Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. weiterlesen
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. weiterlesen
Step Stencil design when 01005 and 0.3mm pitch uBGA’s coexist with RF Shields
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally,there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA
.. weiterlesen
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. weiterlesen
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. weiterlesen
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. weiterlesen
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. weiterlesen
When Precision is not good enough
As PCB designs become ever more complex with more sequential build up layers,tighter annular ring designs and broader range of advanced materials,understanding the effect of material distortion
.. weiterlesen
Top Doing More With Less
A new technology for MLB pressing has been developed by MBT and industry partners,called TOP,Temperature Optimised Process. The goal was to reduce energy consumption and to improve product qual
.. weiterlesen
An Analytical Approach for the Design of Buried Capacitance PCBs
There are presently several techniques for forming a buried capacitor in the core of a multilayer board. For purposes of this discussion,attention will be directed toward a sheet capacitor; alt
.. weiterlesen
Embedded Passives Become Mainstream Technology,Finally!
Embedded passives,especially embedded resistors and capacitors have been a hot topic since the mid-to-late 1990s. It is easy to understand why they have generated so much interest. Technology c
.. weiterlesen
RoHS War Stories
The following article is a series of “from the trenches” stories,taken both from the perspective of an electronics manufacturer and an environmental compliance consultancy. The accounts below p
.. weiterlesen
Laboratory 101: A Guide to Understanding your Testing Laboratory
Within today’s Consumer Electronics Industry,a laboratory report listing elemental content is standard protocol. Understanding the information listed within a lab report can be difficult and un
.. weiterlesen
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. weiterlesen
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. weiterlesen
Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves
Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law,high reliability electronic devices build faster processing speed
.. weiterlesen
Pockets of Contamination That Are Causing Field Failures and How to Avoid Them
The areas of entrapment on cleaned and no-clean assemblies are showing higher levels of contamination around BGA’s,in microvias and particularly under components like the QFN. Flux residues tra
.. weiterlesen
Virtual Access Technique Extends Test Coverage on PCB Assemblies
With greater time to market and time to volume pressures,manufacturers of populated printed circuit boards have traditionally relied upon un-powered vectorless testing to quickly and reliably i
.. weiterlesen
RFS Handler Cone Chuck Simplification for Effective Handling Performance
In today’s manufacturing world,higher equipment utilization and lower operating cost is the way forward. Newer machineries are usually well equipped to get the job done as they are manufactured
.. weiterlesen
Flexible LED Arrays made by all screen printing Process
Many flat panel display technologies were developed and commercialized since 1980s. Today,liquid crystal display panels
(LCD) and plasma display panels (PDP) have the lion’s share of the large
.. weiterlesen
Fine Line Thick Film Circuits with High Conductivity Built on Flexible Substrates are Capable of Soldering
Previously,the general understanding about polymer-base thick film flexible circuits consisted of low density with low electrical conductivity because of the organic matrix in the conductor mat
.. weiterlesen
Design for Low-Halogen Green Electronics
Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the
hottest topics for the upcoming years. Besides reduction of consu
.. weiterlesen
Liquid Photoresist and Soldermask Processing The Real Environmental Impact
Since the early days of PWBs,liquid photoresists and soldermasks have played indispensable roles in the manufacturing process. From the introduction of the original Kodak Photo Resist (KPR) and
.. weiterlesen
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. weiterlesen
Root Cause of Corrosion on Aluminum Bond Pads
During the process from wafer fabrication to completing the final plastic package there are a number of upstream processes that negatively impact subsequent operations. Problems at wirebond can
.. weiterlesen
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. weiterlesen
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. weiterlesen
Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
During the last 5 years,the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new meth
.. weiterlesen
Oscillating Nozzle Technology for Improved Cleaning Performance in Prewash Module
Implementation of lead-free soldering technology has created new interest in high performance cleaning of printed circuit assemblies (PCAs). Many studies have been commissioned regarding remova
.. weiterlesen
Cleaning Today’s Assemblies in Batch Systems
Batch cleaning of electronic assemblies is popular in all regions of the world and continues to grow due to its flexibility,ease-of-use and economic considerations. Batch spray-in-air processes
.. weiterlesen
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. weiterlesen
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. weiterlesen
Step Stencil design when 01005 and 0.3mm pitch uBGA’s coexist with RF Shields
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally,there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA
.. weiterlesen
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. weiterlesen
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. weiterlesen
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. weiterlesen
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. weiterlesen
When Precision is not good enough
As PCB designs become ever more complex with more sequential build up layers,tighter annular ring designs and broader range of advanced materials,understanding the effect of material distortion
.. weiterlesen
Top Doing More With Less
A new technology for MLB pressing has been developed by MBT and industry partners,called TOP,Temperature Optimised Process. The goal was to reduce energy consumption and to improve product qual
.. weiterlesen
An Analytical Approach for the Design of Buried Capacitance PCBs
There are presently several techniques for forming a buried capacitor in the core of a multilayer board. For purposes of this discussion,attention will be directed toward a sheet capacitor; alt
.. weiterlesen
Embedded Passives Become Mainstream Technology,Finally!
Embedded passives,especially embedded resistors and capacitors have been a hot topic since the mid-to-late 1990s. It is easy to understand why they have generated so much interest. Technology c
.. weiterlesen
RoHS War Stories
The following article is a series of “from the trenches” stories,taken both from the perspective of an electronics manufacturer and an environmental compliance consultancy. The accounts below p
.. weiterlesen
Laboratory 101: A Guide to Understanding your Testing Laboratory
Within today’s Consumer Electronics Industry,a laboratory report listing elemental content is standard protocol. Understanding the information listed within a lab report can be difficult and un
.. weiterlesen
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. weiterlesen
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. weiterlesen
Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves
Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law,high reliability electronic devices build faster processing speed
.. weiterlesen
Pockets of Contamination That Are Causing Field Failures and How to Avoid Them
The areas of entrapment on cleaned and no-clean assemblies are showing higher levels of contamination around BGA’s,in microvias and particularly under components like the QFN. Flux residues tra
.. weiterlesen
Virtual Access Technique Extends Test Coverage on PCB Assemblies
With greater time to market and time to volume pressures,manufacturers of populated printed circuit boards have traditionally relied upon un-powered vectorless testing to quickly and reliably i
.. weiterlesen
RFS Handler Cone Chuck Simplification for Effective Handling Performance
In today’s manufacturing world,higher equipment utilization and lower operating cost is the way forward. Newer machineries are usually well equipped to get the job done as they are manufactured
.. weiterlesen
Flexible LED Arrays made by all screen printing Process
Many flat panel display technologies were developed and commercialized since 1980s. Today,liquid crystal display panels
(LCD) and plasma display panels (PDP) have the lion’s share of the large
.. weiterlesen
Fine Line Thick Film Circuits with High Conductivity Built on Flexible Substrates are Capable of Soldering
Previously,the general understanding about polymer-base thick film flexible circuits consisted of low density with low electrical conductivity because of the organic matrix in the conductor mat
.. weiterlesen
Design for Low-Halogen Green Electronics
Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the
hottest topics for the upcoming years. Besides reduction of consu
.. weiterlesen
Liquid Photoresist and Soldermask Processing The Real Environmental Impact
Since the early days of PWBs,liquid photoresists and soldermasks have played indispensable roles in the manufacturing process. From the introduction of the original Kodak Photo Resist (KPR) and
.. weiterlesen
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. weiterlesen
Root Cause of Corrosion on Aluminum Bond Pads
During the process from wafer fabrication to completing the final plastic package there are a number of upstream processes that negatively impact subsequent operations. Problems at wirebond can
.. weiterlesen
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. weiterlesen
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. weiterlesen
Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
During the last 5 years,the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new meth
.. weiterlesen
Oscillating Nozzle Technology for Improved Cleaning Performance in Prewash Module
Implementation of lead-free soldering technology has created new interest in high performance cleaning of printed circuit assemblies (PCAs). Many studies have been commissioned regarding remova
.. weiterlesen
Cleaning Today’s Assemblies in Batch Systems
Batch cleaning of electronic assemblies is popular in all regions of the world and continues to grow due to its flexibility,ease-of-use and economic considerations. Batch spray-in-air processes
.. weiterlesen