Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Impacts and Challenges of AME, from Design to Data
Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated wi
.. weiterlesen
Advances in Multi-level and Multi-materialAdditively Manufactured Electronic (AME) Circuits and Devices
Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as
.. weiterlesen
Conformal Printed Circuit Structures
Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities
.. weiterlesen
Additive Manufacturing and Multiphysics Analysis for Single-Phase and Two-Phase Cooling
Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. Combining multiphysics analysis and additive manufactur
.. weiterlesen
Surface Mounting in Smart Molded Structures Made with Polypropylene
Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics
.. weiterlesen
A Comparative Life Cycle Assessment of Stretchable and Rigid Electronics: A Case Study of Cardiac Monitoring Devices
Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector. Since stretchable electronics use less Printed Circuit Boards (PCBs)
.. weiterlesen
The Journey into The Digital Unknown: How Digital Transformation and Connected Factory Are Changing Our Factory Landscape and Our Lessons...
The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start. Our roles as engineers supporting the factories have historically been
.. weiterlesen
MTC Journey to Digitalisation for Smart Factory Using Legacy Equipment
Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic asse
.. weiterlesen
Improving Productivity with Automated Component Delivery
Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sortin
.. weiterlesen
Empowering Digital Supply Chain Transformation by Utilizing Industry 4.0, Smart Factories, Standards, Smart Contracts and Blockchains
Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a dive
.. weiterlesen
Strategic Sourcing within an Evolving Aerospace & Defense Industry
Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. This presentation will explain the s
.. weiterlesen
Evaluation of Compatibility of EnvironMentally Friendly PCB Manufacturing Processes: Additive Inkjet Coating & Surface Finishes
The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change r
.. weiterlesen
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. weiterlesen
Electroless Palladium Plating – Correlating Plating Solution and Deposit Properties
Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating.
.. weiterlesen
Behind Closed Doors – What You Don’t Know About Your CVD Chamber
Purpose
One of the challenges of larger parylene chemical vapor deposition (CVD) chambers is what seems to be unpredictable material behavior throughout the working volume. The tig
.. weiterlesen
A New Halogen-Free Vapor Phase Coating for High Reliability & Protection of Electronics in Corrosive and Other Harsh Environments
The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. Halogen
.. weiterlesen
Conformal Coatings: State of the Industry Versus State of the Art
The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating
.. weiterlesen
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. weiterlesen
Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card
A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w
.. weiterlesen
Printed Circuit Board Edge Burn Outs – Failure Mechanism
This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electric
.. weiterlesen
Analysis of a Dynamic Flexed Flat Cable Harness
A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the t
.. weiterlesen
ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES
Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. As consumers dem
.. weiterlesen
An Overview of Revision B of GEIA-STD-0005-1
In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP El
.. weiterlesen
A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts
Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. T
.. weiterlesen
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. weiterlesen
FIDES Reliability: New Approach to the ‘Process Factor’ During Product Development
The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. The reliabili
.. weiterlesen
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. weiterlesen
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. weiterlesen
Corrosion Failure Risk Assessment of SMT LEDs to Sulfur Bearing Gas Environments
Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are co
.. weiterlesen
Ammonia Gas Effect on Metal Corrosion of PCB Surface Finish-in Acid-Gases Based Mixed Flowing-Gas Test
The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in rec
.. weiterlesen
Impacts and Challenges of AME, from Design to Data
Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated wi
.. weiterlesen
Advances in Multi-level and Multi-materialAdditively Manufactured Electronic (AME) Circuits and Devices
Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as
.. weiterlesen
Conformal Printed Circuit Structures
Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities
.. weiterlesen
Additive Manufacturing and Multiphysics Analysis for Single-Phase and Two-Phase Cooling
Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. Combining multiphysics analysis and additive manufactur
.. weiterlesen
Surface Mounting in Smart Molded Structures Made with Polypropylene
Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics
.. weiterlesen
A Comparative Life Cycle Assessment of Stretchable and Rigid Electronics: A Case Study of Cardiac Monitoring Devices
Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector. Since stretchable electronics use less Printed Circuit Boards (PCBs)
.. weiterlesen
The Journey into The Digital Unknown: How Digital Transformation and Connected Factory Are Changing Our Factory Landscape and Our Lessons...
The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start. Our roles as engineers supporting the factories have historically been
.. weiterlesen
MTC Journey to Digitalisation for Smart Factory Using Legacy Equipment
Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic asse
.. weiterlesen
Improving Productivity with Automated Component Delivery
Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sortin
.. weiterlesen
Empowering Digital Supply Chain Transformation by Utilizing Industry 4.0, Smart Factories, Standards, Smart Contracts and Blockchains
Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a dive
.. weiterlesen
Strategic Sourcing within an Evolving Aerospace & Defense Industry
Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. This presentation will explain the s
.. weiterlesen
Evaluation of Compatibility of EnvironMentally Friendly PCB Manufacturing Processes: Additive Inkjet Coating & Surface Finishes
The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change r
.. weiterlesen
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. weiterlesen
Electroless Palladium Plating – Correlating Plating Solution and Deposit Properties
Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating.
.. weiterlesen
Behind Closed Doors – What You Don’t Know About Your CVD Chamber
Purpose
One of the challenges of larger parylene chemical vapor deposition (CVD) chambers is what seems to be unpredictable material behavior throughout the working volume. The tig
.. weiterlesen
A New Halogen-Free Vapor Phase Coating for High Reliability & Protection of Electronics in Corrosive and Other Harsh Environments
The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. Halogen
.. weiterlesen
Conformal Coatings: State of the Industry Versus State of the Art
The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating
.. weiterlesen
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. weiterlesen
Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card
A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w
.. weiterlesen
Printed Circuit Board Edge Burn Outs – Failure Mechanism
This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electric
.. weiterlesen
Analysis of a Dynamic Flexed Flat Cable Harness
A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the t
.. weiterlesen
ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES
Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. As consumers dem
.. weiterlesen
An Overview of Revision B of GEIA-STD-0005-1
In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP El
.. weiterlesen
A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts
Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. T
.. weiterlesen
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. weiterlesen
FIDES Reliability: New Approach to the ‘Process Factor’ During Product Development
The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. The reliabili
.. weiterlesen
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. weiterlesen
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. weiterlesen
Corrosion Failure Risk Assessment of SMT LEDs to Sulfur Bearing Gas Environments
Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are co
.. weiterlesen
Ammonia Gas Effect on Metal Corrosion of PCB Surface Finish-in Acid-Gases Based Mixed Flowing-Gas Test
The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in rec
.. weiterlesen