Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low Temperature SMT Process Implementation
Low Temperature Conversion
•Substantial cost savings over regular processes
•Savings can outweigh paste cost differences
•Can be mechanically stronger if done right
•Involves more than just cha
.. weiterlesen
Jet Printing of Low Temperature Solder Paste
•Jet printing introduction
•Industry challenges
•Jet printing low temperature paste
–Collaboration Alpha-MYDATA
–Rheology
–Results
•Low temperature paste offers a production solution for advanc
.. weiterlesen
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. weiterlesen
Automating the Rework Process: Technology Advancement Replaces Manual Method
Automated Optical Rework (AOR) is a new method of reworking shorts by using a fully automated fine laser beam to ablate
any excess copper in fine-line PCB patterns. This includes shorts,protrus
.. weiterlesen
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. weiterlesen
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. weiterlesen
Improving Product Reliability through HALT and HASS Testing of Electronics and PCB’s
HALT & HASS technology uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages (often at board level),improving product reliability and c
.. weiterlesen
Mechanical Reliability – A New Method to Forecast Drop Shock Performance
In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi
.. weiterlesen
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. weiterlesen
Material Selection and Parameter Optimization for Reliable TMV Pop Assembly
The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga
.. weiterlesen
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. weiterlesen
JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste
1.Obtain suggestions from the solder manufactures
Low-Ag SAC Paste
•Increase in reflow temp
•Impact on thermal fatigue and wetting
Sn-Bi low-temp Paste
•Impact on shock strength
•Creep fatigue
.. weiterlesen
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. weiterlesen
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. weiterlesen
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. weiterlesen
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
.. weiterlesen
Liquid Flux Selection and Process Optimization for Selective Soldering Applications
There has been a rapid increase in the use of selective soldering equipment for PCB assembly
–Lower equipment costs
–Smaller equipment footprint
–Lower solder “inventory” cost (smaller pots)
–D
.. weiterlesen
Halogen Free Solder Paste
•What is a halogen?
•Impact on the environment
•Halides and halogens
•Halides in electronics
•Halogens in electronics
•Definition of halogen free
•Technical challenges to remove halogen
•Curren
.. weiterlesen
Lead-free Nanosolders and Nanowire Joining for Microelectronics/Nanoelectronics Assembly and Packaging
- Nanosolder on multi-segment nanowires have been successfully fabricated by electrodeposition method;
- Flux assisted environment enhanced reflow result and micron scale solder spheroids forme
.. weiterlesen
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. weiterlesen
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. weiterlesen
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. weiterlesen
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. weiterlesen
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. weiterlesen
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. weiterlesen
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. weiterlesen
Embedded Passive Technology
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology ha
.. weiterlesen
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. weiterlesen
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. weiterlesen
Low Temperature SMT Process Implementation
Low Temperature Conversion
•Substantial cost savings over regular processes
•Savings can outweigh paste cost differences
•Can be mechanically stronger if done right
•Involves more than just cha
.. weiterlesen
Jet Printing of Low Temperature Solder Paste
•Jet printing introduction
•Industry challenges
•Jet printing low temperature paste
–Collaboration Alpha-MYDATA
–Rheology
–Results
•Low temperature paste offers a production solution for advanc
.. weiterlesen
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. weiterlesen
Automating the Rework Process: Technology Advancement Replaces Manual Method
Automated Optical Rework (AOR) is a new method of reworking shorts by using a fully automated fine laser beam to ablate
any excess copper in fine-line PCB patterns. This includes shorts,protrus
.. weiterlesen
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. weiterlesen
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. weiterlesen
Improving Product Reliability through HALT and HASS Testing of Electronics and PCB’s
HALT & HASS technology uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages (often at board level),improving product reliability and c
.. weiterlesen
Mechanical Reliability – A New Method to Forecast Drop Shock Performance
In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi
.. weiterlesen
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. weiterlesen
Material Selection and Parameter Optimization for Reliable TMV Pop Assembly
The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga
.. weiterlesen
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. weiterlesen
JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste
1.Obtain suggestions from the solder manufactures
Low-Ag SAC Paste
•Increase in reflow temp
•Impact on thermal fatigue and wetting
Sn-Bi low-temp Paste
•Impact on shock strength
•Creep fatigue
.. weiterlesen
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. weiterlesen
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. weiterlesen
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. weiterlesen
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
.. weiterlesen
Liquid Flux Selection and Process Optimization for Selective Soldering Applications
There has been a rapid increase in the use of selective soldering equipment for PCB assembly
–Lower equipment costs
–Smaller equipment footprint
–Lower solder “inventory” cost (smaller pots)
–D
.. weiterlesen
Halogen Free Solder Paste
•What is a halogen?
•Impact on the environment
•Halides and halogens
•Halides in electronics
•Halogens in electronics
•Definition of halogen free
•Technical challenges to remove halogen
•Curren
.. weiterlesen
Lead-free Nanosolders and Nanowire Joining for Microelectronics/Nanoelectronics Assembly and Packaging
- Nanosolder on multi-segment nanowires have been successfully fabricated by electrodeposition method;
- Flux assisted environment enhanced reflow result and micron scale solder spheroids forme
.. weiterlesen
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. weiterlesen
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. weiterlesen
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. weiterlesen
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. weiterlesen
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. weiterlesen
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. weiterlesen
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. weiterlesen
Embedded Passive Technology
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology ha
.. weiterlesen
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. weiterlesen
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. weiterlesen