Global Electronics Association Knowledge Hub

The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac .. read more

In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but .. read more

Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup .. read more

For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio .. read more

Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H .. read more

The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th .. read more

Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid .. read more

Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC .. read more

This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the Unit .. read more

This slide show discusses the cybersecurity risks associated with network integration.  The supply chain is the most vulnerable, especially sub suppliers.  A particular risk is whe .. read more

Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual .. read more

Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. To demonstrate their vulnerability, a circuit .. read more

This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically he .. read more

High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ .. read more

This slide show discusses Automation of IST testing.  It utilizes Dielectric estimation laminate assessment method (DELAM).  The slides utilizes thermo-graphics to locate the failu .. read more

The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det .. read more

Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke .. read more

The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig .. read more

The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die .. read more

The reliability control in airborne electronics products is essential due to safety and business reasons. As users do not have confidence in raw results provided by previous reliability pred .. read more

Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work .. read more

Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n .. read more

In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. Manufacturing indust .. read more

Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized .. read more

Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a pa .. read more

Data is the New Oil Clive Humby, UK Mathematician and architect of Tesco’s Clubcard is widely credited as the first to coin the phrase in 2006: “Data is the new oil. It’s valuable, .. read more

EMS factories have collected and used machine data for many decades. Over that time, much of the value derived from machine data collection has come from three operational use cases: allowin .. read more

Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. A simple approach for equipment maintenance, .. read more

This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu .. read more

As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. Managing .. read more

The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. The Man .. read more

Why use robotics? Precision -> improved quality Consistency -> improved quality Traceability -> improved quality Dexterity -> to handl .. read more

This paper discusses the automation of inspection using Augmented Reality (AR).   Machine vision is used to find small components since it reduces the amount of time needed for ins .. read more

This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu .. read more

IPC/IMEC/ESA Microvia TV CITC Outline  CITC Coupon and Test Plan Overview  CITC Test Introduction  Temperature Coefficient of Resistance (TCR) Test and Resul .. read more

The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c .. read more

The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P .. read more

Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee .. read more

The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well .. read more

The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a .. read more

Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend .. read more

The corrosion mechanism in the aqueous cleaning process is poorly understood. Much of the prior work is theoretical, based solely on Pourbaix Diagrams. These diagrams are based on the thermo .. read more

Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre .. read more

Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu .. read more

Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With .. read more

A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v .. read more

Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke .. read more

Most dispensable thermosetting products are supplied as blends of monomers or pre-polymers. Curing involves a complicated chemical “dance” with a precise sequence of polymerization of one or .. read more

Light-curable materials can provide significant benefits over conventional technologies, including very fast tack free curing, lower operating costs driven by lower labor needs, space saving .. read more

  Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect .. read more