Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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IPC/JEDEC J-STD-609AMarking and Labeling of Components,PCBs and PCBAs to Identify Lead (Pb),Lead-Free (Pb-Free) and Other Attributes
• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly.
• Other areas covered include board base material type and sur
.. weiterlesen
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. weiterlesen
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. weiterlesen
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. weiterlesen
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. weiterlesen
Manufacturing Equipment: From Single Machines to Integrated High Performance Systems
- Production Processes
- Manual Production Line (2000)
- Fully Automated System (today)
- Cell Interconnection
- Encapsulation Materials
- Encapsulation Process
- Influence of Temperature
- Enc
.. weiterlesen
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. weiterlesen
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. weiterlesen
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. weiterlesen
Where are REACH SVHC in Electronic Products and Parts?
The European REACH regulation (Regulation (EC) No 1907/2006) imposes requirements to declare and sometimes restrict the use of Substances of Very High Concern (SVHC). REACH affects all product
.. weiterlesen
Round Robin Testing in Support of IPC J-STD-709: Combustion Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl
This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials
.. weiterlesen
Effect of Board Clamping System on Solder Paste Print Quality
Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics
packaging industry. In those early days,components were fairly large,m
.. weiterlesen
Stencil Design Considerations to Improve Drop Test Performance
Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics
packaging design using smaller components with greater I/Os assembled
.. weiterlesen
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. weiterlesen
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. weiterlesen
Poor Metrology: The Hidden Cost
Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr
.. weiterlesen
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. weiterlesen
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. weiterlesen
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag
.. weiterlesen
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. weiterlesen
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. weiterlesen
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. weiterlesen
Stencil Options for Printing Solder Paste for .3 Mm CSP’s and 01005 Chip Components
Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto
.. weiterlesen
Effect of Squeegee Blade on Solder Paste Print Quality
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro
.. weiterlesen
Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume
It is frequently noted in surface mount printed circuit board assembly that most solder defects can be traced back to the stencil printing process. In addition,continuous miniaturization trends
.. weiterlesen
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. weiterlesen
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. weiterlesen
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. weiterlesen
IPC/JEDEC J-STD-609AMarking and Labeling of Components,PCBs and PCBAs to Identify Lead (Pb),Lead-Free (Pb-Free) and Other Attributes
• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly.
• Other areas covered include board base material type and sur
.. weiterlesen
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. weiterlesen
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. weiterlesen
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. weiterlesen
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. weiterlesen
Manufacturing Equipment: From Single Machines to Integrated High Performance Systems
- Production Processes
- Manual Production Line (2000)
- Fully Automated System (today)
- Cell Interconnection
- Encapsulation Materials
- Encapsulation Process
- Influence of Temperature
- Enc
.. weiterlesen
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. weiterlesen
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. weiterlesen
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. weiterlesen
Where are REACH SVHC in Electronic Products and Parts?
The European REACH regulation (Regulation (EC) No 1907/2006) imposes requirements to declare and sometimes restrict the use of Substances of Very High Concern (SVHC). REACH affects all product
.. weiterlesen
Round Robin Testing in Support of IPC J-STD-709: Combustion Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl
This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials
.. weiterlesen
Effect of Board Clamping System on Solder Paste Print Quality
Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics
packaging industry. In those early days,components were fairly large,m
.. weiterlesen
Stencil Design Considerations to Improve Drop Test Performance
Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics
packaging design using smaller components with greater I/Os assembled
.. weiterlesen
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. weiterlesen
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. weiterlesen
Poor Metrology: The Hidden Cost
Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr
.. weiterlesen
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. weiterlesen
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. weiterlesen
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag
.. weiterlesen
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. weiterlesen
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. weiterlesen
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. weiterlesen
Stencil Options for Printing Solder Paste for .3 Mm CSP’s and 01005 Chip Components
Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto
.. weiterlesen
Effect of Squeegee Blade on Solder Paste Print Quality
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro
.. weiterlesen
Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume
It is frequently noted in surface mount printed circuit board assembly that most solder defects can be traced back to the stencil printing process. In addition,continuous miniaturization trends
.. weiterlesen
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. weiterlesen
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. weiterlesen
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. weiterlesen