Global Electronics Association Knowledge Hub

The importance of signal integrity is emphasized as signal speed increases, and higher frequencies are applied. The PCB manufacturer uses SI coupons that can replace the in-product circuit t .. read more

Driven by rapid changes and markets, the electronics industry has seen massive growth over the past few decades. The short product life cycle has pushed PCB fabrication technology to its lim .. read more

Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme .. read more

The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman .. read more

Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai .. read more

The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer.  Among the pri .. read more

QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc .. read more

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, s .. read more

WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o .. read more

WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o .. read more

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards,wireless charging of mobile electronics,in-pack .. read more

In this study,the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids,such as solder paste and conductive adh .. read more

The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various .. read more

In this era of electronics miniaturization,high yield and low cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip .. read more

The demand to produce smaller electronic devices and products to meet the needs of consumer electronic applications has resulted in thinner ball grid array (BGA) packages with finer pitches. Du .. read more

Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess .. read more

Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Pack .. read more

This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic micro .. read more

Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili .. read more

Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili .. read more

The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important tec .. read more

Leadless semiconductor plastic packages (QFN) is a growing package category in terms of market share and diversity. This is also valid for low pin count semiconductors (e.g.: transistors and di .. read more

The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are .. read more

Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf .. read more

Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf .. read more

E-textiles,also known as electronic textiles,smart textiles,smart clothing,smart garments,or smart fabrics,are fabrics with electronic components and sensors embedded in them. Key components of .. read more

The Augmented Reality and Virtual Reality market is expected to cross $44 billion by the year 2025 according to various industry experts. This exciting new technology is not exactly new,but has .. read more

Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o .. read more

With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri .. read more

This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu .. read more

This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu .. read more

There are numerous techniques to singulate printed circuit boards after assembly including break-out,routing,wheel cutting and now laser cutting. Lasers have several desirable advantages such a .. read more

The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective .. read more

This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used .. read more

Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa .. read more

Silicone thermal interface materials (TIM) are used to bond heatsinks on many critical components in server card assemblies in typical industry systems. Silicone TIMs have excellent high temper .. read more

Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void. .. read more

Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format .. read more

Prior to any conformal or chemically vapor deposited coating process,specific areas and components-often called “keep out zones”-on the printed circuit board (PCB) assembly are generally masked .. read more

Rosin-based no-clean solder pastes are the most widely used solder pastes in the world and dominate consumer electronics assembly. The most common rosin-based no-clean solder paste reflow envir .. read more

Sixteen simple inorganic salts were separately dissolved in water to a specific concentration,applied to separate Surface Insulation Resistance (SIR) coupons,dried and then the coupons were sub .. read more

Misregistration of holes is the maximum amount of variation between the centerlines of all terminal pads within one plated through hole in a printed circuit board. The impacts of misregistratio .. read more

As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be .. read more

This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. Design calculations are presented for a test coupon of .. read more

Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa .. read more

Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material .. read more

Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w .. read more

The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology .. read more

Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo .. read more

The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad .. read more