We’re excited to launch Industry Intelligence Insights, your new go-to resource for the latest research, trends, and expert analysis shaping the global electronics manufacturing industry.
On May 16, 2025, IPC hosted a high-level Industry Leaders Luncheon in Taipei, bringing together nearly 60 prominent representatives from government agencies, industry associations, and leading enterprises to explore trends and strategic opportunities shaping the future of electronics manufacturing.
The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is conducting its annual study on behalf of the Department of Defense to understand the issues and hurdles manufacturers face when adopting smart manufacturing technologies.
IPC successfully convened its 2025 Q2 Executive Policy Roundtable on May 21 at Tokyo Kaikan. The event brought together senior government officials, corporate executives, and industry experts to explore strategies for building resilient and future-proof supply chains in an increasingly complex geopolitical and economic landscape.
IPC, with the support of Research Fab Microelectronics Germany (FMD), is organizing the Workshop on Component-to-System Level Packaging – Addressing Integration Challenges for Automotive and Industrial Applications.
One essential skill—especially for those working on printed circuit board (PCB) assembly lines—is the ability to identify a wide range of electronic components accurately and efficiently.
Measuring the effectiveness of training requires a systematic approach to data collection and analysis. Here’s a step-by-step guide to calculating the ROI of your training programs.
Investing in employee training is essential for driving operational efficiency, improving productivity, and ensuring long-term business success. However, when measuring the ROI of training, it’s essential to account for both tangible and intangible benefits.
Learn about the IPC E-Textiles standards committee seeking new comments on a draft of new e-textiles standard.
By John Perry, Director of Printed Board Standards & Technology
It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies.