The Global Electronics Association, is pleased to announce that IPC Builds 2026 is now open for registration. IPC Builds 2026 is a week-long series of standards development meetings to be held in Europe for the second time, following the first Barcelona success in 2024. Over the years, volunteers worldwide have participated in IPC standards development committee meetings to bring the most trusted standards for electronics manufacturing to the industry. In 2026, we’re excited to head to Paris for this traditional and industry-driving event.
NEPCON will be held in a region with a high concentration of automotive industry activity. The Global Electronics Association will co‑exhibit with JapanUnix and promote IPC standards. We are also considering a presentation by a Key Opinion Leader from a global supplier with established relations with the Global Electronics Association.
To deepen industry engagement and expand global impact, the TPCA Show will collaborate with members of the Global Electronics Association (GEA) to promote sponsorship participation and technical outreach activities, including the organization of a Hand Soldering Competition.
Conducted in alignment with IPC international standards, the competition will evaluate participants’ practical skills in soldering quality, process control, and workmanship compliance. Beyond showcasing technical excellence in electronics manufacturing, the event also reinforces industry awareness of quality and standardization while supporting workforce development and skills transfer.
In parallel, the IMPACT Exhibition will focus on advanced packaging technologies, featuring dedicated symposium sessions jointly organized by the Taiwan Standards Committee and the Taiwan Technical Standards Committee.
These sessions will highlight liquid cooling technologies for semiconductor and electronic packaging, covering industry trends, critical materials, reliability validation, and system integration.
Through cross-disciplinary collaboration between standards bodies and industry experts, the initiative aims to build internationally aligned technical consensus and strengthen Taiwan’s competitive position in high-performance computing and next-generation electronic packaging.
California EMS Leadership Roundtable
Connected or Complicated? Digital, Automation, and the Future of Supply Chain Resilience
Compete at electronica 2026
Professional soldering specialists are invited to demonstrate their skills at the 2026 Hand Soldering Competition Regional Qualification Germany, held at the Global Electronics Association booth during electronica in Munich.
Competitors will have 60 minutes to assemble a complex printed circuit board in accordance with IPC-A-610 Class 3 criteria. IPC Master Instructors will evaluate workmanship, process quality, electrical functionality, and completion time.
Compete at electronica 2026
Professional soldering specialists are invited to demonstrate their skills at the 2026 Hand Soldering Competition Regional Qualification Germany, held at the Global Electronics Association booth during electronica in Munich.
Competitors will have 60 minutes to assemble a complex printed circuit board in accordance with IPC-A-610 Class 3 criteria. IPC Master Instructors will evaluate workmanship, process quality, electrical functionality, and completion time.
October 2020 findings from IPC's North American Printed Circuit Board (PCB) Statistical Program.
An exclusive annual event in Korea, aims to promote Korean electronics industry development and global cooperation. The day is full of six seminar topics and the Association’s local Korea activities. The event attracts more than 150 engineers from the industry every year.
Curious about what’s happening in IPC Europe? IPC blog staff took the opportunity to talk to Alison James, senior director, IPC Europe, Government Relations, about the European response to COVID-19, as well as other issues facing the European electronics manufacturing industry.
From System Safety Requirements to Rugged PCB Decisions: A Practical Requirements-to-Evidence Workflow
This virtual event presents a practical workflow for converting mission profiles and hazardous failure effects into measurable requirements, cross-domain allocations, PCB design constraints, embedded diagnostic behaviors, and objective evidence for verification.
This webinar is intended for systems engineers, PCB and electronic hardware designers, embedded software and firmware engineers, reliability and functional safety engineers, verification and test professionals, technical leads, and engineering managers involved in high-reliability electronic products.