Global Electronics Association Knowledge Hub

Chip components are important elements in electronic production since surface mount technology was introduced. Over the years, package size has constantly decreased. The small resistors and .. read more

Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p .. read more

The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even .. read more

High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality .. read more

Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi .. read more

Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem .. read more

Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an .. read more

Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. This trend is mot .. read more

In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o .. read more

The advent of the Industry 4.0 Revolution and Internet of Manufacturing (IoM) has started to yield Smart factories, intelligent machines and networked processes, that have brought us improve .. read more

Electronics assembly can be delivered at competitive market prices only as long as the manufacturing process is continuously improved. Manufacturing companies are mastering with the help of .. read more

With the ascent of Industry 4.0, the urgency of connecting to equipment on a manufacturing line is increasing. This article focuses on the electronics industry and summarizes what that inter .. read more

Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power .. read more

Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat .. read more

The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid .. read more

The migration to large panel substrates in advanced packaging applications is principally motivated by cost considerations. However, it is occurring at a time when package processing is beco .. read more

The electroless deposition of Copper is widely used within the printed circuit board industry as it offers a simple and reliable method for metallizing holes, which subsequently enable multi .. read more

Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di .. read more

A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp .. read more

Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The .. read more

Every year, billions and billions of products are made and sold across the world. Each of these products, regardless of volume, are made in facilities that follow certain steps to assemble, .. read more

Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and .. read more

Machine Learning  Edge Computing Edge AI Demonstrated using a Case Study on HiP (Head in Pillow) defect detection .. read more

New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro .. read more

In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests .. read more

This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p .. read more

Polymer Thick Film(PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. This pap .. read more

Today’s unique assembly challenges are comprised of complex PCB panelization, involving identical PCBs with a goal towards increased production capability, due to a reduced footprint of the .. read more

The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the vo .. read more

The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fa .. read more

The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged .. read more

The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service o .. read more

Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient th .. read more

The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys .. read more

This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics a .. read more

Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. These loadings might affect the fatigue life of solder .. read more

Radio Detection and Ranging (radar) sensors require specialized materials and specific tolerances in order to optimize their function. However, although not new to many markets, such as the .. read more

Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework t .. read more

Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability. Ball Grid Ar .. read more

Whilst many forward-thinking companies invest time, effort and cost into up front work to fix snags which would lead to issues with yield during production, this paper shows the efforts of a .. read more

If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in surface mount technology (SMT) .. read more

With the growth of Surface Mount Technology (SMT) driven by new technological innovations and next generation products, machine feeder density becomes extremely important in electronics manu .. read more

Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of .. read more

Warning required to be provided for exposing person to a listed chemical, unless “person in the course of doing business” can demonstrate it does not pose “significant risk”   •App .. read more

California Clear and reasonable warnings •Overview of new warning regulation  •Retailer warnings accompanying sale  •Warnings website •Listings•Compliance assis .. read more

Intended for use as technical guidance by ADHP (Aerospace, Defense, and High-Performance) electronics system customers to provide the technical structure needed to allow the designer to eval .. read more

J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b .. read more

Findings and recommendations are reported from phase 1 of the Transient AMR(absolute maximum ratings) project, which is sponsored by the EOS/ESD Association and Industry Council on ESD Targe .. read more

High-frequency materials are characterized by several important parameters, including the dielectric constant or relative permittivity (εr) and the dissipation factor (Df). For those paramet .. read more

This paper analyzes the reasons of inaccurate PCB impedance simulation of the traditional simulator and introduces a novel and cost-effective method for accurate PCB impedance simulation of .. read more