North American PCB Industry Sales Down 11.1 Percent in October

IPC announced today the October 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.09.

Sustainability and Profitability: WHMA Annual Global Leadership Summit Offers Workshop Topics that Impact Wire and Cable Industry

Two career enriching topics of great interest to the wire and cable industry, sustainability and profitability will be covered during WHMA’s Annual Global Leadership Summit, January 28-30, 2025, in Fort Myers, Fla.

Sustainability – A View from the C-Suite

Recently, John Mitchell, IPC’s President and CEO, asked executives Greg Maxwell, Northrop Grumman Corporation, and Tom Edman, TTM Technologies, about how they prioritize sustainability in their companies.

North American PCB Industry Shipments Down 24.1 Percent in September

IPC announced today the September 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.

North American EMS Industry Shipments Up 10.3 Percent in September

IPC announced today the September 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.

Fall 2024 Issue of IPC Community Now Available

There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way.

IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers

A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”

Results are In: Global Insight Readership Survey

IPC's Global Insight editorial team would like to thank the 186 Global Insight readers who took the time to respond to our readership survey.

Taking Steps to Tackle “Circularity” in Electronics Manufacturing

On July 17, IPC and iNEMI (the International Electronics Manufacturing Initiative, a not-for-profit R&D consortium focused on future technology requirements) hosted a webinar to recap a four-hour in-person workshop held in June at the Electronics Goes Green conference in Berlin.