Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. weiterlesen
Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals.
.. weiterlesen
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. weiterlesen
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. weiterlesen
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. weiterlesen
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. weiterlesen
AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. weiterlesen
Color Logical Analysis Approach for LED Testing in Manufacturing
Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha
.. weiterlesen
Reduce Design Time and Product Lifecycle Costs with Functional Blocks Common to Designs and Test Fixtures
This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. Benefits of this s
.. weiterlesen
SJIT,Solder Joint Integrity Test,To Find Latent Defects in Printed Wiring Board
To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far.
Capacitance method and IEEE 1149.1 or boundary scan method are often used t
.. weiterlesen
The use of an available Color Sensor for Burn-In of LED Products
In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know
.. weiterlesen
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. weiterlesen
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. weiterlesen
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. weiterlesen
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. weiterlesen
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. weiterlesen
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. weiterlesen
Cleaning Of Assembled PCBs A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field
Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c
.. weiterlesen
High Reliability and Low Variability Results with Benchtop PCB Cleaning
The purpose of this study is to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked boards. Different variables that play a role in the effectiveness
.. weiterlesen
In Situ Recycling of Cleaning and Rinsing Fluids to Meet Lean & Green Cleaning Process Targets
Recycling cleaning and rinsing fluids in the manufacturing process is becoming very popular for many reasons. Competitiveness is the key issue as the electronics industry ages. In our golden ye
.. weiterlesen
Predicting the Lifetime of the PCB - From Experiment to Simulation
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless,the mechanical
.. weiterlesen
Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a
.. weiterlesen
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. weiterlesen
Taking the LED Pick and Place Challenge
For the past few years there has been a shift in the Lighting Industry that has carried over to the surface mount technology assembly line. What is this shift you may ask? Well it is the LED re
.. weiterlesen
MICROSYSTEMS ENABLED PV
Microsystems Enabled PV:
•Technology benefits
•Process flow/assembly examples
•Cost analysis
•From R&D to commercialization
•3DIC/hybrid assembly and new functionality
.. weiterlesen
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. weiterlesen
PCB Surface Finishes for Low Temperature Solder Processing
Low temp solders are a viable solution and their
performance can be enhance thought final finish
selection.
Initial data suggest that an organic metal final finish
in combination with a low tem
.. weiterlesen
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. weiterlesen
Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals.
.. weiterlesen
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. weiterlesen
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. weiterlesen
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. weiterlesen
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. weiterlesen
AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. weiterlesen
Color Logical Analysis Approach for LED Testing in Manufacturing
Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha
.. weiterlesen
Reduce Design Time and Product Lifecycle Costs with Functional Blocks Common to Designs and Test Fixtures
This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. Benefits of this s
.. weiterlesen
SJIT,Solder Joint Integrity Test,To Find Latent Defects in Printed Wiring Board
To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far.
Capacitance method and IEEE 1149.1 or boundary scan method are often used t
.. weiterlesen
The use of an available Color Sensor for Burn-In of LED Products
In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know
.. weiterlesen
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. weiterlesen
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. weiterlesen
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. weiterlesen
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. weiterlesen
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. weiterlesen
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. weiterlesen
Cleaning Of Assembled PCBs A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field
Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c
.. weiterlesen
High Reliability and Low Variability Results with Benchtop PCB Cleaning
The purpose of this study is to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked boards. Different variables that play a role in the effectiveness
.. weiterlesen
In Situ Recycling of Cleaning and Rinsing Fluids to Meet Lean & Green Cleaning Process Targets
Recycling cleaning and rinsing fluids in the manufacturing process is becoming very popular for many reasons. Competitiveness is the key issue as the electronics industry ages. In our golden ye
.. weiterlesen
Predicting the Lifetime of the PCB - From Experiment to Simulation
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless,the mechanical
.. weiterlesen
Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a
.. weiterlesen
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. weiterlesen
Taking the LED Pick and Place Challenge
For the past few years there has been a shift in the Lighting Industry that has carried over to the surface mount technology assembly line. What is this shift you may ask? Well it is the LED re
.. weiterlesen
MICROSYSTEMS ENABLED PV
Microsystems Enabled PV:
•Technology benefits
•Process flow/assembly examples
•Cost analysis
•From R&D to commercialization
•3DIC/hybrid assembly and new functionality
.. weiterlesen
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. weiterlesen
PCB Surface Finishes for Low Temperature Solder Processing
Low temp solders are a viable solution and their
performance can be enhance thought final finish
selection.
Initial data suggest that an organic metal final finish
in combination with a low tem
.. weiterlesen