IPC Education Foundation Launches Scholarships for Students and Educators

Two Scholarship Programs Now Available

The IPC Education Foundation was formally launched during IPC APEX EXPO 2019. As part of that launch, the Foundation committed to starting scholarship programs to raise awareness and reward educators and students that have interest in the electronics industry and the engineering disciplines. On March 4, 2019, the first two of these scholarship programs were opened to eligible participants.

The Michael V. Carano Teacher Excellence Award supports the professional development for secondary and post-secondary educators pursuing training related to the electronics industry. The Award recognizes the extraordinary contributions that Michael Carano has made to IPC and the electronics industry. The award includes a $1,000 scholarship and a one-year membership pass to IPC EDGE, IPC’s on-line learning platform. The online application must be completed by August 1, 2019.

The second scholarship program, The IPC Student Chapter Scholarship, helps to identify and encourage talented and focused IPC Student Chapter Members from to pursue careers in the electronics industry. The IPC Education Foundation has launched seven IPC Student Chapters with a goal of 50 student chapters by the end of 2019. Currently, student members at Auburn, North Carolina State, Sacramento State, Central Carolina Community College, Gwinnett Technical College, Michigan Technical University, and Triton College are eligible for this annual award.

Charlene Gunter, director of strategic partnerships and programs at IPC, remarked, “We are just getting started with our scholarship programs. We’re working hard to secure additional funding to make these career paths more accessible to interested students no matter their economic situation.”

The IPC Education Foundation, a 501©(3) organization, focuses on strengthening and shaping the emerging workforce by providing educational opportunities, connecting the emerging workforce with industry opportunities, improving the perception of the industry, and offering scholarships to deserving students.

For more information on the IPC Education Foundation scholarship programs, contact Charlene Gunter at CharleneGunter@ipc.org or visit www.ipcef.org.

IPC-1401 Listed Amongst Top 10 Chinese Corporate Social Responsibility Standards by CHINA WTO Tribute Magazine

IPC-1401, Supply Chain Social Responsibility Management System Guidance was listed as a top-10 standard in 2017, for Chinese Corporate Social Responsibility (CSR). CHINA WTO TRIBUTE magazine published the Chinese CSR 2017 listing, which focuses on influential events in the Chinese economy and worldwide corporate coverage. 

IPC-1401 was released at IPC APEX EXPO 2017 in the Chinese language as well as an English translated version. More than 160 volunteers from 80 enterprises and 10 trade organizations devoted their time, effort and expertise to deliver the standard.

IPC-1401 was originated by Chinese IPC members, to meet a specific need for second and third tier suppliers to meet the increasingly strict and complicated EU CSR standards. Small to medium suppliers as well as large PRC OEMs, like Huawei, needed to be able to demonstrate compliance to EU CSR standards.  With IPC-1401, and its related training, even small companies can now meet these requirements.

IPC-1401 helps companies achieve intended outcomes of a supply chain social responsibility management system, creating value for the company, its customers, its suppliers and other stakeholders. Users of this standard can expect the following outcomes: enhancement of working conditions, environmental performance and ethics level of the supply chain; fulfillment of compliance obligations and reduced risks and costs of the supply chain; and achievement of social responsibility objectives, including improvement of customer satisfaction and competitive advantages of the enterprise and its supply chain.

The CHINA WTO TRIBUTE was sponsored by the Ministry of Commerce of China, which publishes the top internal and overseas events each year which influence the economic field.

To build on the progress made in CSR, IPC has developed a Corporate Social Responsibility seminar that will be held in Beijing, in May 2018, to bring the new international requirements, best practices and trends in CSR to Chinese companies. For more details on this or other events, visit: http://www.ipc.org.cn/IPCCalendar.asp.

Global Statistical Programs for IPC Members Now Open for 2019

Global Programs Available for EMS, Assembly Equipment and Solder

IPC’s statistical programs for the global electronics manufacturing services (EMS), assembly equipment and solder industries are now open to new participants for 2019. The deadline for IPC members to sign up is April 1. Participating companies receive quarterly market data at no cost. Participation is free to IPC-member companies as a benefit of membership.

The statistical programs give participating companies access to timely market data that they could not collect themselves and would be prohibitively expensive to obtain from research firms. As a neutral and trusted third party, IPC collects sales, orders and other business data from the participating companies using a secure and confidential online survey system. In exchange, these companies receive the aggregate data and comprehensive quarterly reports that reveal the latest market trends for the industry. Individual company data is kept strictly confidential.

Participating companies use the data in their marketing, sales, planning and financial activities. It helps them to track changes in their market shares, compare their business performance to industry averages within their product segments, and identify growing and declining markets.

These statistical programs have been running for decades. The EMS Statistical Program was limited to North American manufacturers until this year. Participation is now open to EMS companies in Asia and Europe. Participants are both public and private companies of all sizes, including many of the world’s leading companies. Details about these and other IPC statistical programs is at www.ipc.org/StatPrograms.

IPC members interested in participating this year can sign up by contacting IPC at marketresearch@ipc.org or by phone at +1 847-597-2868, by April 1.

IPC Issues Call for Participation for IPC E-TEXTILES Europe 2019

IPC® invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts and educational course proposals for IPC E-TEXTILES Europe 2019 to be held on November 12, 2019 in Munich, Germany.

IPC E-TEXTILES Europe 2019 will provide a platform for presenters and their companies to promote their expertise in e-textiles technologies to key contacts from such industries as fashion design, health and medical, sports and athletics, automotive and military/aerospace.  

Expert technical presentations are being sought in the following areas:

reliability, test methods, connectors, design, innovations in materials, mass production, washability, and market-specific e-textiles technologies (automotive, military, consumer wearables, etc.)

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on e-textiles design, manufacturing processes and materials.

Technical conference paper abstracts and course proposals are due May 10, 2019. To submit an abstract or course proposal, e-mail Chris Jorgensen, IPC’s director of technology transfer, at ChrisJorgensen@ipc.org.

IPC Education Foundation Facilitates Partnerships Between Industry Leaders and Educational Institutions

Industry Leaders Sponsor IPC Student Chapters

During IPC APEX EXPO 2019, the IPC Education Foundation launched six IPC student chapters at: Auburn, North Carolina State, Sacramento State, Central Carolina Community College, Gwinnett Technical College, and Michigan Technical University. The student chapters at North Carolina State, Central Carolina Community College and Michigan Technical University provide examples of how industry can partner with education institutions to prepare engineering students with knowledge specific to the electronics industry.

Weller’s Susan Spaulding remarked, “Weller Tools, the world-wide leader in manual soldering equipment, is supporting students at North Carolina State and Central Carolina.”By sponsoring the annual student fee, Weller provides students access to industry produced video courses, IPC standards, and the benefits of IPC membership including additional industry courses at member discounted rates.

Calumet Electronics is another industry partner that is helping college students at Michigan Technical University enter the electronics sector better prepared with specific knowledge and skills. “As we recruit students and faculty to start IPC Student Chapters, we’re creating special partnerships, facilitated by the IPC Education Foundation, to pair IPC member companies with universities and technical schools in their region,” said Colette Buscemi, senior director of IPC education programs. “We’ve built this cooperative model to open opportunities for students to enter our industry with knowledge and skills that give them an advantage in the job market. Companies benefit because their job candidates come to the table with specific, industry knowledge.”

The IPC Education Foundation, a 501©(3) organization, focuses on strengthening and shaping the emerging workforce by providing educational opportunities, connecting the emerging workforce with industry opportunities, improving the perception of the industry, and offering scholarships to deserving students.

For more information on the IPC Education Foundation, contact Buscemi at ColetteBuscemi@ipc.org or visit www.ipcef.org.

Electronics Industry Joins Call for Passage of USMCA

Statement from IPC President and CEO John Mitchell

Representing the views of more than 2,500 U.S. companies engaged in the global electronics industry, and their nearly 1 million workers, IPC, is joining the new USMCA Coalition, which is being launched today in Washington by the U.S. Chamber of Commerce.

More than 200 companies and associations representing an array of economic sectors are backing the USMCA Coalition, which will advocate for congressional approval of the United States-Mexico-Canada Agreement. 

“Building a stronger U.S. electronics industry depends in no small measure on building a stronger North American supply chain,” said IPC President and CEO John Mitchell. “Our association has members with both headquarters and thousands of jobs in the U.S., Mexico and Canada, and thus we have a strong interest in securing enactment of this agreement.

“The USMCA promises to spur even greater integration among the North American economies and strengthen the region’s stature as a formidable global manufacturing base. Improving the manufacturing competitiveness of North America will unlock more growth, innovation and job creation, benefiting people across the continent and the world.

“As always, IPC will continue to advocate for our members’ interests as the debate goes forward.”

IPC Launches Electronics for a Better World | IPC Cares Initiative

Initiative to celebrate electronics industry’s volunteer efforts

With a mission to show the world the altruistic works of companies in the electronics industry, IPC announces the launch of the Electronics for a Better World | IPC Cares initiative. A global effort being scheduled during IPC Founders Week, June 9-15, Electronics for a Better World | IPC Cares will shine a spotlight on the charitable efforts of the electronics industry and will recognize the activities of each participating member company through IPC’s social media platforms.

“There are many generous companies in this industry, and we want to highlight their efforts,” said John Mitchell, IPC president and CEO “We’re asking companies to select the charity of their choice and to support it through staff volunteer efforts during the week of June 9-15. We’re proud of our industry’s efforts to make our communities a better place to work and live.”

“We’re asking supporting companies to take part in a local litter collection; organize a food drive; any event to make a difference, said David Bergman, IPC vice president of standards and technology and program lead. “IPC was founded June 14, 1957 and holding Electronics for a Better World | IPC Cares during IPC Founders Week will show how our industry has a positive impact around the globe — this week of volunteerism is a great way to show the world the good things we do beyond the products we manufacture!”

Supporters who have already pledged to participate are Altex Engineered Electronic Solutions, ASM Assembly Systems, Burkle North America Inc., Chemcut Corporation, Green Circuits Inc., Huawei, ITW EAE, Koh Young Technology, Mycronic Inc., Nordson, and Viscom Inc.

IPC staff has chosen to support Clean the World Foundation, a global health organization whose mission is to improve the quality of life for vulnerable communities around the world by providing sustainable resources for programming, and education focused on water, sanitation, and hygiene for all those affected by poverty, homelessness, and humanitarian or natural crises. 

For more information or to pledge participation, visit the Electronics for a Better World | IPC Cares website at www.ipc.org/ipc-cares.

IPC’s PCB Technology Trends Study Details How PCB Manufacturers Meet Current and Future Technology Demands

PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry.

Based on data from 74 companies worldwide, the 213-page report presents data on PCB technology and OEMs’ PCB requirements as of 2018, as well as OEMs’ use of emerging technologies. Predictions from both industry segments indicate what these measurements are expected to be five years into the future.

The data on OEMs’ use of emerging technologies showed that more than half of those surveyed are currently making products that communicate with the Internet of Things and three quarters make products that depend upon sensor inputs. By 2023, more than half of the reporting OEMs expect at least some of their products to incorporate artificial intelligence and more than one-third expect to make products that interface with humans via neural networks.

Interesting regional differences emerged on the use of blind vias, which are more commonly specified by OEMs in North America and Europe than in Asia. The use of stacked vias by PCB fabricators is also more prevalent in Asia today, but fabricators in all regions expect the use of stacked vias to grow, displacing staggered vias. Asian PCB fabricators are also leading the way in the use of printed electronics, which is expected to grow in all regions by 2023.

Data on board properties cover thickness, layer count, density, line width and spacing, via diameters, aspect ratios, I/O pitch, via design, blind and buried vias, and thermal properties. Use of materials looks at rigid, flexible, stretchable, metal core, loss characteristics and surface finishes. The PCB industry’s use of special structures covers embedded components and chip packages, and its use of printed electronics includes 3D printing and e-textiles. Survey participants’ comments on compliance and technical challenges and trends are included. In addition, the data in the report are segmented by two regions — North America and Europe in one segment, and Asia in another segment — and by two types of products — installed and mobile.

PCB Technology Trends 2018 is available to IPC members for $675 and $1,350 for nonmembers. For more information or to purchase the report, visit IPC’s Online Store.

IPC Issues Call for Participation for IPC APEX EXPO 2020

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium Corporation, MacDermid Enthone, Northrop Grumman, Oracle and Robert Bosch GmbH have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect Issues
  • BTC/QFN/LGA Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • Board and Component Warpage
  • High Speed, High Frequency & Signal
  • Industry 4.0
  • Integrity
  • Lead-Free Fabrication, Assembly & Reliability
  • Miniaturization Nanotechnology Optoelectronics
  • Packaging & Components
  • PCB Fabrication
  • PCB and Component Storage & Handling Performance
  • Quality & Reliability
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. 

In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.

Technical conference paper abstracts are due June 21, 2019 and course proposals are due June 24, 2019. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP. For more information on technical conference or professional development course participation, contact Brook Sandy-Smith, IPC technical education program manager at BrookSandy@ipc.org.

 

 

 

 

 

IPC Validation Services Introduces New Qualified Manufacturers Listing (QML) Program

IPC Validation Services has introduced a new Qualified Manufacturers Listing (QML) program, the IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements QML, to address gaps in current electronics industry trusted supplier accreditation programs. This program provides the electronics industry with a competitive network of “trusted suppliers” to ensure a high level of integrity in the entire PCB assembly supply chain. 

Requirements for certification and QML listing includes; a product and quality system, a supply chain risk management system (SCRM), a security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system (ChoC). Additionally, suppliers can select to hold any combination of the certification types available; designer, fabricator or assembler.

IPC conducted beta site audits of the new program with the following companies which have achieved an IPC-1791 QML as a result of the audit. Companies awarded an IPC-1791 QML for assemblers are: AbelConn Electronics, a Celestica Company, New Hope, Minn; Teledyne Advanced Electronic Solutions, Lewisburg, Tenn.; and Zentech Manufacturing, Inc., Baltimore, Md. Awarded an IPC-1791 QML for fabricators are; Calumet Electronics Corporation, Calumet, Mich.; Colonial Circuits, Fredericksburg, Va.; and Electrotek Corporation, Oak Creek, Wis. Awarded an IPC-1791 QML for designers and assemblers is Science Applications International Corporation (SAIC), Indianapolis, Ind.

During the IPC Validation Services QML audit, all seven companies met or exceeded the requirements for the electronics industry’s newest most comprehensive system for supply chain security. These companies are now listed and recognized as an IPC trusted source capable of delivering secure systems in accordance with industry best practices.

IPC's Validation Services QPL/QML Program was developed to promote supply chain verification and recognition. It also provides auditing and certification of electronics companies' products, and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize AbelConn Electronics, Calumet Electronics Corporation, Colonial Circuits, Electrotek Corporation, Science Applications International Corporation (SAIC), Teledyne Advanced Electronic Solutions and Zentech Manufacturing, Inc. for becoming a member of IPC's network of trusted QML suppliers."                                       

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.   

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