Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Critical Evaluation of ROSE Testing as Compared to SIR for Monitoring PCB Cleanliness
Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into t
.. weiterlesen
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. weiterlesen
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. weiterlesen
Influence of Process Parameters on Inkjet Printing of Silver Conductive Traces for Digital Additive Manufacturing of Flexible Electronics
The results of a NextFlex project addressing barriers that are preventing inkjet printing from being adopted for prototyping and volume manufacturing of printed circuits, are presented. Thes
.. weiterlesen
Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding Dynamic Twisting and Battery Lamination
The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. Flexible electronics may be subjected to static and dynamic
.. weiterlesen
Electromechanical Testing of Flexible Hybrid Electronics
Printed conductors and interconnects on compatible flexible or stretchable substrates are the foundation of flexible hybrid electronic systems that may include conventional silicon-based dev
.. weiterlesen
Liquid Metal Enabled Soft and Stretchable Electronics
This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. While gallium is a component of existing electro
.. weiterlesen
A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. weiterlesen
Bio-Based Encapsulation Resins: Good for the Environment, Good for Your Environment
There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds
.. weiterlesen
Massively Parallel Testing of Panelized Printed Circuit Board Assembly (PCBA)
The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart device
.. weiterlesen
Increasing Efficiency of Functional Test Through the Use of Modular Test Components and In-Situ Methods for Cleaning of Test Probes...
Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA)
.. weiterlesen
Cyber Attack Response Business Continuity Plan: Trying to Make the Incident Response for the Factory
Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only fo
.. weiterlesen
IPC APEX Secure Data Exchange Between Design And Manufacturing With IPC-2581 (DPMX) and IPC-2591 (CFX)
For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, e
.. weiterlesen
Cyber Security and Export Compliance in the PCB Supply Chain
What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable! To
.. weiterlesen
PFAS Chemistries and Materials: Their Essential Uses in Semiconductor and Electronic System Manufacturing, Pending Regulatory Restrictions, and an Electronics Industry...
Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream c
.. weiterlesen
Eco-design for a Circular Economy: Best Practices in the Electronics Industry
In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series. The learning series was established as an interactive webinar-b
.. weiterlesen
SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy
Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin
.. weiterlesen
Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications
The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027.
.. weiterlesen
Acid Copper Plating Process for IC Substrate Applications
Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process cos
.. weiterlesen
A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition
For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein
.. weiterlesen
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. weiterlesen
Solder Alloy Contribution to Robust Selective Soldering Process
The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are sti
.. weiterlesen
Reliability of Soler Joints: Will Void Free Vacuum Soldering Help?
Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturer
.. weiterlesen
Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling
Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In
.. weiterlesen
Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps
The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes
.. weiterlesen
Defluxing of Copper Pillar Bumped Flip-Chips
Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving c
.. weiterlesen
Evaluation of Solder Pastes for Flux Residue Mitigation in Cleaning Machines*
Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount tec
.. weiterlesen
Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. weiterlesen
ULTRA HDI Printed Boards
This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu
.. weiterlesen
ULTRA HDI/SLP Production
This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit
.. weiterlesen
A Critical Evaluation of ROSE Testing as Compared to SIR for Monitoring PCB Cleanliness
Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into t
.. weiterlesen
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. weiterlesen
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. weiterlesen
Influence of Process Parameters on Inkjet Printing of Silver Conductive Traces for Digital Additive Manufacturing of Flexible Electronics
The results of a NextFlex project addressing barriers that are preventing inkjet printing from being adopted for prototyping and volume manufacturing of printed circuits, are presented. Thes
.. weiterlesen
Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding Dynamic Twisting and Battery Lamination
The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. Flexible electronics may be subjected to static and dynamic
.. weiterlesen
Electromechanical Testing of Flexible Hybrid Electronics
Printed conductors and interconnects on compatible flexible or stretchable substrates are the foundation of flexible hybrid electronic systems that may include conventional silicon-based dev
.. weiterlesen
Liquid Metal Enabled Soft and Stretchable Electronics
This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. While gallium is a component of existing electro
.. weiterlesen
A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. weiterlesen
Bio-Based Encapsulation Resins: Good for the Environment, Good for Your Environment
There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds
.. weiterlesen
Massively Parallel Testing of Panelized Printed Circuit Board Assembly (PCBA)
The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart device
.. weiterlesen
Increasing Efficiency of Functional Test Through the Use of Modular Test Components and In-Situ Methods for Cleaning of Test Probes...
Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA)
.. weiterlesen
Cyber Attack Response Business Continuity Plan: Trying to Make the Incident Response for the Factory
Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only fo
.. weiterlesen
IPC APEX Secure Data Exchange Between Design And Manufacturing With IPC-2581 (DPMX) and IPC-2591 (CFX)
For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, e
.. weiterlesen
Cyber Security and Export Compliance in the PCB Supply Chain
What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable! To
.. weiterlesen
PFAS Chemistries and Materials: Their Essential Uses in Semiconductor and Electronic System Manufacturing, Pending Regulatory Restrictions, and an Electronics Industry...
Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream c
.. weiterlesen
Eco-design for a Circular Economy: Best Practices in the Electronics Industry
In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series. The learning series was established as an interactive webinar-b
.. weiterlesen
SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy
Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin
.. weiterlesen
Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications
The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027.
.. weiterlesen
Acid Copper Plating Process for IC Substrate Applications
Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process cos
.. weiterlesen
A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition
For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein
.. weiterlesen
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. weiterlesen
Solder Alloy Contribution to Robust Selective Soldering Process
The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are sti
.. weiterlesen
Reliability of Soler Joints: Will Void Free Vacuum Soldering Help?
Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturer
.. weiterlesen
Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling
Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In
.. weiterlesen
Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps
The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes
.. weiterlesen
Defluxing of Copper Pillar Bumped Flip-Chips
Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving c
.. weiterlesen
Evaluation of Solder Pastes for Flux Residue Mitigation in Cleaning Machines*
Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount tec
.. weiterlesen
Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. weiterlesen
ULTRA HDI Printed Boards
This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu
.. weiterlesen
ULTRA HDI/SLP Production
This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit
.. weiterlesen