Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture
All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post
.. weiterlesen
Solving Today’s Test Challenges: Razor Sharp Probes
Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability
Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w
.. weiterlesen
Section 41 Research & Experimentation Tax Credit
•Rewards businesses with a dollar for dollar reduction of tax
•Rewards “evolutionary” and “revolutionary” activities
•Federal tax benefit can be as high as 6.5% of investment in new products an
.. weiterlesen
Reducing Costs and Avoiding Risks in the Global Market
Companies seeking sales or suppliers in the global marketplace must proceed with caution. This presentation provides an overview of U.S. regulation of import and export transactions. Importers
.. weiterlesen
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. weiterlesen
Tin Allotropic Transformation ~ Tin Pest
It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% volume increase,and in appearance turns from a bright shiny metallic m
.. weiterlesen
A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. weiterlesen
Cleaning Qualification Methodology for Inline Aqueous Assembly Process
An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p
.. weiterlesen
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. weiterlesen
Fluid Flow Mechanics -Key to Low Standoff Cleaning
Over 3 years ago,Zestron initially addressed cleaning underneath 4 MIL standoff components. With the emergence of lead-free and even smaller components new challenges have now arisen to include
.. weiterlesen
Design for Manufacturability in Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. weiterlesen
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. weiterlesen
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. weiterlesen
Successful Implementation of Insoluble Anodes in a Vertical Plating Acid Copper Tank at Electrotek Corporation in Oak Creek WI.
The use of an insoluble anode in place of standard copper anodes (slab or titanium baskets filled with copper) improves the quality of plating,increases the productivity of the plating line,red
.. weiterlesen
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. weiterlesen
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. weiterlesen
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv
.. weiterlesen
Base Material Consideration for High Speed Printed Circuit boards
Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h
.. weiterlesen
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. weiterlesen
Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch
.. weiterlesen
REACH for Electronics Manufacturers
REACH presents a new set of direct and indirect risks for article manufacturers,including electronics manufacturers. Direct risks arise from obligations explicitly outlined in the REACH regulat
.. weiterlesen
Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
.. weiterlesen
An Analytical Model for an Inline Counter Flow Processor
The purpose of this paper is to demonstrate the value of mathematical modeling of PCB processes. This approach will identify the first order variables that control the process and the relative
.. weiterlesen
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. weiterlesen
Predictor Model … Round Robin
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting this t-cycle lifetime is critical in optimizing product design
.. weiterlesen
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. weiterlesen
1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder
As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar
.. weiterlesen
How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process
The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr
.. weiterlesen
Embedded Capacitor Material and Design Considerations for High Frequency Modules
In order to meet the never ending desire for smaller and cheaper electronics,many companies are pursuing the use of embedded passive technologies. There are several examples of embedded
capacit
.. weiterlesen
Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. weiterlesen
ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture
All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post
.. weiterlesen
Solving Today’s Test Challenges: Razor Sharp Probes
Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability
Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w
.. weiterlesen
Section 41 Research & Experimentation Tax Credit
•Rewards businesses with a dollar for dollar reduction of tax
•Rewards “evolutionary” and “revolutionary” activities
•Federal tax benefit can be as high as 6.5% of investment in new products an
.. weiterlesen
Reducing Costs and Avoiding Risks in the Global Market
Companies seeking sales or suppliers in the global marketplace must proceed with caution. This presentation provides an overview of U.S. regulation of import and export transactions. Importers
.. weiterlesen
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. weiterlesen
Tin Allotropic Transformation ~ Tin Pest
It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% volume increase,and in appearance turns from a bright shiny metallic m
.. weiterlesen
A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. weiterlesen
Cleaning Qualification Methodology for Inline Aqueous Assembly Process
An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p
.. weiterlesen
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. weiterlesen
Fluid Flow Mechanics -Key to Low Standoff Cleaning
Over 3 years ago,Zestron initially addressed cleaning underneath 4 MIL standoff components. With the emergence of lead-free and even smaller components new challenges have now arisen to include
.. weiterlesen
Design for Manufacturability in Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. weiterlesen
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. weiterlesen
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. weiterlesen
Successful Implementation of Insoluble Anodes in a Vertical Plating Acid Copper Tank at Electrotek Corporation in Oak Creek WI.
The use of an insoluble anode in place of standard copper anodes (slab or titanium baskets filled with copper) improves the quality of plating,increases the productivity of the plating line,red
.. weiterlesen
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. weiterlesen
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. weiterlesen
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv
.. weiterlesen
Base Material Consideration for High Speed Printed Circuit boards
Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h
.. weiterlesen
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. weiterlesen
Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch
.. weiterlesen
REACH for Electronics Manufacturers
REACH presents a new set of direct and indirect risks for article manufacturers,including electronics manufacturers. Direct risks arise from obligations explicitly outlined in the REACH regulat
.. weiterlesen
Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
.. weiterlesen
An Analytical Model for an Inline Counter Flow Processor
The purpose of this paper is to demonstrate the value of mathematical modeling of PCB processes. This approach will identify the first order variables that control the process and the relative
.. weiterlesen
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. weiterlesen
Predictor Model … Round Robin
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting this t-cycle lifetime is critical in optimizing product design
.. weiterlesen
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. weiterlesen
1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder
As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar
.. weiterlesen
How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process
The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr
.. weiterlesen
Embedded Capacitor Material and Design Considerations for High Frequency Modules
In order to meet the never ending desire for smaller and cheaper electronics,many companies are pursuing the use of embedded passive technologies. There are several examples of embedded
capacit
.. weiterlesen
Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. weiterlesen