Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Challenge: Sourcing ELIC Substrates in the U.S.
Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi
.. weiterlesen
Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. weiterlesen
Selectively Assembling High Value Components Based on Warpage in Order to Improve Reliability
Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u
.. weiterlesen
Real-time X-ray Video Imaging of Pb-Free Solders Under Simulated SMT Reflow
Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical s
.. weiterlesen
Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. weiterlesen
Security, Data Archiving and CI/CD for Quality Inspection in Manufacturing Using Edge Computing
In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has succe
.. weiterlesen
An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. weiterlesen
High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. weiterlesen
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. weiterlesen
A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and
.. weiterlesen
Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. weiterlesen
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. weiterlesen
Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. weiterlesen
Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)
The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges
.. weiterlesen
Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. weiterlesen
Development of Low Loss Adhesive Film for Multilayer PTFE Substrate
Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising
.. weiterlesen
Hybrid Adhesion Enhancement Systems and its Quality Control for Low Loss PCB Inner Layer Bonding
The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment indu
.. weiterlesen
A Microvia Damage Model
An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy
.. weiterlesen
High Resolution Physical Analyses of Microvia - Target Pad Interfaces
Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal
.. weiterlesen
Soft and Pliable Circuit Boards Made with a Novel Thermoset Polymer
The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p
.. weiterlesen
Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs
Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with C
.. weiterlesen
Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling
The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s
.. weiterlesen
Moving Towards Failure-free and Higher Efficient PCB Depaneling Methods with Laser Technology
Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin
.. weiterlesen
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. weiterlesen
Solvent Free Copper Extraction
Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To
.. weiterlesen
Enabling KCN-Free Stabilization for Mixed Reaction Gold Electrolytes
In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold
.. weiterlesen
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. weiterlesen
Advanced Processes for Improving Performance of Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) combines additive and subtractive manufacturing methods to fully fabricate Printed Circuit Structures (PCS). Harnessing the flexibility of additive methods
.. weiterlesen
TCT and Cross Section Analysis of Combined Alloy and Flux Approach Towards Cost-Effective, High Reliable Solder Joints for Automotive Applications
High reliable lead-free alloys are suitable for high operating temperatures and longer temperature-cycling time. The Innolot alloy,for example, is based on the tin-silver-copper (SAC) metall
.. weiterlesen
Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications
When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re
.. weiterlesen
Challenge: Sourcing ELIC Substrates in the U.S.
Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi
.. weiterlesen
Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. weiterlesen
Selectively Assembling High Value Components Based on Warpage in Order to Improve Reliability
Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u
.. weiterlesen
Real-time X-ray Video Imaging of Pb-Free Solders Under Simulated SMT Reflow
Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical s
.. weiterlesen
Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. weiterlesen
Security, Data Archiving and CI/CD for Quality Inspection in Manufacturing Using Edge Computing
In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has succe
.. weiterlesen
An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. weiterlesen
High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. weiterlesen
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. weiterlesen
A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and
.. weiterlesen
Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. weiterlesen
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. weiterlesen
Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. weiterlesen
Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)
The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges
.. weiterlesen
Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. weiterlesen
Development of Low Loss Adhesive Film for Multilayer PTFE Substrate
Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising
.. weiterlesen
Hybrid Adhesion Enhancement Systems and its Quality Control for Low Loss PCB Inner Layer Bonding
The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment indu
.. weiterlesen
A Microvia Damage Model
An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy
.. weiterlesen
High Resolution Physical Analyses of Microvia - Target Pad Interfaces
Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal
.. weiterlesen
Soft and Pliable Circuit Boards Made with a Novel Thermoset Polymer
The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p
.. weiterlesen
Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs
Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with C
.. weiterlesen
Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling
The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s
.. weiterlesen
Moving Towards Failure-free and Higher Efficient PCB Depaneling Methods with Laser Technology
Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin
.. weiterlesen
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. weiterlesen
Solvent Free Copper Extraction
Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To
.. weiterlesen
Enabling KCN-Free Stabilization for Mixed Reaction Gold Electrolytes
In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold
.. weiterlesen
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. weiterlesen
Advanced Processes for Improving Performance of Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) combines additive and subtractive manufacturing methods to fully fabricate Printed Circuit Structures (PCS). Harnessing the flexibility of additive methods
.. weiterlesen
TCT and Cross Section Analysis of Combined Alloy and Flux Approach Towards Cost-Effective, High Reliable Solder Joints for Automotive Applications
High reliable lead-free alloys are suitable for high operating temperatures and longer temperature-cycling time. The Innolot alloy,for example, is based on the tin-silver-copper (SAC) metall
.. weiterlesen
Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications
When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re
.. weiterlesen