Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. weiterlesen
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. weiterlesen
Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when
.. weiterlesen
Development and Classification of Conductive Circuitry for E-textiles
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi
.. weiterlesen
Bladder Inflation Method for Mechanical Testing of Stretchable Electronics and Wearable Devices
The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. The
.. weiterlesen
Additive Manufacturing for Next Generation Microwave Electronics and Antennas
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkj
.. weiterlesen
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo
.. weiterlesen
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi
.. weiterlesen
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. weiterlesen
Approaching FCT with Low-Cost Modular and Fully Integrated Test Fixtures
Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process. Automated
.. weiterlesen
The Next RF Probing Challenge: IoT and 5G
IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I
.. weiterlesen
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. weiterlesen
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. weiterlesen
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. weiterlesen
Smart Molded Structures Bring Surfaces to Life
This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia
.. weiterlesen
Development of Flexible Hybrid Electronics
Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-preci
.. weiterlesen
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics for Brain-Machine Interfaces
Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from incon
.. weiterlesen
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. weiterlesen
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper
.. weiterlesen
PCB Manufacturing for Electronics Megatrends
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be
.. weiterlesen
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. weiterlesen
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. weiterlesen
High Temperature Thermal Cycling Reliability Testing of a High Reliability Lead-free Solder Alloy
In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working envir
.. weiterlesen
Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see
.. weiterlesen
Qualification Protocols for A Sustainable and Innovative Release Aid Within the PCB & CCL Laminating Press Process.
PCB (Printed Circuit Board) and CCL (Copper Clad Laminates) industries are facing environmental issues and cost reduction challenges. Consumable release sheets are an important aid for many
.. weiterlesen
Manufacturing of Low-Cost Wearable Vital Sign Monitoring Devices
Wireless wearable devices can continuously assess and communicate the condition of patients and are crucial components of digital mobile health platforms. General societal trends across the
.. weiterlesen
Design, Fabrication and Testing of an RFID Tag with Security Features for Authentication and Tamper Resistance
To demonstrate the benefits of flexible hybrid technology (FHE) and printed electronics the team of Lockheed Martin Rotary Missions Systems Owego (LMO), Lockheed Martin Space Systems Billeri
.. weiterlesen
Designing and Manufacturing Flexible Hybrid Electronic Wearable Chemical Sensors
Real-time and in-situ monitoring of the air-quality of confined spaces is a life-saving technology for commercial and government maintenance workers and is conspicuously absent from the comm
.. weiterlesen
CFX Performance Mapping – Methods to Qualify, Validate and Control Acceptable Levels of Flux and Other Residues
The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. The concept of the Digital Twin is to
.. weiterlesen
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. weiterlesen
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. weiterlesen
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. weiterlesen
Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when
.. weiterlesen
Development and Classification of Conductive Circuitry for E-textiles
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi
.. weiterlesen
Bladder Inflation Method for Mechanical Testing of Stretchable Electronics and Wearable Devices
The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. The
.. weiterlesen
Additive Manufacturing for Next Generation Microwave Electronics and Antennas
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkj
.. weiterlesen
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo
.. weiterlesen
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi
.. weiterlesen
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. weiterlesen
Approaching FCT with Low-Cost Modular and Fully Integrated Test Fixtures
Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process. Automated
.. weiterlesen
The Next RF Probing Challenge: IoT and 5G
IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I
.. weiterlesen
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. weiterlesen
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. weiterlesen
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. weiterlesen
Smart Molded Structures Bring Surfaces to Life
This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia
.. weiterlesen
Development of Flexible Hybrid Electronics
Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-preci
.. weiterlesen
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics for Brain-Machine Interfaces
Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from incon
.. weiterlesen
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. weiterlesen
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper
.. weiterlesen
PCB Manufacturing for Electronics Megatrends
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be
.. weiterlesen
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. weiterlesen
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. weiterlesen
High Temperature Thermal Cycling Reliability Testing of a High Reliability Lead-free Solder Alloy
In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working envir
.. weiterlesen
Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see
.. weiterlesen
Qualification Protocols for A Sustainable and Innovative Release Aid Within the PCB & CCL Laminating Press Process.
PCB (Printed Circuit Board) and CCL (Copper Clad Laminates) industries are facing environmental issues and cost reduction challenges. Consumable release sheets are an important aid for many
.. weiterlesen
Manufacturing of Low-Cost Wearable Vital Sign Monitoring Devices
Wireless wearable devices can continuously assess and communicate the condition of patients and are crucial components of digital mobile health platforms. General societal trends across the
.. weiterlesen
Design, Fabrication and Testing of an RFID Tag with Security Features for Authentication and Tamper Resistance
To demonstrate the benefits of flexible hybrid technology (FHE) and printed electronics the team of Lockheed Martin Rotary Missions Systems Owego (LMO), Lockheed Martin Space Systems Billeri
.. weiterlesen
Designing and Manufacturing Flexible Hybrid Electronic Wearable Chemical Sensors
Real-time and in-situ monitoring of the air-quality of confined spaces is a life-saving technology for commercial and government maintenance workers and is conspicuously absent from the comm
.. weiterlesen
CFX Performance Mapping – Methods to Qualify, Validate and Control Acceptable Levels of Flux and Other Residues
The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. The concept of the Digital Twin is to
.. weiterlesen
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. weiterlesen