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Dec 03, 2025
|
News

Reporting from SSbD25: What’s Next for Safe and Sustainable by Design

Diana Radovan, the Global Electronics Associations' director of sustainability policy, shares key insights from the Safe and Sustainable by Design (SSbD25) conference.
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Nov 25, 2025
|
News

Three Top Reads from the Global Electronics Association’s Chief Communications Officer

Carrie Sessine, Chief Communications Officer, shares her Top Reads
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Nov 25, 2025
|
News

Advanced Electronic Packaging – How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia

Malaysia’s semiconductor landscape is shifting toward deeper technology integration and system-level innovation.
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Nov 14, 2025
|
News

Global Electronics Association Submits Updated Position on ECHA PFAS Restrictions

The Association calls for an urgent and proportionate, risk-based approach to the use of functional-critical PFAS in electronics.
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Nov 13, 2025
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News

Why COP30 Matters to the Electronics Industry and How Manufacturers Can Lead

We elaborate on why COP30 matters and how companies are taking steps that demonstrate sustainability efforts aren’t just an obligation, but a path to innovation.
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Nov 12, 2025
|
News

Standards Committee Meetings in Europe Showcase Association’s Global Footprint

News about key outcomes and technical advancements from the recent Global Electronics Association’s European standards development meetings, underscoring global collaboration
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Nov 10, 2025
|
News

Strengthening North America’s Electronics Backbone

When the U.S., Mexico, and Canada operate as a region, we all win: our industries grow, our supply chains become more secure, and our collective resilience deepens.
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Nov 07, 2025
|
News

Global Electronics Association Partners with KTL to Advance Reliability and Standardization in the Electronics Industry

The Global Electronics Association on November 4 signed a Memorandum of Understanding (MOU) with the Korea Testing Laboratory (KTL) to strengthen cooperation in
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Nov 03, 2025
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News

How AI is Reshaping Electronic Packaging to Advance at the Component and System Level

At IMPACT 2025, attendees explored how packaging technologies are evolving to meet the complexities of today’s AI systems and the future.
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