Global Electronics Association Knowledge Hub

Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple .. read more

In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m .. read more

There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t .. read more

It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even .. read more

To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as .. read more

Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board .. read more

The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for .. read more

-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks. -Deflux: Washing process using water or DIW in combination with other .. read more

Base on our experience,HiP defect comes in various shapes and forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t .. read more

Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor .. read more

This paper reports on further developments for an innovative copper deposition technology that was presented two years ago at this conference. At that time,the innovative technology was describ .. read more

As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu .. read more

Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and r .. read more

Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO .. read more

Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi .. read more

Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation. On the other hand,vapor phase sol .. read more

With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux .. read more

As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services .. read more

Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi .. read more

Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application .. read more

The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures .. read more

This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir .. read more

The CAD library is the starting point that affects every process from PCB layout through PCB manufacturing and assembly. There are dozens of things to consider when creating a CAD library that .. read more

Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper lead-frame structure they do not resemble the more traditional small outl .. read more

Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa .. read more

As consumers the expectation of increased functionality within new products is a given. However there comes a time where this tireless demand for product efficiency starts to stretch the design .. read more

The demand for product miniaturization,especially in the handheld device area,continues to challenge the board assembly industry. The desire to incorporate more functionality while making the p .. read more

Cost reduction in electronic assembly and soldering is a key issue for economic survival in the global market. Very promising ways to reduce failure costs and increase productivity are: reduce .. read more

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode .. read more

It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the .. read more

Circuit housings used in industrial and utility applications have requirements often not needed in the commercial or consumer electronics industries. The device may be used in locations as dive .. read more

In today’s PCB industry,the challenges are no longer just on how to control and improve the manufacturing processes,but also to ensure the fabricated product is compliant to the industry standa .. read more

•iNEMI Environmental Vision •Highlights of Environmental Conscious Electronics Chapter of iNEMI Roadmap •Key iNEMI Projects •Environmental Impact of Electronics –Products –Services •Concluding .. read more

Test and quality coverage for an assembled printed circuit board is becoming increasingly more expensive and complex as digital electronics moves well into the gigahertz era. Traditional tools .. read more

Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has .. read more

For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si .. read more

Several U.S. Government (USG) regulations require parties engaged in import activities to maintain records of transaction processes. By using formal documented tools integrating these regulatio .. read more

Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or .. read more

DNA is a form of forensic evidence trusted by law enforcement and recognized by international courts around the world. This abstract provides an introduction to the utility of botanical DNA tag .. read more

Counterfeiting is a widespread problem that affects every industry and which has the potential to significantly erode a company’s bottom line. According to the International Anti-Counterfeiting .. read more

- COMPONENTS - Risk Mitigation Testing Strategies Examples - Risk Mitigation Testing Affiliations - IDEA – 1010 - AS5553 - Mil-Std-1580 .. read more

Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on .. read more

An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater .. read more

The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring .. read more

This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume .. read more

The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r .. read more

Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st .. read more

Because of the phase out of CFC’s and HCFC’s,standard solder pastes and fluxes evolved from RA and RMA fluxes,to No-Clean,to low residue No-Clean,to very low residue No-Clean. Many companies ca .. read more

Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat .. read more

• 2010 turned out to be an unexpectedly strong year: > 130% growth in both cell production and installations over 2009 • 24GWp cell production • All leading suppliers are expanding production c .. read more