Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Study of Copper Thickness Distribution in Through Hole at the Early Stage of Copper Filled Plating
In laptop and tablet CPU/GPU applications, package thickness tends to be thinner since it brings lighter weight, lower product thickness, and shorter interconnection distance. To decrease pa
.. read more
Reflow Soldering Performance Improvement of Polymer Aluminum Electrolytic Capacitor
The reflow soldering performance of polymer aluminum electrolytic capacitors have a direct impact on their electrical performance. By analyzing the mechanism of capacitor bulges, improve the
.. read more
Effect of Soft Touch Caused by Manual Handling on Substrate Warpage
Flip chip BGA, interconnect with semiconductor chips and mainboards, to serve the interconnection of electronic products. This paper is about the study of one of the important warpage modula
.. read more
Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization
In the pursuit of ever finer lines and spaces to advance technology's power and efficiency, the substrate and substrate-like production processes must adapt to meet these demands while caref
.. read more
The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graphene
The protection of metallic substrates from reactive environments is necessary for semiconductor packages, which are mainly made of copper metal. Conventionally, plating with novel metals suc
.. read more
Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints
This study is part of a series of papers on mitigation of voids in solder joints. Voiding is an ongoing concern for printed circuit board assembly (PCBA) manufacturers. As bottom terminated
.. read more
The study of TCNCP solder joint quality with flip chip ETS
ETS (Embedded Trace Substrate) is one of advanced substrate design that enable to make fine width and space. The Cu trace open defect on ETS layer (L01) revealed by this OSP micro etching is
.. read more
Warpage Estimation of Organic Interposer for HPC Application
The explosion of data in the 4th Industrial Revolution has increased the importance of high-performance computing (HPC). HPC requires high-density I/O count to be formed in small area, but t
.. read more
Development and Enhancement for Low Temperature Wave Soldering Solution
Sn-58Bi lead-free low-temperature solder (LTS) is regarded as a candidate for low-temperature assembly of electronics components, but its usage field is limited in Surface Mount Technology (
.. read more
Research on electroplating capability of multi-layer interconnected deep microvia PCB based on simulation model
Deep microporous crab legs and abnormal crystallization of coating are common defects in the electroplating process, which have a significant impact on the reliability of PCB products. In th
.. read more
Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Chiplet technology is rapidly applied to the latest devices as high performance of semiconductor devices is required. As chiplet becomes vibrant, IC packaging substrates become bigger and mo
.. read more
Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Applications for dielectric materials are becoming ever more demanding and complex, requiring careful planning & material selection by original equipment manufacturer (OEM) designers tha
.. read more
Advanced Heat Removal, An Electronics Overmolding Advantage
The growing demand for high-performance and compact electronic devices has led to increasing power densities, resulting in thermal challenges that impact packaging, performance, and reliabil
.. read more
Can Assembly Materials Help You Achieve Your Sustainability Objectives?
Today, the evaluation of circuit board assembly materials extends beyond their technical performance. An increasingly important aspect of this evaluation centers on whether the material help
.. read more
High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Polycarbonate/Acrylonitrile butadiene styrene (PC/ABS) blends are widely used engineering thermoplastic materials in electronic applications for TV frames, computer peripherals, phone housin
.. read more
Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage
Thermal-aging induced crack formation of fiber-reinforced polymer composites in printed circuit boards (PCBs) is a major failure mode affecting the reliability of electronic control units as
.. read more
Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization
As the data rate is getting faster with the development of applications such as High Performance Computing (HPC), Data Center, and Artificial Intelligence (AI), it is found via stubs are aff
.. read more
Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
Solder voids affect the thermal and electrical properties of solder joints, reducing their reliability. The main test for solder voids is non-destructive testing using X-ray transmission ima
.. read more
Investigation of Factors Influencing SR/Cu Interface Adhesion
Solder resist (SR) is applied to the outermost layer of printed circuit boards (PCBs) for surface protection and electrical insulation. It is crucial for the reliability of PCBs to ensure ro
.. read more
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing
Metals have long been used as thermal interface materials (TIMs). Due to their high reliability and thermal conductivity, metal TIMs are excellent solutions for heat dissipation in electroni
.. read more
A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
There is a global consensus that the environmental impact of electronics needs to be reduced. The first step towards this goal is identifying the environmental hotspots in electronics manufa
.. read more
Development of Flux for Fine Bump Array by Controlling Rheological Properties
Flux which facilitates fine bump development and bump pitch was developed. The purpose was to achieve fine bump and bump pitch by securing rheological properties that are similar to, or an i
.. read more
Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
Thermosetting epoxy resin is widely used in electronic materials for its excellent insulation, heat resistance, mechanical properties, chemical resistance and processability. However, the no
.. read more
Advanced Package Substrate Embedding Thin Non-Silicon Substrates of Fine Lines
2.5D is representative advanced packaging technologies that combine multiple integrated circuit dies into one package using silicon interposer. And 2.1D bridge technology, which inserts high
.. read more
Electronic Essentials 101: What You Think You Know - and More
The July 23rd webinar, “Electronic Essentials 101: What You Think You Know – and More,” presented by Greg Merrill, offered a practical refresher on core electronics concepts like voltage, cu
.. read more
iNEMI 2023 Board Assembly++CPU Socket Technology Roadmap
This article is a series of studies on a new generation of CPU socket challenges and component interconnect technology for high-end computer product applications. These products encompass co
.. read more
Achieving Equipment Orchestration Through Equipment Integration
In modern manufacturing, the seamless coordination and efficient control of Surface Mount Technology (SMT) production lines rely significantly on strong communication and interoperability am
.. read more
High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard
When the traditional server motherboard is designed in laminated structure, in order to ensure the symmetry of laminated structure, each layer is designed with the same material. With the up
.. read more
QFN Assembly Reliability Under a New HALT Test Method
This paper first presents a summary of cycles-to-failures (CTFs) test data based on Weibull plots and failure analysis generated for small to large Quad Flat No-Lead (QFN) packages, which we
.. read more
Research on the Laminating Technology of Embedded Optical Fiber Array PCB
Optical fiber array can realize multi-channel optical signal transmission. In the process of embedded PCB, the difficulty lies in laminating. The structure of the optical fiber array determi
.. read more
Study of Copper Thickness Distribution in Through Hole at the Early Stage of Copper Filled Plating
In laptop and tablet CPU/GPU applications, package thickness tends to be thinner since it brings lighter weight, lower product thickness, and shorter interconnection distance. To decrease pa
.. read more
Reflow Soldering Performance Improvement of Polymer Aluminum Electrolytic Capacitor
The reflow soldering performance of polymer aluminum electrolytic capacitors have a direct impact on their electrical performance. By analyzing the mechanism of capacitor bulges, improve the
.. read more
Effect of Soft Touch Caused by Manual Handling on Substrate Warpage
Flip chip BGA, interconnect with semiconductor chips and mainboards, to serve the interconnection of electronic products. This paper is about the study of one of the important warpage modula
.. read more
Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization
In the pursuit of ever finer lines and spaces to advance technology's power and efficiency, the substrate and substrate-like production processes must adapt to meet these demands while caref
.. read more
The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graphene
The protection of metallic substrates from reactive environments is necessary for semiconductor packages, which are mainly made of copper metal. Conventionally, plating with novel metals suc
.. read more
Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints
This study is part of a series of papers on mitigation of voids in solder joints. Voiding is an ongoing concern for printed circuit board assembly (PCBA) manufacturers. As bottom terminated
.. read more
The study of TCNCP solder joint quality with flip chip ETS
ETS (Embedded Trace Substrate) is one of advanced substrate design that enable to make fine width and space. The Cu trace open defect on ETS layer (L01) revealed by this OSP micro etching is
.. read more
Warpage Estimation of Organic Interposer for HPC Application
The explosion of data in the 4th Industrial Revolution has increased the importance of high-performance computing (HPC). HPC requires high-density I/O count to be formed in small area, but t
.. read more
Development and Enhancement for Low Temperature Wave Soldering Solution
Sn-58Bi lead-free low-temperature solder (LTS) is regarded as a candidate for low-temperature assembly of electronics components, but its usage field is limited in Surface Mount Technology (
.. read more
Research on electroplating capability of multi-layer interconnected deep microvia PCB based on simulation model
Deep microporous crab legs and abnormal crystallization of coating are common defects in the electroplating process, which have a significant impact on the reliability of PCB products. In th
.. read more
Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Chiplet technology is rapidly applied to the latest devices as high performance of semiconductor devices is required. As chiplet becomes vibrant, IC packaging substrates become bigger and mo
.. read more
Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Applications for dielectric materials are becoming ever more demanding and complex, requiring careful planning & material selection by original equipment manufacturer (OEM) designers tha
.. read more
Advanced Heat Removal, An Electronics Overmolding Advantage
The growing demand for high-performance and compact electronic devices has led to increasing power densities, resulting in thermal challenges that impact packaging, performance, and reliabil
.. read more
Can Assembly Materials Help You Achieve Your Sustainability Objectives?
Today, the evaluation of circuit board assembly materials extends beyond their technical performance. An increasingly important aspect of this evaluation centers on whether the material help
.. read more
High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Polycarbonate/Acrylonitrile butadiene styrene (PC/ABS) blends are widely used engineering thermoplastic materials in electronic applications for TV frames, computer peripherals, phone housin
.. read more
Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage
Thermal-aging induced crack formation of fiber-reinforced polymer composites in printed circuit boards (PCBs) is a major failure mode affecting the reliability of electronic control units as
.. read more
Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization
As the data rate is getting faster with the development of applications such as High Performance Computing (HPC), Data Center, and Artificial Intelligence (AI), it is found via stubs are aff
.. read more
Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
Solder voids affect the thermal and electrical properties of solder joints, reducing their reliability. The main test for solder voids is non-destructive testing using X-ray transmission ima
.. read more
Investigation of Factors Influencing SR/Cu Interface Adhesion
Solder resist (SR) is applied to the outermost layer of printed circuit boards (PCBs) for surface protection and electrical insulation. It is crucial for the reliability of PCBs to ensure ro
.. read more
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing
Metals have long been used as thermal interface materials (TIMs). Due to their high reliability and thermal conductivity, metal TIMs are excellent solutions for heat dissipation in electroni
.. read more
A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
There is a global consensus that the environmental impact of electronics needs to be reduced. The first step towards this goal is identifying the environmental hotspots in electronics manufa
.. read more
Development of Flux for Fine Bump Array by Controlling Rheological Properties
Flux which facilitates fine bump development and bump pitch was developed. The purpose was to achieve fine bump and bump pitch by securing rheological properties that are similar to, or an i
.. read more
Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
Thermosetting epoxy resin is widely used in electronic materials for its excellent insulation, heat resistance, mechanical properties, chemical resistance and processability. However, the no
.. read more
Advanced Package Substrate Embedding Thin Non-Silicon Substrates of Fine Lines
2.5D is representative advanced packaging technologies that combine multiple integrated circuit dies into one package using silicon interposer. And 2.1D bridge technology, which inserts high
.. read more
Electronic Essentials 101: What You Think You Know - and More
The July 23rd webinar, “Electronic Essentials 101: What You Think You Know – and More,” presented by Greg Merrill, offered a practical refresher on core electronics concepts like voltage, cu
.. read more
iNEMI 2023 Board Assembly++CPU Socket Technology Roadmap
This article is a series of studies on a new generation of CPU socket challenges and component interconnect technology for high-end computer product applications. These products encompass co
.. read more
Achieving Equipment Orchestration Through Equipment Integration
In modern manufacturing, the seamless coordination and efficient control of Surface Mount Technology (SMT) production lines rely significantly on strong communication and interoperability am
.. read more
High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard
When the traditional server motherboard is designed in laminated structure, in order to ensure the symmetry of laminated structure, each layer is designed with the same material. With the up
.. read more
QFN Assembly Reliability Under a New HALT Test Method
This paper first presents a summary of cycles-to-failures (CTFs) test data based on Weibull plots and failure analysis generated for small to large Quad Flat No-Lead (QFN) packages, which we
.. read more
Research on the Laminating Technology of Embedded Optical Fiber Array PCB
Optical fiber array can realize multi-channel optical signal transmission. In the process of embedded PCB, the difficulty lies in laminating. The structure of the optical fiber array determi
.. read more