Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Counterfeit Electronics:Strategies for Fighting Counterfeit Electronics
•Background information
•Scope of the problem
–Anecdotal
–Study by International Chamber of Commerce
–Recent study US Dept of Commerce
•What to do about it ?
–“Findings” and “Best Practices”
•T
.. weiterlesen
Real or Fake? The Counterfeit Chip Conundrum
Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th
.. weiterlesen
Conformal Coatings for Tin Whisker Risk Management
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. weiterlesen
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. weiterlesen
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. weiterlesen
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. weiterlesen
A Flexible Fixturing System for In-Circuit Test of High Node Count Circuit Boards
Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition
.. weiterlesen
Effective Transition of Electronics Production between Manufacturing Sites
“Unprecedented” is a word often used to describe the events caused by the economic downturn and its impact on the
automotive electronics industry. The result has been numerous plant closings an
.. weiterlesen
Migrating from Paper to Interactive Paperless Work Instructions
One of the effects of the ever increasing mountain of regulatory requirements and the globalization of markets is the need to
disseminate and collect information across the shop floor and the e
.. weiterlesen
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. weiterlesen
Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free
technologies,generating much concern. A head-in-pillow defect is the in
.. weiterlesen
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. weiterlesen
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. weiterlesen
Assessment of Moisture Content Measurement Methods for Printed Circuit Boards
Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met
.. weiterlesen
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. weiterlesen
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. weiterlesen
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. weiterlesen
Photochemical Machining (PCM) for Cost-effective,Rapid Production
Photochemical machining (PCM) is an excellent method for manufacturing both simple and complex parts in a wide range of
engineering materials. In the harsh economic climate facing manufacturing
.. weiterlesen
Examples of Parts Made by Photochemical Machining
Examples of various parts machined by PCM processes are featured.
.. weiterlesen
Precision Parts Made by Photochemical Machining
Examples of various types of parts machined through PCM processes are described.
.. weiterlesen
Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)
- 3D Manufacturing solutions: Flexible integration
- 3D/SiP Cost of Ownership
- Die vs. Package Stack Analysis
- Smartphone
- Package evolution
- Handheld Processor Roadmap
- PoP
- TMV
- Future
.. weiterlesen
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include
.. weiterlesen
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. weiterlesen
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. weiterlesen
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. weiterlesen
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. weiterlesen
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. weiterlesen
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. weiterlesen
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. weiterlesen
Design To Manufacturing Standards
• The Information Process
• Knowing the jargon (terms & definitions)
• Defining the requirements
• Expansion of Documentation standards
• Document Grade and Completeness
• Relationship of CAD/C
.. weiterlesen
Counterfeit Electronics:Strategies for Fighting Counterfeit Electronics
•Background information
•Scope of the problem
–Anecdotal
–Study by International Chamber of Commerce
–Recent study US Dept of Commerce
•What to do about it ?
–“Findings” and “Best Practices”
•T
.. weiterlesen
Real or Fake? The Counterfeit Chip Conundrum
Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th
.. weiterlesen
Conformal Coatings for Tin Whisker Risk Management
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. weiterlesen
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. weiterlesen
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. weiterlesen
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. weiterlesen
A Flexible Fixturing System for In-Circuit Test of High Node Count Circuit Boards
Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition
.. weiterlesen
Effective Transition of Electronics Production between Manufacturing Sites
“Unprecedented” is a word often used to describe the events caused by the economic downturn and its impact on the
automotive electronics industry. The result has been numerous plant closings an
.. weiterlesen
Migrating from Paper to Interactive Paperless Work Instructions
One of the effects of the ever increasing mountain of regulatory requirements and the globalization of markets is the need to
disseminate and collect information across the shop floor and the e
.. weiterlesen
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. weiterlesen
Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free
technologies,generating much concern. A head-in-pillow defect is the in
.. weiterlesen
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. weiterlesen
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. weiterlesen
Assessment of Moisture Content Measurement Methods for Printed Circuit Boards
Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met
.. weiterlesen
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. weiterlesen
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. weiterlesen
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. weiterlesen
Photochemical Machining (PCM) for Cost-effective,Rapid Production
Photochemical machining (PCM) is an excellent method for manufacturing both simple and complex parts in a wide range of
engineering materials. In the harsh economic climate facing manufacturing
.. weiterlesen
Examples of Parts Made by Photochemical Machining
Examples of various parts machined by PCM processes are featured.
.. weiterlesen
Precision Parts Made by Photochemical Machining
Examples of various types of parts machined through PCM processes are described.
.. weiterlesen
Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)
- 3D Manufacturing solutions: Flexible integration
- 3D/SiP Cost of Ownership
- Die vs. Package Stack Analysis
- Smartphone
- Package evolution
- Handheld Processor Roadmap
- PoP
- TMV
- Future
.. weiterlesen
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include
.. weiterlesen
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. weiterlesen
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. weiterlesen
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. weiterlesen
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. weiterlesen
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. weiterlesen
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. weiterlesen
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. weiterlesen
Design To Manufacturing Standards
• The Information Process
• Knowing the jargon (terms & definitions)
• Defining the requirements
• Expansion of Documentation standards
• Document Grade and Completeness
• Relationship of CAD/C
.. weiterlesen