by Ken Schramko, senior director, North American government relations You have probably seen news reports about the various ways that the U.S. Government partial shutdown is affecting "regular people." So we were wondering: How it is affecting the electronics industry, if at all? How is it affecting your company? Please help us by taking a minute now to answer an IPC survey on this issue. Your answers will help us understand the situation better and advocate on your behalf. We’ll publish the results here in about 7-10 days and alert you in an upcoming edition of IPC Global Insight, IPC's weekly e-newsletter. In the meantime, this two-page document from our colleagues at Prime Policy provides an overview of which government agencies and functions are most affected. To cite just a few examples: About 95% of the U.S. EPA’s staff are on furlough; as are about half the staff at the White House office that reviews and approves pending regulations. The State Department will keep issuing passports and visas until they run out of funds; and taxpayers will not have services to help with taxes.

Are you building military boards or circuits for 5G? If so, reliability is of paramount importance and you should consider attending IPC’s Executive Forum for Advancing Automotive Electronics and learn what is being done to improve reliability, what high voltage tests are being conducted, and what new materials and process chemicals have been developed to produce fine lines and dissipate heat. Tier 1 providers will discuss what is expected and what they are doing to improve reliability. Industry icons from Asia and Europe will join American leaders to provide information to help you meet tomorrow’s fabrication and assembly challenges. This not-to-be-missed event will be held at IPC APEX EXPO 2019 on January 28 in San Diego. Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org. For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The subcommittee will hold an open forum during IPC APEX EXPO for industry to discuss this important topic and how industry can come together to address it. Attendees will be invited to share their own issues regarding the weak microvia interface and will learn how to participate on the subcommittee. IPC Weak Microvia Interface Open Forum Wednesday, January 30 10:15 AM to 12:00 PM San Diego Convention Center Room 11A Agenda 10:15-10:20 AM – Introduction and Organization / IPC Solutions Committee Logistics Chris Jorgensen, IPC staff 10:20-10:30 AM – Background: History of the effort, scope of work, status and organization Marc Carter, V-TSL-MVIA Chair 10:30-10:45 AM – Presentation: Current Understanding of the Problem/Mitigation Measures Jerry Magera and J.R. Strickland, Motorola 10:45-11:05 AM – Weak Microvia Interface Project Subteam Reports • Data Collation and Mining on the Issue Happy Holden Using results of tests already conducted by various organizations to establish “knowns” vs. “unknowns” for further study and/or confirmation • FMEA “Fishbone” Presentation on what the group has done so far, the categories and that we need volunteer experts to help fill in that information • Engineering Simulation Marc Carter Initial high-level model debugging Incorporating data collation and Fishbone targets going forward 11:05-11:30 AM – Next Steps and Goals • Near term: o Breakout teams (plan for Thursday working meeting based on Fishbone) Marc Carter o Published literature and public data “mining” effort Mike Carano, V-TSL Committee Chair • Middle term: o Knowns/Unknowns: Can any intermediate conclusions or improved mitigation techniques be communicated in another white paper? o Identify Testing Needed: Gaps and confirmation o Capture suggestions from the floor (continue during Q&A/Discussion) • Long term: Prevention: Can it be accomplished through design, process enhancements, etc.? 11:30AM-12:00PM – Q&A Session and How to Get Involved The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed as a result of work done on IPC-WP-023. Order IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat - Weak Microvia Interface from the IPC bookstore. For more information on the IPC V-TSL-MVIA Subcommittee, e-mail me at ChrisJorgensen@ipc.org.

By Chris Jorgensen, director, technology transfer IPC has received interest from several volunteers in Europe to form an e-textiles standards interest group in Europe. Volunteers from this group would meet to influence IPC standards activities, form working groups to develop new IPC standards and to network under the umbrella of developing standards. If you would like to be added to the roster for this interest group, so you can stay abreast of its activities, e-mail me at ChrisJorgensen@ipc.org. The group is open to anyone and at no cost or obligation. For more information on the formation of this interest group and potential working groups in Europe, as well as how to participate in other IPC e-textiles standards activities, view the slide deck from the December 13 meeting to the European e-textiles market.

IPC president and CEO John Mitchell invites you to attend IPC APEX EXPO 2019. From the show floor to the class room and all points in between, IPC APEX EXPO 2019 is THE place to be to learn, network, and conduct business. https://youtu.be/jlr0XVekkKo

In Part 10 of IPC President and CEO John Mitchell’s blog series on workforce issue, John covers gender differences in the workplace. As I mentioned last week, in Part 5: Demographic Differences, we reviewed two primary topics: generational differences and gender differences. In today’s blog, we discuss discoveries around gender as it concerns the workplace and talk about what companies and organizations might do to enhance their success when confronting any challenges. Differences Expected Again, let me reiterate the danger of generalizations (some of which we are about to report on) when it comes to gender. Every individual is indeed that – an individual. What we will be sharing below represents trends, not absolutes, so to get the best results you will need to know your people well. Really well. Which leads us to our first point – Communication. READ MORE...

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white paper that cast a light on how a weak microvia interface is a hidden reliability threat. The subcommittee will hold an open forum for industry to learn about its activities as well as its planned path forward. Attendees will be invited to share their own issues regarding weak microvia interfaces and will learn how to participate on the subcommittee. IPC Weak Microvia Interface Open Forum Wednesday, January 30, 2019 10:15 AM to 12:00 PM San Diego Convention Center Room 11A Order IPC WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat - Weak Microvia Interface from the IPC bookstore. For more information on the IPC V-TSL-MVIA Subcommittee, contact me at ChrisJorgensen@ipc.org.

The U.S. Commerce Department’s Bureau of Industry and Security (BIS) published a notice seeking public comment on how it should define and identify emerging technologies that are not now controlled for export, but should be due to their national security importance. Representative general categories of emerging technologies on which Commerce seeks comments include: (i) “biotechnology”; (ii) “artificial intelligence”; (iii) “Position, Navigation, and Timing (PNT) technology”; (iv) “microprocessor technology”; (v) “advanced computing technology”; (vi) “data analytics technology”; (vii) “quantum information and sensing technology”; (viii) “logistics technology”; (ix) “additive manufacturing”; (x) “robotics”; (xi) “brain-computer interfaces”; (xii) “hypersonics”; (xiii) “advanced materials”; and (xiv) “advanced surveillance technologies.” Comments are due on or before December 19, 2018. IPC will be responding. Please contact IPC Vice President of Global Government Relations, Chris Mitchell, at ChrisMitchell@ipc.org with your questions and perspectives on this notice.

One of the biggest events to occur in the political and policy world in the last month was, of course, the U.S. midterm elections, in which the Democrats gained almost 40 seats in the House of Representatives while minimizing their losses in the U.S. Senate. The incoming Congress will be younger and more diverse than ever. Several key moderates and senior leaders will be leaving the scene. The election results are likely to bring even more partisan gridlock to Washington in the months ahead. That said, IPC works with policy makers on a bipartisan basis, and our policy priorities tend to earn support across party lines. Thus, we will continue to educate policymakers on both sides and advance smart policy solutions with a long-term perspective. IPC-organized webinar on the election results and what they may mean for our industry: https://www.youtube.com/watch?v=vhtqI5dCyQ8&feature=youtu.be

Pursuant to Section 845 of the Fiscal 2019 National Defense Authorization Act (NDAA), the U.S. Department of Defense (DoD) is required to provide an assessment of the defense electronics industrial base to Congress by January 31, 2019. IPC has been the primary champion for this study, which reflects the need for a comprehensive evaluation of the defense electronics supply chain and its future needs. Mid October, IPC cohosted a day-long discussion of the issue with DoD, WHMA and ECIA, focusing on five segments of the industry: PCB, EMS, cable/wire harness, connectors, and passive components. And in the coming weeks, we will be submitting more information and recommendations to the DoD. Have questions or suggestions? Contact Chris Mitchell, IPC vice president of global government relations.