Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. weiterlesen
Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the
.. weiterlesen
Active Alignment Adhesive Technology
The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme
.. weiterlesen
Printed Circuit Structures: Past, Present, and Future
Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. Almost every product available today contains s
.. weiterlesen
Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition
In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This
.. weiterlesen
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. weiterlesen
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. weiterlesen
Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. weiterlesen
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. weiterlesen
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. weiterlesen
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. weiterlesen
Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications
This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi
.. weiterlesen
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. weiterlesen
Application of Dielectric Spectroscopy (Ds) for Quality Control of Solvent-Borne Conformal Coatings
The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). A conformal coating that has experienced mois
.. weiterlesen
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. weiterlesen
A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance
As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented,
.. weiterlesen
Using Machine Learning for Anomaly Pattern Recognition in Manufacturing Processes
As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the
.. weiterlesen
Towards Artificial Intelligence in SMT inspection processes
To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. In SM
.. weiterlesen
AI for Electronics Manufacturing – An Industry 4.0 Architecture and ConditionMonitoring Framework for Printed Circuit Board Assemblies
The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturin
.. weiterlesen
AI Model Benchmarking at the Edge for Quality Inspection in Manufacturing
Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adap
.. weiterlesen
In-Line Implementation of Photonic Soldering
Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiati
.. weiterlesen
IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production
IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while t
.. weiterlesen
A Study of Data Driven Quality Management Across EMS Smart Factory
With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. More and more Electronic
.. weiterlesen
SMT Printer Changeover Automation
The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity an
.. weiterlesen
IPC-CFX Open-Source Hardware Initiative
The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. To realise the benefit
.. weiterlesen
Single Source of Truth (PathWave Manufacturing Analytics)
With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionall
.. weiterlesen
48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis
This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the
.. weiterlesen
Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications
Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ
.. weiterlesen
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. weiterlesen
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. weiterlesen
Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. weiterlesen
Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the
.. weiterlesen
Active Alignment Adhesive Technology
The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme
.. weiterlesen
Printed Circuit Structures: Past, Present, and Future
Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. Almost every product available today contains s
.. weiterlesen
Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition
In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This
.. weiterlesen
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. weiterlesen
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. weiterlesen
Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. weiterlesen
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. weiterlesen
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. weiterlesen
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. weiterlesen
Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications
This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi
.. weiterlesen
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. weiterlesen
Application of Dielectric Spectroscopy (Ds) for Quality Control of Solvent-Borne Conformal Coatings
The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). A conformal coating that has experienced mois
.. weiterlesen
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. weiterlesen
A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance
As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented,
.. weiterlesen
Using Machine Learning for Anomaly Pattern Recognition in Manufacturing Processes
As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the
.. weiterlesen
Towards Artificial Intelligence in SMT inspection processes
To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. In SM
.. weiterlesen
AI for Electronics Manufacturing – An Industry 4.0 Architecture and ConditionMonitoring Framework for Printed Circuit Board Assemblies
The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturin
.. weiterlesen
AI Model Benchmarking at the Edge for Quality Inspection in Manufacturing
Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adap
.. weiterlesen
In-Line Implementation of Photonic Soldering
Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiati
.. weiterlesen
IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production
IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while t
.. weiterlesen
A Study of Data Driven Quality Management Across EMS Smart Factory
With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. More and more Electronic
.. weiterlesen
SMT Printer Changeover Automation
The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity an
.. weiterlesen
IPC-CFX Open-Source Hardware Initiative
The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. To realise the benefit
.. weiterlesen
Single Source of Truth (PathWave Manufacturing Analytics)
With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionall
.. weiterlesen
48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis
This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the
.. weiterlesen
Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications
Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ
.. weiterlesen
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. weiterlesen
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. weiterlesen