Global Electronics Association Knowledge Hub

The 2002 International Electronics Manufacturing Initiative (iNEMI) Optoelectronics roadmap anticipated a cross-over in cost-performance whereby a system using optical transmission of high spee .. read more

Metal-base printed circuit boards (PCBs),multilayer PCBs and embedded PCBs are constructed with a thin insulation layer. In these PCBs,particularly those used for Power Electronics,the insulati .. read more

The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. Since there are exemptions of which product types are mandated .. read more

In this report,the group activity of developing and proposing standard EMC models for numerical EMC simulation is presented. Our group has developed some basic and standard EMC models which con .. read more

A previously developed ball grid array (BGA) solder joint vibration fatigue life prediction model,which was experimentally validated by Test Vehicle One (TV1) test data for the BGAs with and wi .. read more

We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as a dielectric material,and interconnect technology with Silicon through-hol .. read more

With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor devices are required to cope with finer patterning and higher wiring densi .. read more

A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/h .. read more

It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen at 260°C decreases with the specimen thickness. A temperature gra .. read more

We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of higher density and more sophisticated function of mobile devices and .. read more

It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the development of higher density circuits on build-up printed wiring boards. When .. read more

The world market is changing for the OEM,CEM,and electronic manufacturers. This changing market dictates that as a global industry more focus is placed on reducing the time to market for “New P .. read more

After the world electronic circuit industry finally turned out from the unprecedented recession,the business management of today’s printed circuit industry may possibly have a chance to take a .. read more

This paper describes part of a research effort currently under way in the field of print defect detection. The techniques described have proven to be robust and particularly well suited for det .. read more

The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board (PCB) was done to understand how both patterns correspond to each oth .. read more

Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding technology. However,the requirement for finer pitch PCB is still increasi .. read more

In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural faults within highly complex multi-layer PCB designs that offer extrem .. read more

The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the electrical characterization of printed wiring board (PWB) transmission lines is de .. read more

Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two decades. However,increasing PCB densities continually put pressur .. read more

Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National Nanotechnology Initiative is matched by initiatives in Europe and Asia. B .. read more

Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric constant was above 80 at 1 MHz and the specific capacitance was successfu .. read more

The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic processes for soldermask patterning on substrate packaging and rigid .. read more

As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials becomes critical for design modeling. Understanding these properties and their de .. read more

Information Technology has come a long way from the humble payroll accounting system to integrated suite of business applications,ostensibly to assist corporations to manage their businesses mo .. read more

Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics “food chain.” Double ordering,inventory building and component outag .. read more

New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the supply chain,the PWB fabricator is often the last link that will learn wh .. read more

The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when more and more power and functionality is being offered in ever smaller packa .. read more

Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes that severely stress the mechan .. read more

The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit boards (MLB) comprising approximately 40% of the market. One of the mos .. read more

The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component placement. The embedding of the passive components inside the PCB has already .. read more

We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled and filled materials were characterized in regards to performance,reliabi .. read more

By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers can obtain laser trim results similar to the trimming obtained using a specia .. read more

This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing high-density package substrates and chip on films (COF). 1) High resolution .. read more

Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs. Circuitization of these substrates uses copper pattern plating follow .. read more

In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that results in the production of a printed wiring board. This imaging manufa .. read more

Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that many electronics assemblers will be transitioning their soldering proces .. read more

Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of lead-free electronic products by July 2006 are pushing the industry t .. read more

Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and product power consumption are increasing as the silicon densities and s .. read more

Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit designs that employ coplanar structure,either for both single-end and .. read more

In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous works have showed in detail,the characterization and modeling effort .. read more

A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t .. read more

This paper describes Advanced Filled Via Plating Methodology for stacked via technology. In this paper,via bottom crevice, via bottom land etching and electroless copper plating coverage is foc .. read more

This article summarises how a copper metallization process for simultaneous via filling and through hole plating was developed on a laboratory scale and the challenges encountered by scale-up t .. read more

The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase .. read more

Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for the PWB industry. For example,the ability to locate decoupling capacit .. read more

In this study,we developed the thin film embedded decoupling capacitors and experimentally investigated its electrical behavior in terms of power-ground impedance and simultaneous switching noi .. read more

We have developed a new resin-coated-foil (RCF) material named MCF-HD-45 to be embedded in PWBs to constitute capacitors. The material is composed of a thermosetting resin and a high dielectric .. read more

In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making rapid progresses for even circuit features on printed wiring boards .. read more

For the purpose of mask-less manufacturing for Printed Circuit Board (PCB),a new process using electrophotography technology,principle of copy machines,has been proposed and evaluated. Wiring p .. read more

There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these include the following: ?? Customer requirements to reflow SAC-based (SnAgCu) .. read more