Statement from IPC President and CEO John Mitchell on Final Passage of National Defense Authorization Act

Statement from John Mitchell, IPC president and CEO:

“President Trump's threat to veto the National Defense Authorization Act (NDAA) unless it includes a repeal of Section 230 imperils passage of legislation critical to U.S. military readiness. Tying an unrelated, controversial legislative priority related to liability for content posted on online platforms to the must-pass defense bill creates an unnecessary game of political chicken where, regardless of the outcome, the American people lose.

“IPC urges President Trump and the members of Congress to stay focused on the issues central to the nation’s defense with the goal of enacting the NDAA into law next week.”

IPC Releases IPC-2581 Revision C, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Heralds Design-through-Manufacturing 4.0

IPC-2581C, Generic Requirements for Printed Board Assembly Product Manufacturing Description Data and Transfer Methodology is the eagerly anticipated update of IPC’s widely adopted global standard for PCB design through manufacturing data flow. Revision C introduces groundbreaking new features, automation supporting Industry 4.0, and bidirectional DFX intelligence capability that eliminates the time-consuming back and forth between design house and manufacturers before production can begin.

As technology in the industry progresses, including the latest additive processes with embedded components within the PCB, the IPC-2581 committee of experts has introduced support for the latest technologies, representing every aspect of modern PCB design. Updates include overhauled support for rigid flex, embedded components, cavities, coins, attenuation parameters, connector ports, pin polarities, edge plating, countersink/counterbore, square drill, and intended net-shorts.

Ensuring that all related data is in digital form, IPC-2581 represents the method of choice for automation between design and manufacturing, significantly surpassing proprietary and legacy formats.

As a specific highlight, revision C includes the bi-directional DFX data exchange through which feedback between design and manufacturing is conveyed and tracked before manufacturing begins.

“DFM checking and resolution can be a frustrating and time-consuming process that poses little overall benefit for our customers” said Greg Link, FAE manager for WUS Printed Circuits. “IPC-2581 revision C addresses the need for a collaborative, executable exchange for DFM issues eliminating spreadsheets, PowerPoints, and emails, accelerating new product introduction for our customers."

“As the industry continues to move toward digital data exchange, the timing is right for the technology behind IPC-2581C to bring the opportunity for critical savings and efficiencies in engineering workload. The update benefits both design and manufacturing, supporting agility and responsiveness within the holistic electronics manufacturing process,” stated Matt Kelly, IPC chief technologist.

“IPC-2581C is also a major component of the digital twin architecture and strategy, setting the standard for interoperability between different digital twin solutions, bringing maximum value from data,” Kelly added. “IPC-2581 revision C is much more than an incremental update, providing the industry’s only fully digitalized and automated data exchange. It is ready to be a critical part of any PCB fabrication and assembly manufacturing smart factory strategy.”

For more information or to purchase IPC-2581C, visit the IPC Online Store.

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2021

Deadline for abstracts and proposals: January 5, 2021

WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 11-13, 2021 at the Wisconsin Center in Milwaukee, Wis.

Expert technical presentations are being sought in the following areas:

  • Case Studies on A-620 Success
  • Quality Requirements
  • ESD Impacts on Harness
  • ESD Transmission through Harnesses
  • High Frequency Cabling
  • X-ray Inspection Techniques
  • Crimping Challenges/Dos and Don’ts
  • Crimp Cross Sectioning
  • Wire Harness Troubleshooting
  • Reliability Issues and Failure Analysis
  • Wiring Harness Education and Training
  • Connector Advances
  • Tooling
  • Process Equipment/Productions
    Calibration
  • Ultrasonics Splicing and Terminating
  • Harness Design Drawings
  • Engineering
  • Overmolding
  • Testing – Electrical/Environmental/
    Mechanical
  • Electric Vehicles (EV)/Electric Mobility
  • Cleanliness and FOD
  • Wiring Harness Rework

          An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest, and contain appropriate technical test results. Final selected presentations will be limited to 30 minutes. Technical conference paper abstracts and course proposals are due January 5, 2021. To submit an abstract or course proposal, contact David Bergman, WHMA executive director and IPC vice president, standards and technology, at DavidBergman@ipc.org.

          For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact KimDiCianni@ipc.org or AliciaBalonek@ipc.org.

IPC Day EMS 2020-EMS Day and Beyond

Date
- (2:00 - 7:00am CST)

Presented by IPC Europe and Estonian Electronics Industries Association

10:00-15:00 (UTC +2)

Detailed agenda currently shows (Local Estonian Time) :
• 10.00 – 10:15 Gathering
• 10:15 - 10:25 Welcome and Introduction, Viljar Lubi, Deputy Secretary General of Ministry of Economic Affairs and Communications, Otto Pukk, Chairman of Estonian Electronics Industries Association
• 10:25 – 11:10 The European EMS Industry, structure, development and future, Dieter G. Weiss, in4ma EMS

Market Statistics
• 11:10 - 11:40 Nordic and Baltic Industries During Corona Crisis, Tõnu Mertsina, Swedbank
• 11:40 - 12:10 Estonian Electronics Industry, Arno Kolk, Managing Director of the Estonian Electronics Industries Association
• 12:10 – 12:40 Lunch Break
• 12:40 – 13:00 Electronic Engineering, tbc,
• 13:00 - 13:20 Scanfil - vertically integrated EMS, tbc, Scanfil
• 13:20 - 13:40 OEM View - Why We Built Our Own Factory, Kristjan Maruste, CEO and Co-Founder of

Comodule
• 13:40 - 14:00 Recycling in Electronics Industry, Raido Oras, COO of Kat Metal
• 14:00 - 14:30 Electronics Industry in Latvia, Normunds Bergs, President of LETERA
• 14:30 - 14:50 IPC Green Standards
• 14:50 - 15:00 Wrap up

 

Estonian Electronics Industries Association

Akadeemia tee 23
12618 Tallinn Estonia
Estonia

IPC Drives Collaboration, Transformation, Modernization; Launches Factory of The Future Initiative

To help the electronics manufacturing industry harness the full potential of smart factory/Industry 4.0 technologies, IPC has launched its Factory of the Future initiative. The framework is intended to drive the industry forward by promoting and accelerating modernization; helping to Build Electronics Better.

Building upon 20 years of conventional technology advancements with emerging/disruptive technologies such as digitization, 3D printing, robotics, cloud computing, and equipment data communications, IPC is bringing factory of the future solutions providers together with original equipment manufacturers, EMS companies, and PCB fabricators focused on identifying and solving business challenges important to their companies and supply chains. Target outcomes from new collaborations include improvements in quality, reliability, efficiency, productivity, new product introduction cycles times, and manufacturing operations security enhancements. The model fosters industry-wide modernization by developing new standards, workforce education modules, industry events, and advocacy efforts.

Elements of the initiative include strengthening industry workgroup collaborations (AIAG, PSMA, MTC, HDP, INEMI); addition of new factory of the future technology solutions providers; Chief Technologist Council insights to obtain “voice of customer” input and continuously monitor IPC member manufacturing technology needs; CFX implementation on the shop floor; digital standards portfolio development and growth; and expanded education and training offerings.

“To date, there hasn’t been a clear path on how to implement Industry 4.0 leaving companies paralyzed with information overload and wondering how to make use of innovations that will deliver real value to their business,” said Matt Kelly, IPC chief technologist and initiative lead. “Taking a leadership role, IPC, through its partners and member base will help industry move beyond Industry 4.0 concepts by shifting to implementation of new/emerging technologies, thus modernizing factories, operations, and manufacturing/business processes. IPC will focus its efforts on building common industry building blocks benefiting the entire electronics industry supply chain.”

IPC President and CEO John Mitchell echoes Kelly’s points, “This initiative is very much implementation focused. Our goal is to drive a unified, standardized, and simplified factory of the future industry transformation. Currently, we are working on defining a new factory of future standards category which will include the following areas: connected factory, cybersecurity, digital twin, blockchain, traceability, model-based design, and PCB/PCBA manufacturing data and transfer methodology. IPC is absolutely investing in the electronics industry’s future. It is our goal to be the go-to association helping companies transform and modernize.”

For additional information on IPC’s Factory of the Future initiative, visit. www.ipc.org/ipc-factory-future.   

IPC Presents: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability

Date
-

The Proliferation of Electronics into Harsh Environments and the Effects on Reliability - A Webinar

 

Since the evolution of no-clean soldering processes, many assemblers have enjoyed the cost and time savings a no-clean process affords. The proliferation of electronics into harsh environments has however, highlighted the well-established link between process residues and electro-chemical migration (ECM) caused failures. Higher operational voltages, increased component densities, and assembly miniaturization, and increased reliability expectations increase the relationship between clean assemblies and long-term reliability.

This webinar will detail the relationship between clean assemblies and reliability and the reasons an historically successful no-clean process is measurably less successful on modern assemblies, especially when installed in harsh environments. Factors that affect circuit assembly residue tolerance will be presented as well as residue mitigation processes.

Real-world examples of residue-related failures from the automotive and communications space will be presented along with the solutions adopted by the manufacturers. Multiple residue-induced failure mechanisms will be reviewed including ECM, conformal coating adhesion, frequency distortion, corrosion, and cosmetic. Additionally, the relationship with reflow profiles and residues will be presented.

Newly updated IPC cleanliness quantification standards will also be presented in order to answer the age-old question, “how clean is clean”.

REGISTER

About the Presenter: Mike Konrad

Mike began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents.

Mike was a member of the US Navy's EMPF's Manufacturers Committee and has served on editorial boards for several industry publications.

Mike is an internationally known speaker on the subject of increasing reliability through contamination removal and cleanliness quantification techniques and procedures. Mike was awarded “Distinguish Speaker Status” with SMTA in 2018 and received the “Rich Freiberger Best of Conference Award” in 2019.

Mike was recently elected to the SMTA Global Board of Directors where he chairs the SMTA Training Committee and is also a member of the SMTA Strategic Development Committee. Mike is also Vice President of Technical Programs for the Los Angeles / Orange County SMTA Chapter.

Mike is the host of the popular Reliability Matters Podcast available on Apple Podcasts, Google Podcasts, and Spotify.

Aqueous Technologies

1678 N. Maple Street
Corona, CA 91730
United States