Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
The growing complexity of electronic assemblies increases the cleaning challenge due to miniaturization,lower component gaps,and improved flux designs. The need to remove ionizable contaminants
.. weiterlesen
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. weiterlesen
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. weiterlesen
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. weiterlesen
A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources
An overview of previous work regarding light enegine development is provided,proceeded by an in-depth overview of new technology available for solder mask imaging.
.. weiterlesen
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. weiterlesen
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. weiterlesen
Selecting Cleaning Processes for Electronics Defluxing: Total Cost of Ownership
Electronics manufacturing process engineers are faced with significant challenges when selecting a cleaning system as a
consequence of the wide ranges of cleaning processes and equipment. Curre
.. weiterlesen
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. weiterlesen
The Use of Inkjet Printing Technology for Fabricating Electronic Circuits – The Promise and the Practical
Manufacturers of electronic devices are always searching for new technologies that can improve processes,extend capabilities and lower costs. These drivers,along with the needs of new markets l
.. weiterlesen
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. weiterlesen
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. weiterlesen
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. weiterlesen
The Universal PCB Design Grid System
Mixing PCB Design Layout units will compromise perfection every time. PCB Design perfection starts with building CAD
library parts and quickly moves to part placement,via fanout and trace routi
.. weiterlesen
A Strategy for Via Connections in Embedded Sheet Capacitance Designs
Predicting the electrical performance of embedded capacitor PCB designs has been a major stumbling block for the technology. In particular,one of the key questions has been how quickly can char
.. weiterlesen
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. weiterlesen
Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. weiterlesen
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. weiterlesen
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. weiterlesen
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. weiterlesen
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. weiterlesen
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. weiterlesen
Cleanliness of Stencils and Cleaned Misprinted Circuit Boards
The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see
.. weiterlesen
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. weiterlesen
Advances in Automatic Monitoring of Stencil Printing Processes
The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign
.. weiterlesen
Zoom Fixtures for ATE
This paper details a break-through technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs of - "faster,cheaper,and smaller". The new fixture
.. weiterlesen
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. weiterlesen
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. weiterlesen
Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand Reworked Fine Pitch...
Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by
passing them together across the flowing surface of a molten solder reservo
.. weiterlesen
Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
The growing complexity of electronic assemblies increases the cleaning challenge due to miniaturization,lower component gaps,and improved flux designs. The need to remove ionizable contaminants
.. weiterlesen
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. weiterlesen
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. weiterlesen
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. weiterlesen
A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources
An overview of previous work regarding light enegine development is provided,proceeded by an in-depth overview of new technology available for solder mask imaging.
.. weiterlesen
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. weiterlesen
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. weiterlesen
Selecting Cleaning Processes for Electronics Defluxing: Total Cost of Ownership
Electronics manufacturing process engineers are faced with significant challenges when selecting a cleaning system as a
consequence of the wide ranges of cleaning processes and equipment. Curre
.. weiterlesen
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. weiterlesen
The Use of Inkjet Printing Technology for Fabricating Electronic Circuits – The Promise and the Practical
Manufacturers of electronic devices are always searching for new technologies that can improve processes,extend capabilities and lower costs. These drivers,along with the needs of new markets l
.. weiterlesen
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. weiterlesen
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. weiterlesen
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. weiterlesen
The Universal PCB Design Grid System
Mixing PCB Design Layout units will compromise perfection every time. PCB Design perfection starts with building CAD
library parts and quickly moves to part placement,via fanout and trace routi
.. weiterlesen
A Strategy for Via Connections in Embedded Sheet Capacitance Designs
Predicting the electrical performance of embedded capacitor PCB designs has been a major stumbling block for the technology. In particular,one of the key questions has been how quickly can char
.. weiterlesen
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. weiterlesen
Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. weiterlesen
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. weiterlesen
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. weiterlesen
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. weiterlesen
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. weiterlesen
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. weiterlesen
Cleanliness of Stencils and Cleaned Misprinted Circuit Boards
The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see
.. weiterlesen
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. weiterlesen
Advances in Automatic Monitoring of Stencil Printing Processes
The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign
.. weiterlesen
Zoom Fixtures for ATE
This paper details a break-through technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs of - "faster,cheaper,and smaller". The new fixture
.. weiterlesen
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. weiterlesen
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. weiterlesen
Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand Reworked Fine Pitch...
Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by
passing them together across the flowing surface of a molten solder reservo
.. weiterlesen