IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

  • Post Reflow In-Circuit Test
  • During “Box Level” Assembly Environmental Stress Screening (ESS)
  • In Service (End Customer Fielded Product)

Many of these failures occurred within products that had already passed traditional production lot acceptance testing in accordance with existing IPC-6010, Printed Board Qualification and Performance Specifications. IPC has been provided with data showing that traditional inspection techniques utilizing thermally stressed microsections and light microscopes alone is no longer an effective quality assurance tool for detecting microvia-to-target plating failures.

Related to this, in 2018, IPC released IPC-WP-023, an IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance titled “Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface.”  The white paper asserts stacked microvia reliability problems linked to a weak interface between microvia target pads and electrolytic copper fill and provides data in support of the observations reported by numerous IPC OEM member companies.

As a result of IPC-WP-023, the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee was formed in late 2018 to begin investigating the potential causes of these failures and to provide industry resources on the topic. This group provided its first update to industry during an open forum held during IPC APEX EXPO 2019 and will continue to provide updates as it progresses.

In response to this, IPC is issuing the following warning statement, which will also be included in the forthcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards:

“There have been many examples of post fabrication microvia failures over the last several years.  Typically, these failures occur during reflow, however they are often undetectable (latent) at room temperature. The further along the assembly process that the failures manifest themselves the more expensive they become. If they remain undetected until after the product is placed into service, they become a much greater cost risk, and more importantly, may pose a safety risk.”

Looking forward, IPC is working on the concept of moving away from traditional microsection evaluations and focusing on performance-based acceptance testing, a recommendation made several years ago by the IPC D-33a Rigid Printed Board Performance Task Group responsible for the IPC-6012 specification. In conjunction with this task group and the IPC 1-10c Test Coupon and Artwork and Generation Task Group and D-32 Thermal Stress Test Methodology Subcommittee, IPC continues to work on revisions to its existing test methods for thermal stress (IPC-TM-650, Method 2.6.27) and thermal shock (IPC-TM-650, Method 2.6.7.2). These methodologies make use of performance-based acceptance test coupons utilizing electrical resistance measurements, such as the IPC-2221B Appendix “D” coupon, which when designed properly in accordance with the IPC-2221B Gerber Coupon Generator tool, have allowed manufacturers to detect latent microvia failures and shelter themselves from possible defect escapes.

For more information on this issue, contact John Perry, director, printed board standards & technology, at JohnPerry@ipc.org.

2019 Annual Wire Harness Conference – WHMA Connects You to Resources That Make You an Industry Leader

Lead, Educate and Connect - these three words gives the perfect insight into this year’s Wire Harness Conference. Starting with a record high of 50 attendees joining the “First Timers Session” that was led by representatives of WHMA’s Board of Directors; this meeting was to educate the participants on the association and conference, discuss industry topics, and introduce and connect the First Timers with other members throughout the conference.

With 2019 being one of the largest Annual Wire Harness Conferences hosted by WHMA, with 32 Exhibitors and 235 attendees, the presentations were full, roundtables were conversing, the exhibit hall was busy, and the receptions were buzzing. This conference is not just a conference but has become an investment for many attendees to learn, grow, share and discover new approaches in the wire harness and cable industry.

The Conference planning committee goes to great lengths to create a compelling and educational industry related agenda and did this year justice. Starting with the Keynote Presenter, Todd Buchholz and his riveting presentation entitled “Prosperity Ahead – or Not?”, giving the audience an understanding of the competitive pressure, we face today and a road map to finding success.

Diving into what to expect from the economy this year and beyond was Taylor St. Germain with his presentation on, “Wire Harness Industry Economics – The Future and Now.”  This presentation had the audience on the edge of their seats learning about using a rate-of-change calculation method by which their company can take advantage of their own data and the economic environment. They also walked away with a clearer vision for the economic future in 2019 and beyond, an understanding on the impact of government policy on the economy, and inflation, interest rate and profitability expectations.

With other great speakers focusing on supporting and developing standards, profiting from R&D tax credits, and developing the future workforce in manufacturing, the conference provided pertinent information to their attendees. Daniel Penrod from LJR Electronics stated, “I've attended the WHMA annual conference on and off since 2000, both as a manufacturer and now as a distributor.  The 2019 conference was the best yet, with greater attendance and relevant economic speakers.”

Thoughts from the Chairman of WHMA’s Board of Directors about this year’s conference. “It was great to hear the attendee feedback that the 2019 WHMA conference was one of the best ever. They really appreciated the opportunity to network with their industry peers, while learning about ways to improve their business. The 2020 conference in Las Vegas should be even better,” said Rick Bromm, President, Altex.

In 2020, WHMA’s Annual Wire Harness Conference will be held at the JW Marriott Las Vegas Resort & Spa the week of February 16th. The 2020 Annual Conference Committee are developing the agenda, locating speakers and forming discussion topics for this exciting industry event. This event goal is to LEAD you through the best practices of the wire harness and cable industry, EDUCATE you on developing standards and additional resources throughout the industry, and CONNECT you with long-lasting, valuable relationships within your industry. Keep an eye on www.whma.org for more details.

IPC Education Foundation Launches Scholarships for Students and Educators

Two Scholarship Programs Now Available

The IPC Education Foundation was formally launched during IPC APEX EXPO 2019. As part of that launch, the Foundation committed to starting scholarship programs to raise awareness and reward educators and students that have interest in the electronics industry and the engineering disciplines. On March 4, 2019, the first two of these scholarship programs were opened to eligible participants.

The Michael V. Carano Teacher Excellence Award supports the professional development for secondary and post-secondary educators pursuing training related to the electronics industry. The Award recognizes the extraordinary contributions that Michael Carano has made to IPC and the electronics industry. The award includes a $1,000 scholarship and a one-year membership pass to IPC EDGE, IPC’s on-line learning platform. The online application must be completed by August 1, 2019.

The second scholarship program, The IPC Student Chapter Scholarship, helps to identify and encourage talented and focused IPC Student Chapter Members from to pursue careers in the electronics industry. The IPC Education Foundation has launched seven IPC Student Chapters with a goal of 50 student chapters by the end of 2019. Currently, student members at Auburn, North Carolina State, Sacramento State, Central Carolina Community College, Gwinnett Technical College, Michigan Technical University, and Triton College are eligible for this annual award.

Charlene Gunter, director of strategic partnerships and programs at IPC, remarked, “We are just getting started with our scholarship programs. We’re working hard to secure additional funding to make these career paths more accessible to interested students no matter their economic situation.”

The IPC Education Foundation, a 501©(3) organization, focuses on strengthening and shaping the emerging workforce by providing educational opportunities, connecting the emerging workforce with industry opportunities, improving the perception of the industry, and offering scholarships to deserving students.

For more information on the IPC Education Foundation scholarship programs, contact Charlene Gunter at CharleneGunter@ipc.org or visit www.ipcef.org.

IPC-1401 Listed Amongst Top 10 Chinese Corporate Social Responsibility Standards by CHINA WTO Tribute Magazine

IPC-1401, Supply Chain Social Responsibility Management System Guidance was listed as a top-10 standard in 2017, for Chinese Corporate Social Responsibility (CSR). CHINA WTO TRIBUTE magazine published the Chinese CSR 2017 listing, which focuses on influential events in the Chinese economy and worldwide corporate coverage. 

IPC-1401 was released at IPC APEX EXPO 2017 in the Chinese language as well as an English translated version. More than 160 volunteers from 80 enterprises and 10 trade organizations devoted their time, effort and expertise to deliver the standard.

IPC-1401 was originated by Chinese IPC members, to meet a specific need for second and third tier suppliers to meet the increasingly strict and complicated EU CSR standards. Small to medium suppliers as well as large PRC OEMs, like Huawei, needed to be able to demonstrate compliance to EU CSR standards.  With IPC-1401, and its related training, even small companies can now meet these requirements.

IPC-1401 helps companies achieve intended outcomes of a supply chain social responsibility management system, creating value for the company, its customers, its suppliers and other stakeholders. Users of this standard can expect the following outcomes: enhancement of working conditions, environmental performance and ethics level of the supply chain; fulfillment of compliance obligations and reduced risks and costs of the supply chain; and achievement of social responsibility objectives, including improvement of customer satisfaction and competitive advantages of the enterprise and its supply chain.

The CHINA WTO TRIBUTE was sponsored by the Ministry of Commerce of China, which publishes the top internal and overseas events each year which influence the economic field.

To build on the progress made in CSR, IPC has developed a Corporate Social Responsibility seminar that will be held in Beijing, in May 2018, to bring the new international requirements, best practices and trends in CSR to Chinese companies. For more details on this or other events, visit: http://www.ipc.org.cn/IPCCalendar.asp.

Global Statistical Programs for IPC Members Now Open for 2019

Global Programs Available for EMS, Assembly Equipment and Solder

IPC’s statistical programs for the global electronics manufacturing services (EMS), assembly equipment and solder industries are now open to new participants for 2019. The deadline for IPC members to sign up is April 1. Participating companies receive quarterly market data at no cost. Participation is free to IPC-member companies as a benefit of membership.

The statistical programs give participating companies access to timely market data that they could not collect themselves and would be prohibitively expensive to obtain from research firms. As a neutral and trusted third party, IPC collects sales, orders and other business data from the participating companies using a secure and confidential online survey system. In exchange, these companies receive the aggregate data and comprehensive quarterly reports that reveal the latest market trends for the industry. Individual company data is kept strictly confidential.

Participating companies use the data in their marketing, sales, planning and financial activities. It helps them to track changes in their market shares, compare their business performance to industry averages within their product segments, and identify growing and declining markets.

These statistical programs have been running for decades. The EMS Statistical Program was limited to North American manufacturers until this year. Participation is now open to EMS companies in Asia and Europe. Participants are both public and private companies of all sizes, including many of the world’s leading companies. Details about these and other IPC statistical programs is at www.ipc.org/StatPrograms.

IPC members interested in participating this year can sign up by contacting IPC at marketresearch@ipc.org or by phone at +1 847-597-2868, by April 1.

IPC Issues Call for Participation for IPC E-TEXTILES Europe 2019

IPC® invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts and educational course proposals for IPC E-TEXTILES Europe 2019 to be held on November 12, 2019 in Munich, Germany.

IPC E-TEXTILES Europe 2019 will provide a platform for presenters and their companies to promote their expertise in e-textiles technologies to key contacts from such industries as fashion design, health and medical, sports and athletics, automotive and military/aerospace.  

Expert technical presentations are being sought in the following areas:

reliability, test methods, connectors, design, innovations in materials, mass production, washability, and market-specific e-textiles technologies (automotive, military, consumer wearables, etc.)

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on e-textiles design, manufacturing processes and materials.

Technical conference paper abstracts and course proposals are due May 10, 2019. To submit an abstract or course proposal, e-mail Chris Jorgensen, IPC’s director of technology transfer, at ChrisJorgensen@ipc.org.

IPC Education Foundation Facilitates Partnerships Between Industry Leaders and Educational Institutions

Industry Leaders Sponsor IPC Student Chapters

During IPC APEX EXPO 2019, the IPC Education Foundation launched six IPC student chapters at: Auburn, North Carolina State, Sacramento State, Central Carolina Community College, Gwinnett Technical College, and Michigan Technical University. The student chapters at North Carolina State, Central Carolina Community College and Michigan Technical University provide examples of how industry can partner with education institutions to prepare engineering students with knowledge specific to the electronics industry.

Weller’s Susan Spaulding remarked, “Weller Tools, the world-wide leader in manual soldering equipment, is supporting students at North Carolina State and Central Carolina.”By sponsoring the annual student fee, Weller provides students access to industry produced video courses, IPC standards, and the benefits of IPC membership including additional industry courses at member discounted rates.

Calumet Electronics is another industry partner that is helping college students at Michigan Technical University enter the electronics sector better prepared with specific knowledge and skills. “As we recruit students and faculty to start IPC Student Chapters, we’re creating special partnerships, facilitated by the IPC Education Foundation, to pair IPC member companies with universities and technical schools in their region,” said Colette Buscemi, senior director of IPC education programs. “We’ve built this cooperative model to open opportunities for students to enter our industry with knowledge and skills that give them an advantage in the job market. Companies benefit because their job candidates come to the table with specific, industry knowledge.”

The IPC Education Foundation, a 501©(3) organization, focuses on strengthening and shaping the emerging workforce by providing educational opportunities, connecting the emerging workforce with industry opportunities, improving the perception of the industry, and offering scholarships to deserving students.

For more information on the IPC Education Foundation, contact Buscemi at ColetteBuscemi@ipc.org or visit www.ipcef.org.

Electronics Industry Joins Call for Passage of USMCA

Statement from IPC President and CEO John Mitchell

Representing the views of more than 2,500 U.S. companies engaged in the global electronics industry, and their nearly 1 million workers, IPC, is joining the new USMCA Coalition, which is being launched today in Washington by the U.S. Chamber of Commerce.

More than 200 companies and associations representing an array of economic sectors are backing the USMCA Coalition, which will advocate for congressional approval of the United States-Mexico-Canada Agreement. 

“Building a stronger U.S. electronics industry depends in no small measure on building a stronger North American supply chain,” said IPC President and CEO John Mitchell. “Our association has members with both headquarters and thousands of jobs in the U.S., Mexico and Canada, and thus we have a strong interest in securing enactment of this agreement.

“The USMCA promises to spur even greater integration among the North American economies and strengthen the region’s stature as a formidable global manufacturing base. Improving the manufacturing competitiveness of North America will unlock more growth, innovation and job creation, benefiting people across the continent and the world.

“As always, IPC will continue to advocate for our members’ interests as the debate goes forward.”

IPC Launches Electronics for a Better World | IPC Cares Initiative

Initiative to celebrate electronics industry’s volunteer efforts

With a mission to show the world the altruistic works of companies in the electronics industry, IPC announces the launch of the Electronics for a Better World | IPC Cares initiative. A global effort being scheduled during IPC Founders Week, June 9-15, Electronics for a Better World | IPC Cares will shine a spotlight on the charitable efforts of the electronics industry and will recognize the activities of each participating member company through IPC’s social media platforms.

“There are many generous companies in this industry, and we want to highlight their efforts,” said John Mitchell, IPC president and CEO “We’re asking companies to select the charity of their choice and to support it through staff volunteer efforts during the week of June 9-15. We’re proud of our industry’s efforts to make our communities a better place to work and live.”

“We’re asking supporting companies to take part in a local litter collection; organize a food drive; any event to make a difference, said David Bergman, IPC vice president of standards and technology and program lead. “IPC was founded June 14, 1957 and holding Electronics for a Better World | IPC Cares during IPC Founders Week will show how our industry has a positive impact around the globe — this week of volunteerism is a great way to show the world the good things we do beyond the products we manufacture!”

Supporters who have already pledged to participate are Altex Engineered Electronic Solutions, ASM Assembly Systems, Burkle North America Inc., Chemcut Corporation, Green Circuits Inc., Huawei, ITW EAE, Koh Young Technology, Mycronic Inc., Nordson, and Viscom Inc.

IPC staff has chosen to support Clean the World Foundation, a global health organization whose mission is to improve the quality of life for vulnerable communities around the world by providing sustainable resources for programming, and education focused on water, sanitation, and hygiene for all those affected by poverty, homelessness, and humanitarian or natural crises. 

For more information or to pledge participation, visit the Electronics for a Better World | IPC Cares website at www.ipc.org/ipc-cares.

IPC’s PCB Technology Trends Study Details How PCB Manufacturers Meet Current and Future Technology Demands

PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry.

Based on data from 74 companies worldwide, the 213-page report presents data on PCB technology and OEMs’ PCB requirements as of 2018, as well as OEMs’ use of emerging technologies. Predictions from both industry segments indicate what these measurements are expected to be five years into the future.

The data on OEMs’ use of emerging technologies showed that more than half of those surveyed are currently making products that communicate with the Internet of Things and three quarters make products that depend upon sensor inputs. By 2023, more than half of the reporting OEMs expect at least some of their products to incorporate artificial intelligence and more than one-third expect to make products that interface with humans via neural networks.

Interesting regional differences emerged on the use of blind vias, which are more commonly specified by OEMs in North America and Europe than in Asia. The use of stacked vias by PCB fabricators is also more prevalent in Asia today, but fabricators in all regions expect the use of stacked vias to grow, displacing staggered vias. Asian PCB fabricators are also leading the way in the use of printed electronics, which is expected to grow in all regions by 2023.

Data on board properties cover thickness, layer count, density, line width and spacing, via diameters, aspect ratios, I/O pitch, via design, blind and buried vias, and thermal properties. Use of materials looks at rigid, flexible, stretchable, metal core, loss characteristics and surface finishes. The PCB industry’s use of special structures covers embedded components and chip packages, and its use of printed electronics includes 3D printing and e-textiles. Survey participants’ comments on compliance and technical challenges and trends are included. In addition, the data in the report are segmented by two regions — North America and Europe in one segment, and Asia in another segment — and by two types of products — installed and mobile.

PCB Technology Trends 2018 is available to IPC members for $675 and $1,350 for nonmembers. For more information or to purchase the report, visit IPC’s Online Store.

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