Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. weiterlesen
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. weiterlesen
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. weiterlesen
A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. weiterlesen
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. weiterlesen
Novel Dielectric Materials: Breaking the Gigahertz Barrier
For many critical electronic applications,there is a need for dielectric systems that exhibit better electrical insulation
performance than epoxies and other conventional materials. In the prod
.. weiterlesen
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. weiterlesen
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. weiterlesen
To be or not to be in Color: A 10 year study of the benefits and pitfalls of including color...
Imagine that you were choosing a camera for your AOI system. Should you opt for a black and white camera or a color camera? This seems like a no-brainer. Most of us would go for a color camera.
.. weiterlesen
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. weiterlesen
Preparing Supply Chains for the Disruption of Green Transitions
The European Union list of Substances of Very High Concern (SVHCs) published in the Registration,Evaluation,Authorization and Restriction of Chemicals (REACH) regulation,requires producers of A
.. weiterlesen
SMT Process Characterization and Financial Impact
Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM
.. weiterlesen
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. weiterlesen
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. weiterlesen
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. weiterlesen
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. weiterlesen
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. weiterlesen
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. weiterlesen
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. weiterlesen
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. weiterlesen
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. weiterlesen
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. weiterlesen
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. weiterlesen
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. weiterlesen
Low Cost Optical Thickness Measurement of Conformal Coatings
Conformal coatings are used in high reliability electronics to protect the circuits from environmental contaminants. They are
applied by a variety of methods,and in varying thicknesses. Confirm
.. weiterlesen
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. weiterlesen
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. weiterlesen
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. weiterlesen
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. weiterlesen
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. weiterlesen
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. weiterlesen
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. weiterlesen
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. weiterlesen
A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. weiterlesen
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. weiterlesen
Novel Dielectric Materials: Breaking the Gigahertz Barrier
For many critical electronic applications,there is a need for dielectric systems that exhibit better electrical insulation
performance than epoxies and other conventional materials. In the prod
.. weiterlesen
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. weiterlesen
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. weiterlesen
To be or not to be in Color: A 10 year study of the benefits and pitfalls of including color...
Imagine that you were choosing a camera for your AOI system. Should you opt for a black and white camera or a color camera? This seems like a no-brainer. Most of us would go for a color camera.
.. weiterlesen
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. weiterlesen
Preparing Supply Chains for the Disruption of Green Transitions
The European Union list of Substances of Very High Concern (SVHCs) published in the Registration,Evaluation,Authorization and Restriction of Chemicals (REACH) regulation,requires producers of A
.. weiterlesen
SMT Process Characterization and Financial Impact
Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM
.. weiterlesen
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. weiterlesen
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. weiterlesen
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. weiterlesen
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. weiterlesen
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. weiterlesen
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. weiterlesen
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. weiterlesen
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. weiterlesen
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. weiterlesen
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. weiterlesen
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. weiterlesen
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. weiterlesen
Low Cost Optical Thickness Measurement of Conformal Coatings
Conformal coatings are used in high reliability electronics to protect the circuits from environmental contaminants. They are
applied by a variety of methods,and in varying thicknesses. Confirm
.. weiterlesen
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. weiterlesen
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. weiterlesen
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. weiterlesen
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. weiterlesen
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. weiterlesen