IPC Holds Board Election at IPC APEX EXPO

New board member elected, another re-elected to second term

The Nominating and Governance Committee of the IPC Board of Directors presented one new member candidate and one term-renewal candidate for election at the 64th IPC Annual Meeting on March 9, held in conjunction with IPC APEX EXPO 2021. All board members serve a four-year term.                                                                                                                          

The newly elected Board members are:

  • First-term director: Elke Eckstein, President and CEO, ENICS (Zürich, Switzerland)
  • Second-term director: Cao Xi, Technical Director, Advanced Process Lab, Huawei (Shenzhen, China)

"IPC is privileged to have Elke and Cao added to our current slate of Board members. Both are active contributors to IPC initiatives, and we look forward to their continued contributions to advancing IPC and helping the electronics industry build electronics better," said John Mitchell, IPC president and CEO.

For additional information on IPC's Board of Directors including bios on newly elected Board members, contact Sandy Gentry, IPC communications director, at SandyGentry@ipc.org. For information on IPC APEX EXPO, visit www.ipcapexexpo.org.

IPC Launches New ESG for Electronics Initiative to Provide Guidance to Industry on ESG Practices and Reporting

IPC today unveiled a new ESG for Electronics Initiative to develop guidance for electronics manufacturers on an industry-specific approach to ESG (environmental, social and governance) practices and reporting and to develop aspirational goals that the industry is working together to achieve.  

As part of this initiative, IPC has engaged electronics industry leaders and ESG experts to develop and distribute guidance on key aspects of reporting that demonstrate a commitment to ESG principles. This guidance is intended to help the industry meet ESG goals by providing industry-specific definitions, benchmarks, self-assessments and recommendations.

In developing its guidance, IPC will employ practices similar to its global standards development process/protocol. Members of the ESG for Electronics Steering Group will review initial proposals and existing methodologies, and direct working sub-groups to establish, refine and finalize guidance specifics.

“This initiative truly reaffirms our industry’s commitment to build electronics better,” said John Mitchell, IPC president and CEO. “And to build electronics better, manufacturers must do so with awareness and responsibility to environment, social, and corporate governance factors, fully integrating them into their business core. IPC’s ESG for Electronics initiative will weave together existing and bold, new industry activities to support industry engagement on a range of societal concerns, including circularity and our renewed efforts towards eco-design and raw materials management.”

To view additional information on IPC’s ESG for Electronics Initiative, including an ESG FAQ and call for steering group participation, go to www.ipc.org/esg-electronics.

 

IPC Presents Wide-Ranging Policy Priorities to Biden Administration, Notes Synergies Between “Build Electronics Better” and “Build Back Better”

In a letter to U.S. President Joe Biden, IPC applauds the Biden administration’s early directions on manufacturing policy and maps a detailed policy agenda to drive growth and resilience in electronics manufacturing.

“Your call for a resurgence in U.S. manufacturing signals a federal commitment that is sorely needed and long overdue,” wrote IPC President and CEO John Mitchell. “The U.S. Government needs to move beyond rhetorical support and provide meaningful and tangible programs that collectively constitute a coordinated, bipartisan vision for the future of manufacturing.” 

The letter outlines policy recommendations in five key areas, including:

  1. Strengthen the defense electronics industrial base.
    1. Implement Section 841 of the FY21 National Defense Authorization Act, which will bolster the security and resiliency of the U.S. defense electronics supply chain.
    2. Address concerns with the government’s Cybersecurity Maturity Model Certification (CMMC).
  2. Develop and implement a strategy to promote the factories of the future.
    1. Establish an interagency manufacturing policy lead.
    2. Invest in R&D for the entire electronics ecosystem.
    3. Bring back the U.S. supply chain.
  3. Expand and upskill the workforce.
    1. Support industry-recognized worker credentials.
    2. Reduce the burden for apprenticeship program implementation.
  4. Rebuild trade relationships.
    1. Revive multilateral trade pacts and dispute-resolution bodies.
    2. Endorse and implement a North American Manufacturing Initiative.
  5. Protect human health and the environment via practical policies and regulations.
    1. Structure regulations to build on industry best practices.
    2. Work with industry to ensure policies and regulations are based on existing data and information.

“IPC works with industry to ‘Build Electronics Better,’” Mitchell writes. “Your administration aims for the U.S. to ‘Build Back Better.’ Our shared language suggests we have a shared vision of creating skilled, well-paying jobs in a cleaner economy that renews and extends U.S. leadership in electronics manufacturing.”

View full letter here.

IPC Issues Industry Alert to Members Regarding U.S. EPA Prohibition of PIP (3:1) in Electronics

IPC alerted members about the U.S. Environmental Protection Agency’s (EPA) final risk management rules to reduce exposure to five persistent, bioaccumulative, and toxic chemicals (PBTs). The alert calls attention to the rules, which went into effect February 5, 2021, and to one of the five PBTs with a history of use in electronics: phenol, isopropylated, phosphate (3:1) (known as PIP (3:1)).

The final rule for PIP (3:1) prohibits the processing and distribution of this chemical substance and products containing this chemical substance as of March 8, 2021. There are some exceptions to the prohibition, for example, for new and replacement parts for automotive and aerospace industries, however, there are no electronics industry exceptions.

As a chemical that can perform several functions simultaneously, sometimes under extreme conditions, PIP (3:1) has several distinctive applications: It is used as a plasticizer; a flame retardant; an anti-wear additive; or an anti-compressibility additive in hydraulic fluid, lubricating oils, lubricants and greases, various industrial coatings, and in adhesives and sealants. PIP (3:1) is also used in plastic-containing materials that are used to form tubes, harnesses, cables, sleeves, gaskets, and covers of parts – parts that are used in electrical or electronic products.

IPC seeks out member input on the EPA final rule, requesting information on how the final rule may adversely affect supply chains for electronics manufacturers. To provide input, contact Kelly Scanlon, EHS policy and research director, at KellyScanlon@ipc.org. To view news on EPA’s final PIP (3:1) ruling and other advocacy and EHS-related information, visit www.ipc.org/ipc-advocacy.

The Global Economy Continues to Improve

IPC Releases February 2021 Economic Outlook

Good news! The global economy continues to improve, in many ways recovering better than anticipated. In the United States, our current forecast is for nearly three percent growth in the first quarter and there’s a good chance that our forecast for the first quarter, and all of 2021, will increase in the coming months. Incoming data has been solid.

In this month’s report, you will find U.S. and European data on economic growth, employment, Manufacturer’s Sentiment (PMI) and end markets for electronics.

READ FEBRUARY REPORT

North American PCB Industry Sales Begin 2021 Up 4 Percent

IPC Releases PCB Industry Results for January 2021

IPC announced today the January 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.14.

Total North American PCB shipments in January 2021 were up 4 percent compared to the same month last year. Compared to the preceding month, January shipments decreased 16 percent.

PCB bookings in January increased 17.6 percent year-over-year. Bookings in January decreased 9.2 percent from the previous month.

“PCB shipments fell in January a bit more than expected given recent order trends,” said Shawn DuBravac, IPC’s chief economist. “The slowdown in shipments is driven in part by constraints on semiconductor availability which in turn is exerting pressure on other parts of the supply chain.”

PCB Book to Bill Chart 1 January 2021
PCB Book to Bill Chart 2 January 2021

View charts in pdf format

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.