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Dec 03, 2025
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News
Reporting from SSbD25: What’s Next for Safe and Sustainable by Design
Diana Radovan, the Global Electronics Associations' director of sustainability policy, shares key insights from the Safe and Sustainable by Design (SSbD25) conference.
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Nov 25, 2025
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News
Three Top Reads from the Global Electronics Association’s Chief Communications Officer
Carrie Sessine, Chief Communications Officer, shares her Top Reads
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Nov 25, 2025
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News
Advanced Electronic Packaging – How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia
Malaysia’s semiconductor landscape is shifting toward deeper technology integration and system-level innovation.
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Nov 14, 2025
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News
Global Electronics Association Submits Updated Position on ECHA PFAS Restrictions
The Association calls for an urgent and proportionate, risk-based approach to the use of functional-critical PFAS in electronics.
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Nov 13, 2025
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News
Why COP30 Matters to the Electronics Industry and How Manufacturers Can Lead
We elaborate on why COP30 matters and how companies are taking steps that demonstrate sustainability efforts aren’t just an obligation, but a path to innovation.
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Nov 12, 2025
|
News
Standards Committee Meetings in Europe Showcase Association’s Global Footprint
News about key outcomes and technical advancements from the recent Global Electronics Association’s European standards development meetings, underscoring global collaboration
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Nov 10, 2025
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News
Strengthening North America’s Electronics Backbone
When the U.S., Mexico, and Canada operate as a region, we all win: our industries grow, our supply chains become more secure, and our collective resilience deepens.
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Nov 07, 2025
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News
Global Electronics Association Partners with KTL to Advance Reliability and Standardization in the Electronics Industry
The Global Electronics Association on November 4 signed a Memorandum of Understanding (MOU) with the Korea Testing Laboratory (KTL) to strengthen cooperation in
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Nov 03, 2025
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News
How AI is Reshaping Electronic Packaging to Advance at the Component and System Level
At IMPACT 2025, attendees explored how packaging technologies are evolving to meet the complexities of today’s AI systems and the future.
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