Global Electronics Association Knowledge Hub

Buried Capacitance1 (BC) laminates products have been in use in many high-speed applications for more than ten years. BC products are a significant contributor to complex multi-layer printed ci .. read more

The adoption of three-dimensional System-in-Package (3D-SiP) is progressing rapidly,driven primarily my mobile electronic applications such as mobile phones,PDAs,digital still cameras,and digit .. read more

A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any number of single and multiple functional combinations. The enabling techn .. read more

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Optomec is developing an aerosol-based technology for high-precision,maskless deposition of a wide variety of materials. The system functions by atomizing commercial inks and pastes,and then de .. read more

In the United States,focus turns toward enabling technology for quick-turn printed circuit board and laminate package manufacturing. The current corporate mandate is to develop advanced,enablin .. read more

Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint reliability. In the case of high density assemblies,via-in-pad designs of .. read more

As an EMS provider of high complexity backpanel assemblies,traceability of components with performance issues found at system test,functional test and in the field was limited to the ability to .. read more

For decades,tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of printed circuit board (PCB) in press-fit connections. Therefore,most test r .. read more

Abstract Electroplated tin and tin alloy coatings are used in electronics plating applications as a solderable and corrosion resistant surface finish for components and printed circuit boards ( .. read more

Designing a signal path to provide a particular impedance is thought to be a well understood science. The first issue which is often overlooked is to analytically establish the need for specify .. read more

This paper addresses the growing need in the Printed Wiring Board industry to measure and test propagation delay parameters of board interconnects within the fabrication process. The state of c .. read more

Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As operating frequencies increase beyond one Gigahertz the availability .. read more

The Cray X1™ system dramatically extends the capability of supercomputers with High efficiency and extreme performance. Specifically designed to meet the needs of the high-end user,the Cray X1 .. read more

Two years ago when IBM Endicott,now Endicott Interconnect (EI),was preparing to install a new Acid Copper plating system,the Periodic Reverse Pulse (PRP) tanks installed at the end of the line .. read more

Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of wet manufacturing processes play an important role in the formation of durable i .. read more

JPCA has been developing standards necessary for adoption of optoelectronic technology especially for consumer applications for years. The subjects being drafted are the technology that is fair .. read more

Today’s HDI field of technology is coming under more and more pressure to increase wiring density and,even more importantly,to decrease manufacturing costs. The current technological approach d .. read more

Currently,PWB industry is striving for the cost down at the daily PWB manufacturing,and at the same time,they are developing the higher density PWB for the future application. The emerging 300 .. read more

Although wave soldering has not historically been considered a well-controlled process,its evolution over the past decade makes it a prime candidate for effective control methods. These methods .. read more

A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a function of temperature,time and voltage bias through the solder joint. Th .. read more

Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for so .. read more

To characterize the paste printing process,both the individual aspects of the process and the interactions between the aspects must be understood. The main aspects of the printing process are p .. read more

The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale Packages (CSP). The footprints of these packages are only about half the size .. read more

It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and specifically BGAs. There have been many publications which discuss this phenomena, .. read more

In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive thermal cycling environment. Best parameters for underfilling of BGAs were develop .. read more

A simple and cost effective method has been developed in order to test adhesion of components to a circuit board via a reflow encapsulant. Originally,a mechanical shock test similar to current .. read more

Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable in that it would eliminate the underfill process from the end-users assemb .. read more

A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux residue is designed to provide an interference-free service performance,in addition .. read more

As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead solders,manufacturing companies are asking questions regarding what they need to .. read more

To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit outstanding cleaning performance for a variety of flux residues. The new cleanin .. read more

The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE- 7200) provides the fluid dynamics to build engineered cleaning fluids that exhi .. read more

With the ban of CFC’s,various cleaning processes have emerged and have been established as viable alternatives1,2,3. Several cleaning processes such as ultrasonic and spray in air batch and in- .. read more

The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core competencies that enhance shareholder value. This outsourcing trend i .. read more

The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the increase in outsourcing of manufacturing services. This has resulted in the conseq .. read more

With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New .. read more

The internet explosion of the 90’s created much hype around public exchanges that has never materialized. The current business environment of a multi-company value chain,alliances and partnersh .. read more

In a low-volume,high-mix electronics manufacturing environment,the ability to delineate design concerns before a customer’s product goes to production is paramount. Design deficiencies or devia .. read more

As outsource to EMS,the requirement for Automated Optical Inspection (AOI) equipment changes as well. Due to the diversity of the business,EMS providers require equipment that can handle a myri .. read more

The increasing demand for portable electronic products has accelerated the quest for even greater miniaturization. At the current state of electronic production technology,volume and weight red .. read more

Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip interconnection types including anisotropic conductive film or .. read more

Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time consuming to setup,and relatively expensive. This is because support pins or dedica .. read more

The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products mandate the enhancement of manufacturing systems and assembly yields. In fine pit .. read more

One of the electronic assembly markets that has been emerging in recent years is the automation equipment associated with odd form component placement and final product assembly. As with insert .. read more

Stability and repeatability are imperative in any reflow oven today. If oven operation is not validated periodically,all subsequent profiles and adjustments are not reliable in finding or maint .. read more

Flux management methods for reflow soldering have been debated for years. Current data suggests that multi-stage filtration systems offer many benefits,particularly in dealing with the byproduc .. read more

The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu) .. read more

Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. It is expected that soldering in a nitrogen atmosphere might over .. read more

The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni .. read more

Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a .. read more