Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. weiterlesen
Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi
.. weiterlesen
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. weiterlesen
Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys
Recently,the industry has seen the development of a wide range of new Pb-free alloys. A significant element of uncertainty within the industry regarding these new alloys is the lack of defined
.. weiterlesen
Characterizing the Lead-Free Impact on PCB Pad Craters
Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo
.. weiterlesen
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. weiterlesen
Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. weiterlesen
Constitutive and Failure Behavior of SnAgCu Solder Joints
Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a
.. weiterlesen
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. weiterlesen
Suspect / Counterfeit Electronic Components and Risk Mitigation
In this presentation,numerous examples of counterfeited parts are provided along with the means of identification for the respective technique utilized in production.
.. weiterlesen
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. weiterlesen
Design Considerations for High Reliability PCB
- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly
.. weiterlesen
Pb-Free Reflow,PCB Degradation,and the Influence of Moisture Absorption
Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread o
.. weiterlesen
Proposed Standardizations of Lead Free Alloy Testing
Although lead free assembly is now widely adopted the industry is still exploring a variety of options for lead free alloys. Attempts to standardize on a single alloy for either reflow or wave
.. weiterlesen
IPC Solder Products Value Council (SPVC) Lead-Free Technical Subcommittee Report: Take Action Limits (TAL) for SAC305 Lead Free Automated Soldering...
At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering.
Unlike solder paste in a reflow
.. weiterlesen
Vibration and Mechanical Shock Testing
Little data has been generated on the performance of lead-free solders under vibration and mechanical shock. What data exists suggests that lead-free solders may be less reliable than eutectic
.. weiterlesen
Implementing Quality and Reliability on the Assembly Line
Many will look to IPC standards for advice or workmanship requirements for electronic assemblies. Some will find a copy of IPC-A-610 Acceptability of Electronic Assemblies and stop there. But I
.. weiterlesen
High Performance Work Teams in EMS The Critical Difference
This presentation attempts to convince the reader that while all the logistical,equipment,financial and process aspects of any business are important,the high performance work team is the criti
.. weiterlesen
Manufacturing Quality Issues from the EMS Perspective
As more electronic assembly moves from OEM to EMS providers,a number of key issues arise in the overall value stream of production. This presentation will provide a comprehensive look at qualit
.. weiterlesen
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. weiterlesen
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. weiterlesen
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. weiterlesen
Why Electroless Palladium: Study on Impact of Electroless Palladium on Electroless Nickel Deposits
Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met
.. weiterlesen
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. weiterlesen
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. weiterlesen
REACH,RoHS,TSCA,CPSC – What’s next?
Restrictions on the use of chemicals in began 30 years ago in the US with the passage of the Toxic Substances Control Act. Over the last five years we have seen a logarithmic increase in produc
.. weiterlesen
International Environmental Standards for the Electronics Industry
Industry associations,such as IPC,were quick to develop standards to help the electronics industry deal with emerging environmental regulations; however,for regulatory compliance,smooth interna
.. weiterlesen
Materials Declaration: Practical Tips for Cutting through the Paperwork
This presentation will examine materials declaration from a practical point of view,identify the role of materials declaration in the product lifecycle analysis and thus hone in on the practica
.. weiterlesen
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. weiterlesen
Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi
.. weiterlesen
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. weiterlesen
Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys
Recently,the industry has seen the development of a wide range of new Pb-free alloys. A significant element of uncertainty within the industry regarding these new alloys is the lack of defined
.. weiterlesen
Characterizing the Lead-Free Impact on PCB Pad Craters
Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo
.. weiterlesen
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. weiterlesen
Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. weiterlesen
Constitutive and Failure Behavior of SnAgCu Solder Joints
Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a
.. weiterlesen
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. weiterlesen
Suspect / Counterfeit Electronic Components and Risk Mitigation
In this presentation,numerous examples of counterfeited parts are provided along with the means of identification for the respective technique utilized in production.
.. weiterlesen
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. weiterlesen
Design Considerations for High Reliability PCB
- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly
.. weiterlesen
Pb-Free Reflow,PCB Degradation,and the Influence of Moisture Absorption
Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread o
.. weiterlesen
Proposed Standardizations of Lead Free Alloy Testing
Although lead free assembly is now widely adopted the industry is still exploring a variety of options for lead free alloys. Attempts to standardize on a single alloy for either reflow or wave
.. weiterlesen
IPC Solder Products Value Council (SPVC) Lead-Free Technical Subcommittee Report: Take Action Limits (TAL) for SAC305 Lead Free Automated Soldering...
At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering.
Unlike solder paste in a reflow
.. weiterlesen
Vibration and Mechanical Shock Testing
Little data has been generated on the performance of lead-free solders under vibration and mechanical shock. What data exists suggests that lead-free solders may be less reliable than eutectic
.. weiterlesen
Implementing Quality and Reliability on the Assembly Line
Many will look to IPC standards for advice or workmanship requirements for electronic assemblies. Some will find a copy of IPC-A-610 Acceptability of Electronic Assemblies and stop there. But I
.. weiterlesen
High Performance Work Teams in EMS The Critical Difference
This presentation attempts to convince the reader that while all the logistical,equipment,financial and process aspects of any business are important,the high performance work team is the criti
.. weiterlesen
Manufacturing Quality Issues from the EMS Perspective
As more electronic assembly moves from OEM to EMS providers,a number of key issues arise in the overall value stream of production. This presentation will provide a comprehensive look at qualit
.. weiterlesen
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. weiterlesen
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. weiterlesen
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. weiterlesen
Why Electroless Palladium: Study on Impact of Electroless Palladium on Electroless Nickel Deposits
Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met
.. weiterlesen
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. weiterlesen
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. weiterlesen
REACH,RoHS,TSCA,CPSC – What’s next?
Restrictions on the use of chemicals in began 30 years ago in the US with the passage of the Toxic Substances Control Act. Over the last five years we have seen a logarithmic increase in produc
.. weiterlesen
International Environmental Standards for the Electronics Industry
Industry associations,such as IPC,were quick to develop standards to help the electronics industry deal with emerging environmental regulations; however,for regulatory compliance,smooth interna
.. weiterlesen
Materials Declaration: Practical Tips for Cutting through the Paperwork
This presentation will examine materials declaration from a practical point of view,identify the role of materials declaration in the product lifecycle analysis and thus hone in on the practica
.. weiterlesen