:30 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

The group will be resolving comments for Revision K.

9:00 am-12:00 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

5-21N: Cold Joining/Press-fit Task Group
The 5-21N task group is responsible for the handbook that explains accepted industry practices for users of IPC-9797. The handbook details the process techniques, equipment, materials, tests and acceptance requirements for the production of acceptable press-fit hardware.

During this meeting, the task group will provide an update on the development of content for IPC-HDBK-9798A, review action items assigned during previous meetings and review work that has been prepared by A-teams (A-teams topics: sustainability, cross-section, rework).

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
2-17A: IPC-CFX Standard Task Group
The 2-17A task group is responsible for the management of IPC-2591, Connected Factory Exchange, which establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

During this meeting, representatives from the task group A-Team will provide updates on progress made to date for IPC-2591, Version 2.0, which will be released in 2024. Some of these updates include the addition of capabilities for hand soldering stations and wave soldering, additional communications to support sustainability data exchange and a supporting IPC-CFX implementation guideline.

1:30 pm-5:30 pm
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
The 7-31FHV task group is looking at high voltage cable applications in the electric mobility industry.

The task group will be developing content for the High Voltage Addendum.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

D-25A: High Speed High Frequency Communication Devices Subcommittee
Task group developing requirements for mechanical properties, electrical test conditions, interconnections and plug-in technologies for high-speed connections in high reliability applications, such as automotive.

During this meeting, the task group will provide an overview of the work has been done so far in development of IPC-3711, review action items and define a common understanding of some electrical test conditions and parameters.

3:30 pm–5:30 pm
2-19A: Critical Components Traceability Task Group
The 2-19A task group is responsible for the management of IPC-1782, Standard for Manufacturing and Supply Chain Traceability of Electronic Products, which establishes minimum requirements for traceability of items throughout the entire supply chain.

This task group recently released IPC-1782B and is seeking industry input on schemas to collect IPC-1782 data and additional needs to expand the standard to other operations.

8:00 am-8:45 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am-10:15 am
5-21H: Bottom Termination Components (BTC) Task Group
The 5-21H task group is maintaining IPC-7093, a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metalized terminations that are an integral part of the component body.

During this meeting, the task group will provide an update on the development of content for IPC-7093, review main changes have been made so far for the next revision and brainstorm additional needs for further development.

2-12A: Generic Requirements for Digital Twin Task Group
The 2-12A task group is responsible for maintaining IPC-2551, International Standard for Digital Twin Architecture, which stipulates and defines Digital Twin properties, types, complexities and readiness levels.

This meeting will provide a review of the content of this standard and how it applies to real-world use cases and an opportunity for industry to provide input on expansion of the standard for additional use cases.

9:00 am-12:00 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

During this meeting, the task group will be resolving comments for Revision K.

7-25A: Automated Optical Inspection Process Control Standard Task Group
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.

During this meeting, representatives from the task group A-Team will provide an update on the development of content for IPC-9716, which is scheduled for release this year, and explain areas of the draft that would benefit from additional contributions from industry. The group leadership will also introduce a new standards project for AOI process control for IC substrates and how to participate in that initiative.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. A visit to EURECAT's plastronics pilot plant is planned as an afternoon activity. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

9:00 am-5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

10:30 am–12:00 pm
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
The 2-12B task group is responsible for maintaining IPC/DAC -2552, General Electronic Components Model Based Definition (MBD) Standard, a set of specification elements for components and parts as part of a digital model-based standard for digital design of board-level assemblies and to support virtual manufacturing.

During this meeting, task group leadership will provide updates on its progress on the next version of this standard as well as an explanation on the benefits of this standard to industry.

IPC-V-TSL-MVIA-EU: Micro Via Task Group
The IPC-V-TSL-MVIA-EU has been raised in 2022 to address microvia reliability in the European HDI PCB supply chain. The objectives of the subcommittee are to gather experts from EU high-rel electronics manufacturing industry, to execute a specific first work proposal, as well as to identify future ones, and to strengthen EU industry presence in IPC standardization on microvias. The leadership of the subcommittee will provide the motivation for the ongoing work, and include a call to participate. Newcomers are welcome!

10:30 am–5:30 pm
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
This Task Group is responsible for maintaining an addendum to J-STD-001 and IPC-A-610 to enable users to specify a standardized set of acceptance criteria unique to assemblies used in the automotive industry.

During this meeting, the task group will be preparing content for the Final Draft for Industry Review.

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
5-22AS: Space and Military Electronic Assemblies Task Group
The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

The J-STD-001 Space Addendum is ready for Final Draft for Industry Review, during this meeting the group will discuss the next steps.

1:30 pm–3:15 pm
D-31B: IPC-2221/2222 Task Group
This task group is reviewing the latest IPC-2221C revision release and establishing goals for an Amendment 1 to IPC-2221C and a revision to the IPC-2226A standard for HDI/Microvia Design.

2-12C: Cybersecurity Protection Standard Task Group
The 2-12C task group is responsible for maintaining IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain, which establishes requirements to provide assurance that products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to cybersecurity incidents.

During this meeting, task group leadership provide updates on the status of a first amendment to IPC-1792 as well as a white paper on how to implement the standard, both of which are scheduled for release this year.

1:30 pm–5:30 pm
5-33A: Conformal Coating Task Group
The 5-33A task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.

The committee will review tests methods, in particular Dielectric Withstanding Voltage, Thermal Shock and Moisture and Insulation Resistance.

Discussion on their suitability in their current form, and to canvass opinions about any needs for revisions. Previous discussion have been conducted on the MIR test, and will recap those conclusions.

3:15 pm–4:15 pm
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

During this meeting, the group will be discussing the content and seeking input from industry.

3:30 pm-5:30 pm
D-33-AP: Ultra HDI Subcommittee
This subcommittee is developing a white paper outlining the need for future design and fabrication guidelines for printed boards utilizing conductors/spacings below 50 µm and dielectric spacings below 75 µm that are manufactured with semi-additive and modified semi-additive processing.

2-12D: Digital Sustainability Credentials Standard Task Group
The 2-12D task group is responsible for developing IPC-2553 Global Standard for Digital Sustainability Credentials, which establishes the framework, content definition and secure interoperability mechanism that provides the needed ability to exchange factors that influence environmental sustainability, without the risk of IP leakage, in a way that scales from the original source of materials, through to the final product.

During this meeting, attendees will learn about the concepts behind this new standard and how it will apply to real-world usage. Representatives from the task group A-Team will also provide an update on the development of content for the standard and plans it is developing for a proof-of-concept project for this standard using IPC-CFX.

4:30 pm–5:30 pm
7-34: Repairability Subcommittee
The 7-34 subcommittee is responsible for the maintenance of IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies.

During this meeting, the task group will be seeking input from industry on the recently released Revision D.

8:00 am-8:45 | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–12:00 pm
D-33A and 7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
With the publication of IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards, this joint task group effort will be focusing on industry submissions of photographs for the upcoming Revision M to IPC-A-600, Acceptability of Printed Boards.

D-84A: Plastronics Accelerated Reliability Testing Task Group
The D-84A task group is responsible for the development of IPC-9206 Guidelines for Accelerated Reliability Testing of 3D Plastronics Parts, to enable users to specify a standardized set of testing guidelines to verify the reliability of 3D plastronics end products, such as in-mold electronics and laser surface activated molded integrated devices.

During this meeting, the task group will continue the development phase by reviewing the latest working draft content provided by the A-Teams on high temperature, thermal cycling, and vibration testing guidelines. Discussions on the classification system, applicable testing and definitions.

B-10A: Plastic Chip Carrier Cracking Task Group
The B-10A task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components.

This committee is at the inception of the review and revise of the J-STD-033 and would like to get additional active volunteer support from industry.

D-70: E-Textiles Committee
Task groups within this committee are responsible for maintaining and developing IPC standards for conductive yarn functionality; printed electronics e-textiles reliability; woven, knitted and braided e-textiles functionality; embroidered e-textiles design; reliability of e-textiles wearables and multiple new IPC Test Methods to support requirements in these standards.

During this meeting, leaders from each of the task groups will provide updates on their progress, including IPC-8921A (woven, knitted and braided e-textiles), IPC-8981 (e-textiles wearables reliability) and its 14 new IPC Test Methods, IPC-8961 (e-textiles guideline), IPC/JPCA-8911 (conductive yarn) and IPC-8953 (embroidered e-textiles design requirements). Attendees will learn how they can participate in any of these activities and learn about or propose new e-textiles standards activities.

9:00 am–4:30 pm
7-31F: IPC/WHMA-A-620 Task Group
This task group is responsible for maintaining IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

During this meeting, the task group will be resolving comments for Revision F.

9:00 am–5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–5:30 pm
D-33AA: IPC-6012 Automotive Addendum
The D-33AA task group is chartered with maintaining an addendum to the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, that will provide specific requirements for printed boards in automotive applications.

During this meeting, the task group will provide an update on the development of content for IPC-6012FA, review current working draft and work that has been prepared by A-teams (A-teams topics: microvia, CAF, high-voltage test method, metal base printed boards, end of the life test method).

1-14: DFX Standards Subcommittee
The 1-14 subcommittee is developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

This session will focus on reviewing proposed changes to the IPC-2231A in preparation for FDIR.

D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will review the working draft and resolve a pending discussion on definitions. The group will focus on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

4:30 pm–5:30 pm
7-31J: IPC-A-630 Task Group
The 7-31J task group is responsible for the maintenance of IPC-A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures and IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

During this meeting, the group will be reviewing the Final Draft for Industry Review.

8:00 am–9:00 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–3:00 pm
V-EUTG: European Training Group
This is the European Training Group/Committee for ALL IPC Training Programs. Meeting open to ALL training committee members, EU and International. V-EUTG is responsible for reviewing course content, including program translations, and providing recommendations for the training and certification programs.

During this meeting, the group leadership will provide updates on status of certification programs, translation activities and available resources, followed by discussions and comments disposition (if applicable) for each committee: 7-31BT – 610 Training, 5-22BT – 001 Training, 7-31FT- 620 Training, 7-34T – 7711/7721 Training, D-33AT &7-31AT – 6012 & 600 Training, V-TPTG – Training Programs Translation Group. Attendees will learn how they can join a training committee and participate in any of these activities.

9:00 am–12:00 pm
D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will continue to review the working draft focusing on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

9:00 am-12:00 pm
2-40: Documentation Committee

This meeting of the 2-40 Documentation Committee is to review proposed changes to the IPC-261x series of documentation documents, including a proposed new document that synthesizes the content of IPC-2611, IPC-2612, IPC-2612-1, IPC-2614, and IPC-2615, and IPC-D-325.

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:15 pm
5-21JND: Solder Paste Printing Task Group
This task group is responsible for the maintenance of IPC-7527 Requirements for Solder Paste Application.

During this meeting, the task group will review the updates on the working draft for Revision A in preparation for going into Final Draft for Industry Review (FDIR) after the meeting.

1:30 pm–5:30 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

3:15 pm-5:30 pm
7-31N: Manual Magnification Aides Task Group

The 7-31N task group is responsible for IPC-9904 providing guidelines for manual magnification.

During this meeting, the group will be developing content for IPC-9904.

Event Venue: World Trade Center Barcelona

Moll de Barcelona S/N
South Building
08039 Barcelona
Spain

World Trade Center Barcelona Website

World Trade Center Barcelona

Moll de Barcelona S/N
South Building
08039 Barcelona Barcelona
Spain

World Trade Center Barcelona

World Trade Center Barcelona
Moll de Barcelona S/N
Barcelona, B 08039
Spain

IPC Announces New Thought Leaders Program Experts

Program delivers enhanced awareness and insights on electronics industry trends

IPC has revamped its Thought Leaders Program (TLP) an initiative designed to “mine” key industry experts’ insight and knowledge on issues driving change within the electronics industry.

Five experts have been selected to generate ideas and insights in five areas: education and workforce; technology and innovation; the economy; key markets; and environment, health, and safety. The TLP is chaired by Mike Carano, IPC consultant, and a member of IPC’s Hall of Fame. 

New TLP member are:

The Thought Leaders’ responsibilities will include providing publishable material in their subject areas; flagging opportunities for IPC engagement; and participating in quarterly roundtable discussions. Each expert is expected to fulfill at least one 12-month term, during which quarterly contributions will be expected.

“I’m honored to work with such a diverse and august group of experts,” said Mike Carano. “The program is drawing on individuals who are leaders within the electronics manufacturing industry and who also have insights into market research, trends, cybersecurity, high-tech production, emerging technologies, sustainability, business management, materials science and consulting. Our industry rapidly changes, and these experts have been assembled to provide guidance and solutions to lead and influence change toward building electronics better.”

For more information on the Thought Leaders Program, visit www.elecctronics.org/advocacy/ipc-thought-leaders-program.

 

 

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.

The IPC Chief Technologist Council, composed of nearly 20 technologists at leading companies and organizations, says the emerging CHIPS for America program must be leveraged to stimulate IC substrate fabrication, assembly, and test capabilities. Over the longer term the program must help the U.S. “leapfrog into state-of-the-art capabilities,” the tech leaders say.  

IC substrates are base layers used in the packaging of integrated circuit chips, also called semiconductors. Substrate layers connect chips with each other and with other items on a printed circuit board (PCB), in addition to protecting, reinforcing, and supporting the IC chip. Semiconductors cannot function without IC substrates and PCBs, and more advanced chips require more advanced substrates and PCBs.

However, according to a prior IPC study, the United States has almost no capability to produce the most advanced IC substrates, called Flip Chip Ball Grid Array (FCBGA) or Flip Chip Chip Scale Package (FCCSP). The U.S. also has very limited capability and capacity to produce lower-end wire bonded substrates.

The U.S. Government has established processes to determine how CHIPS Act funding will be allocated, but the resulting “feeding frenzy” is eating up funding while failing to address related needs, the technologists say. While IPC believes IC substrate projects are eligible for CHIPS Act funding, they are not being clearly prioritized.

Thus, the group calls on industry and government to collaborate on building an IC Substrate Manufacturing Center of Excellence – a fabrication pilot line – that could be incrementally improved over time. The facility should be located and designed to address other weaknesses in the semiconductor packaging ecosystem, including education, training, R&D, and related manufacturing centers such as outsourced semiconductor assembly and test (OSAT) facilities.

“Spending more time planning, talking, and debating will not get us to the desired competitiveness position more quickly,” the technologists write. “Only by starting the process, using our collective intellect to make on-the-fly adjustments, will we reconcile the technology shortfall in a timely fashion. We need to do something, and sooner is better than perfect.”

IPC and its allies have been calling on President Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act through a “silicon-to-systems” innovation strategy, recognizing that greater production of chips alone will not meet the U.S. goals of greater security and resilience in its supply chain.

As IPC President and CEO John W. Mitchell has said: “Increasing domestic chips production without bolstering the manufacture of cutting-edge PCBs and IC substrates risks lengthening the semiconductor supply chain, because many of the chips made in California or Ohio will still have to be sent outside of the United States for packaging and assembly into finished products.

“Policy makers need to move beyond a silicon-only mindset and rebuilding the wider U.S. electronics manufacturing industry.”

IPC will continue to work with the Biden administration, the U.S. Congress, and industry partners to support long-term policy and funding to rebuild the entire ecosystem that sustains innovative, resilient, and secure electronics manufacturing in the United States.

For more information, visit www.IPC.org.

Ventec International Group Earns IPC-4101 Qualified Products Listing

IPC's Validation Services Program has awarded an IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards Qualified Products Listing (QPL) to Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China. Ventec International Group provides high-reliability printed circuit board (PCB) base materials for diverse industries including military, aerospace, and automotive with material ranges designed for use in harsh environments, thermal management, signal integrity and RF applications.

Ventec International Group has met or exceeded IPC Validation Services QPL requirements for producing base materials used by PCB manufacturers in the electronics industry. The company successfully qualified its products, VT-90H and VT-901, to specification sheets 40 and 41 to IPC-4101E.

"Being recognized with an IPC Qualified Product Listing (QPL) for our polyimide laminate materials once again is a testament to our high quality and consistent manufacturing of materials for use in high-reliability mil/aero applications. The IPC QPL provides an independent endorsement that can be trusted throughout the entire electronics supply chain, and we are proud to have met the stringent requirements of both IPC’s rigorous facility audit and qualification testing program at an independent test laboratory,” said Mark Goodwin, Chief Operating Officer of Ventec International Group.

“This endorsement provides our customers with an assurance that we meet the rigorous standards for material and production control set by the IPC QPL, giving designers, manufacturers, and OEMs the confidence that we are providing reliable PCB base materials for their mission-critical applications,” Goodwin added.   

IPC's Validations Services QPL Program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards. "Ventec has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Ventec for becoming a trusted supplier conforming to IPC-4101E."

Ventec and other trusted sources of suppliers can be found on IPC's QML/QPL website: www.ipcvalidation.org.

New IPC Sustainability for Electronics Leadership Council to Address Industry Sustainability Challenges

In recognition of the need to identify, understand, and address sustainability challenges faced by the electronics manufacturing industry, IPC announces the Sustainability for Electronics Leadership Council.

Tasked with identifying the most pressing sustainability topics for the industry and building a strategic plan to address these topics, the Leadership Council will be active in an industry-wide materiality assessment to enable the creation of the plan.

Representatives from the following companies were named to the Leadership Council:

  • AT&S
  • Altium
  • BAE Systems
  • Flex
  • Intel
  • Jabil
  • NGC
  • Robert Bosch GmbH
  • Siemens
  • TTM Technologies
  • Zollner

Comprising industry sustainability experts with cross-industry representation from printed circuit board design and manufacturing companies, electronics manufacturing services, and original equipment manufacturers from a variety of product sectors, the Leadership Council plans to meet every two weeks to develop strategy and roadmap recommendations to address the industry’s sustainability challenges.

IPC’s Lead Sustainability Strategist Dr. Kelly Scanlon said, “We hear from the industry that there needs to be a balance between current and evolving regulatory requirements with practical and realistic solutions – for example, specific education, advocacy, and standards – that harmonize the industry’s ability to achieve their sustainability goals.”

John W. Mitchell, IPC president and CEO, and current Chair of the Leadership Council stated, “We look forward to working with the subject matter experts on the Leadership Council. They represent the industry at large, their companies, their value chain segments, and their customers and suppliers. Their expertise in sustainability and electronics manufacturing empowers them to not just think about sustainability for electronics but to take actions that make a real difference.”

 The Sustainability for Electronics Leadership Council intends to present recommendations for a sustainability strategic plan by August 2023.

For further information on IPC's Sustainability for Electronics Initiative, contact Dr. Scanlon at KellyScanlon@ipc.org.

Interconnect Solutions Company Earns IPC/WHMA-A-620 QML Requalification

IPC's Validation Services Program has awarded a requalification of the IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to Interconnect Solutions Company in Fountain Valley, Calif. 

The company has built custom power cables and assemblies since 1971 and continues to be a trusted quality supplier meeting the stringent requirements of IPC’s foremost standard: IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

Interconnect Solutions Company has fulfilled or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high performance electronic assemblies.       

“Interconnect Solutions Company is pleased to announce the successful requalification to IPC/WHMA-A-620 for our Fountain Valley, California facility. The partnership with IPC’s Validation Services team has helped strengthen our internal processes and allows us to continue to offer best in class manufacturing services,” said David Herrera, vice president of operations, Interconnect Solutions Company.

IPC's Validation Services QPL/QML programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Interconnect Solutions Company for maintaining their participation in IPC's network of trusted suppliers.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org  or call +1 847-597-2892.

Hughes Circuits, Inc. Earns IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing

IPC's Validation Services Program has awarded an IPC-1791, trusted electronic designer, fabricator, assembler, and cable and wire harness assembler Qualified Manufacturers Listing (QML), to Hughes Circuits Inc., located in San Marcos, Calif.

Hughes Circuits Inc. is the only electronics manufacturing services (EMS), company located in the San Diego area, which houses a complete PCB layout service bureau, a complete PCB fabrication facility, a full-service PCB assembly facility, and a precision metal fabrication facility. The IPC-1791 QML demonstrates Hughes Circuits Inc.’s commitment to securing a position as a trusted supply in the U.S electronics manufacturing industry.

“I am proud of the work done by our team to ensure the security of our clients and end user data and intellectual property,” said Russ Collins, corporate director of quality for Hughes Circuits Inc. “We are excited to have added the IPC-1791 QML to our extensive list of qualifications, i.e. AS9100D for the aerospace industry, ISO 13485 for the medical industry and the full suite of IPC certifications for all persons involved in PCB layout, fabrication, assembly and metal fabrication.”

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes that conform to IPC standards. The IPC-1791 QML verifies security systems and recognizes companies for either trusted electronics design, fabrication, or assembly, ensuring a high level of integrity.

"IPC's Validation Services Audit Programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Hughes Circuits Inc. on becoming a member of IPC's network of trusted QML suppliers for IPC-1971, design, fabrication and assembly requirements."         

For more information on IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org  or call +1 847-597-2892.

James Webb Telescope Engineer Dr. Kenneth Harris II to Deliver Keynote at EWPTE 2023

Kenneth Harris II, Eng.D. will deliver the opening keynote at Electrical Wire Processing Technology Expo (EWPTE). Acknowledged by Forbes Magazine as one of the world’s youngest and most influential individuals in the field of science, he will present “Building the Future,” on Wednesday, May 17, 2023, at the Wisconsin Center in Milwaukee, Wis.

From starting with NASA at the age of 16 to successfully leading integration of a $10 billion space telescope, Dr. Harris will deliver a captivating 15-year story that explores the engineering complexity behind some of our most ambitious missions to date. He will share his experience as a wire harness engineer on the James Webb Space Telescope and a champion of early STEM exposure.

As a senior project engineer for The Aerospace Corporation, Dr. Harris has what many consider to be a dream job in the STEM field: he contributes to both DoD and NASA payload missions. In this role, Dr. Harris is responsible for developing procedures and implementing processes to defend on orbit satellites from physical and cyber threats -- the attainment of which leads to the successful data collection and orbital life of the mission. The satellite asset protection procedures and analysis allow spacecrafts to be monitored for hackers and anomalous threats from the designated Operations Control Center.

“We’re looking forward to welcoming Dr. Harris to EWPTE 2023,” said Dave Bergman, Wiring Harness Manufacturer’s Association (WHMA) executive director. “We’re eager for him to share his journey to becoming an engineer at NASA and to find out what exciting projects follow his work on the well-known James Webb Space Telescope.”

Produced by WHMA and IPC, EWPTE provides training and education and connects buyers with local, national and international manufacturers and distributors, thus providing new business opportunities. EWPTE will also feature IPC SummerCom, IPC’s standards development committee meetings, to be held May 13-18. For more information on EWPTE, including full descriptions of educational content, pricing on a special technical conference session or the wire harness standards meetings package, or to register, visit www.electricalwireshow.com. To learn more about IPC SummerCom, visit www.ipc.org/event/ipc-summercom.

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