Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics
Corrosion issues of electronic devices under humid conditions heavily rely on the cleanliness of Printed Circuit Board Assemblies (PCBAs). Use of no-clean flux during diverse soldering techn
.. read more
Reliability and Value Proposition of Active and Passive Embedded Components in Consumer Applications
This study evaluated embedded components for use in printed circuit board assemblies to achieve miniaturization goals for wearable consumer products. Both passive and active components were
.. read more
Solder Graping Issue Analysis
A solder graping issue affected multiple units during the production process. Solder graping is a phenomenon where small, un-melted solder particles are trapped on the surface of the joint,
.. read more
Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features
The physical reliability of a printed circuit board (PCB) is often seen as more important than having the best dielectric performance. Hence, a great deal of research and development has bee
.. read more
Glass Type Comparison
Woven glass fabric has been used in PWB laminates since the 1960s as a replacement for paper reinforcements. It complements the resin system properties by adding high tensile strength, dimen
.. read more
A Review of Current and Future PCB Final Finishes
Printed Circuit Boards (PCBs) are essential components in modern electronics, serving as the backbone for electrical connections. The final finish of a PCB is crucial for reliable solder joi
.. read more
Applying Pre-trained Vision Transformer Models for PCB and Components Image Recognition at Scale
The iNEMI project on Artificial Intelligence (AI) Enhancement to Automated Optical Inspection (AOI) for Printed Circuit Boards Assembly (PCBA) has demonstrated the potential of AI technologi
.. read more
Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper on Laser-Induced Graphene
Flexible hybrid electronics (FHE) combine flexible substrates with traditional electronic components to create flexible circuits, which reduce form factor and increase mechanical stability.
.. read more
A Comprehensive Sustainability Comparison of Primary Metallization Processes
As sustainability becomes a top priority at companies around the globe, OEMs and Printed Circuit Board fabricators alike are turning to their supply chains to assist in quantifying their gre
.. read more
Reliability of Microvias
Interconnect Stress Testing (IST) is used to assess the reliability of microvia interfaces in printed circuit boards. To better understand the failure mechanisms, samples from different desi
.. read more
From the Corrosion to Short Circuiting in Electronics: Investigation of the Detrimental Dendrite Development
With the development of electrification and digitalization in different fields, materials in electronic function units are also expected to work under exposed climatic condition as conventio
.. read more
Enhancing Component Density in PCBs: A Study on Molded Interconnect Device Integration
The increasing demand for higher signal density and miniaturization in electronic devices has driven the use of multilayer printed circuit boards (PCBs), which stack multiple circuitry layer
.. read more
A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI Technology
This paper presents a real-time, AI-driven defect detection system designed to enhance quality control in electronic assembly, providing manufacturers with precise, customizable screening pa
.. read more
CFX Drives the Digital Strength of the Industry and Leads the New Era of Intelligent Manufacturing
Electronics assembly manufacturers, in pursuit of diverse products and sustainable development, continue to strive for efficient, energy-saving, and reliable products and solutions. Data col
.. read more
Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability in State-of-the-Art Server Technology
Artificial intelligence (AI) is driving significant growth in the server market, spurring an urgent need for innovative and efficient solutions in the production of integrated circuit substr
.. read more
Evaluating PCB Fabrication Capabilities for Compliance with SFF-TA-1002 and CEM Connector Specifications
As Input/Output (I/O) bandwidth continues to double every three years[1], the reduction in connector pitch to 0.6 mm, exemplified by SFF TA-1002 [2], imposes stringent design requirements on
.. read more
High-Performance Phase Change Metal TIMs - Part II
Phase change metal (PCM) thermal interface materials (TIMs) are low melting point metal alloys that are solid at room temperature. The melting point of PCM TIMs should be below the operation
.. read more
Copper Salt-Based Sinter Paste for Use Under Air and Pressureless Conditions
In the field of power electronics, modern components have to resist increasing thermal stress and need a higher life expectancy even under harsh conditions. Even if temperature-stable compon
.. read more
Wearable Device Friendly Light and Moisture Dual Curable Conformal Coating
Encapsulants and conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable m
.. read more
Design and Performance Study of Low Carbon Footprint Bio-based Copper Clad Laminates
Petroleum-based polymer resins are widely used in electronic base materials for their excellent insulation, heat resistance, chemical resistance, and processability. In recent years, the inc
.. read more
Thermal Profiling of Pre-heater Configurations with Added Convection to Determine Heating Effectiveness for Selective Soldering
The quality of through-hole soldering joints is determined by the percentage of solder fill within a printed circuit board (PCB) hole. Good wetting is required to achieve this via heating an
.. read more
Fatigue Evaluation of FPC under Torsional Bending for Wearable Devices
Flexible printed circuits (FPCs) are electrical substrate composed of a copper cladding laminated with an insulating material and a copper foil. Because of their favorable fatigue characteri
.. read more
Advanced Corrosion Protection for Electronics using Atomic Layer Deposition (ALD) +Parylene Multilayer Nanocoatings
The use of flexible and miniaturized electronic devices is continuously growing with the advancement of interconnect, microvia and microBGA technologies. While these advancements have offere
.. read more
Warpage mitigation, Board Assembly and Solder Joint Reliability for Antenna-in-Package Targeted for 6G applications at 92-100 GHz
A phased array Antenna-in-Package (AiP) has been developed in an applied research collaboration between several companies. The AiP is designed and manufactured using a highly integrated pack
.. read more
A Universal AI-Powered Segmentation Model for PCBA and Semi-Conductor
The integration of artificial intelligence (AI) in automated optical inspection (AOI) systems for printed circuit board assemblies (PCBAs) and semiconductors has garnered significant attenti
.. read more
Extended Analysis of Temperature Behavior of FR4 Substrates when Processing during Laser Depaneling
Laser depaneling is driven by the clear industry trend to further improve performance and thus the cost-benefit ratio with ever more powerful lasers. As a result of this development, laser p
.. read more
The Mechanism of Voiding in Resin Plugged Back-Drilled Hole
With the development of high-speed PCB, the control requirements of signal transmission for via stub are more and more strict. The back drilled metallized stub has to be controlled within th
.. read more
Plated Through Hole Via Stub Length Reduction and Control in Printed Circuit Boards
High-speed product segments, such as servers and network switches, are rapidly increasing data rate requirements in the electronics industry. With bandwidth requirements doubling every gener
.. read more
Spring-Probe Technologies for End-of-Line Test, History, Design and Latest Trends and Applications
Spring-loaded test probes for in-circuit or functional test are not new. However, with modern applications those designs have evolved a lot over the years. A traditional test probe consists
.. read more
Influence of Accurate Thermal Profiling on Reflow Process Control
A complex Printed Circuit Board (PCB), such as those in advanced electronics can house 500 to 1500 components. High-end systems like servers or telecommunications equipment can have thousand
.. read more
Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics
Corrosion issues of electronic devices under humid conditions heavily rely on the cleanliness of Printed Circuit Board Assemblies (PCBAs). Use of no-clean flux during diverse soldering techn
.. read more
Reliability and Value Proposition of Active and Passive Embedded Components in Consumer Applications
This study evaluated embedded components for use in printed circuit board assemblies to achieve miniaturization goals for wearable consumer products. Both passive and active components were
.. read more
Solder Graping Issue Analysis
A solder graping issue affected multiple units during the production process. Solder graping is a phenomenon where small, un-melted solder particles are trapped on the surface of the joint,
.. read more
Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features
The physical reliability of a printed circuit board (PCB) is often seen as more important than having the best dielectric performance. Hence, a great deal of research and development has bee
.. read more
Glass Type Comparison
Woven glass fabric has been used in PWB laminates since the 1960s as a replacement for paper reinforcements. It complements the resin system properties by adding high tensile strength, dimen
.. read more
A Review of Current and Future PCB Final Finishes
Printed Circuit Boards (PCBs) are essential components in modern electronics, serving as the backbone for electrical connections. The final finish of a PCB is crucial for reliable solder joi
.. read more
Applying Pre-trained Vision Transformer Models for PCB and Components Image Recognition at Scale
The iNEMI project on Artificial Intelligence (AI) Enhancement to Automated Optical Inspection (AOI) for Printed Circuit Boards Assembly (PCBA) has demonstrated the potential of AI technologi
.. read more
Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper on Laser-Induced Graphene
Flexible hybrid electronics (FHE) combine flexible substrates with traditional electronic components to create flexible circuits, which reduce form factor and increase mechanical stability.
.. read more
A Comprehensive Sustainability Comparison of Primary Metallization Processes
As sustainability becomes a top priority at companies around the globe, OEMs and Printed Circuit Board fabricators alike are turning to their supply chains to assist in quantifying their gre
.. read more
Reliability of Microvias
Interconnect Stress Testing (IST) is used to assess the reliability of microvia interfaces in printed circuit boards. To better understand the failure mechanisms, samples from different desi
.. read more
From the Corrosion to Short Circuiting in Electronics: Investigation of the Detrimental Dendrite Development
With the development of electrification and digitalization in different fields, materials in electronic function units are also expected to work under exposed climatic condition as conventio
.. read more
Enhancing Component Density in PCBs: A Study on Molded Interconnect Device Integration
The increasing demand for higher signal density and miniaturization in electronic devices has driven the use of multilayer printed circuit boards (PCBs), which stack multiple circuitry layer
.. read more
A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI Technology
This paper presents a real-time, AI-driven defect detection system designed to enhance quality control in electronic assembly, providing manufacturers with precise, customizable screening pa
.. read more
CFX Drives the Digital Strength of the Industry and Leads the New Era of Intelligent Manufacturing
Electronics assembly manufacturers, in pursuit of diverse products and sustainable development, continue to strive for efficient, energy-saving, and reliable products and solutions. Data col
.. read more
Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability in State-of-the-Art Server Technology
Artificial intelligence (AI) is driving significant growth in the server market, spurring an urgent need for innovative and efficient solutions in the production of integrated circuit substr
.. read more
Evaluating PCB Fabrication Capabilities for Compliance with SFF-TA-1002 and CEM Connector Specifications
As Input/Output (I/O) bandwidth continues to double every three years[1], the reduction in connector pitch to 0.6 mm, exemplified by SFF TA-1002 [2], imposes stringent design requirements on
.. read more
High-Performance Phase Change Metal TIMs - Part II
Phase change metal (PCM) thermal interface materials (TIMs) are low melting point metal alloys that are solid at room temperature. The melting point of PCM TIMs should be below the operation
.. read more
Copper Salt-Based Sinter Paste for Use Under Air and Pressureless Conditions
In the field of power electronics, modern components have to resist increasing thermal stress and need a higher life expectancy even under harsh conditions. Even if temperature-stable compon
.. read more
Wearable Device Friendly Light and Moisture Dual Curable Conformal Coating
Encapsulants and conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable m
.. read more
Design and Performance Study of Low Carbon Footprint Bio-based Copper Clad Laminates
Petroleum-based polymer resins are widely used in electronic base materials for their excellent insulation, heat resistance, chemical resistance, and processability. In recent years, the inc
.. read more
Thermal Profiling of Pre-heater Configurations with Added Convection to Determine Heating Effectiveness for Selective Soldering
The quality of through-hole soldering joints is determined by the percentage of solder fill within a printed circuit board (PCB) hole. Good wetting is required to achieve this via heating an
.. read more
Fatigue Evaluation of FPC under Torsional Bending for Wearable Devices
Flexible printed circuits (FPCs) are electrical substrate composed of a copper cladding laminated with an insulating material and a copper foil. Because of their favorable fatigue characteri
.. read more
Advanced Corrosion Protection for Electronics using Atomic Layer Deposition (ALD) +Parylene Multilayer Nanocoatings
The use of flexible and miniaturized electronic devices is continuously growing with the advancement of interconnect, microvia and microBGA technologies. While these advancements have offere
.. read more
Warpage mitigation, Board Assembly and Solder Joint Reliability for Antenna-in-Package Targeted for 6G applications at 92-100 GHz
A phased array Antenna-in-Package (AiP) has been developed in an applied research collaboration between several companies. The AiP is designed and manufactured using a highly integrated pack
.. read more
A Universal AI-Powered Segmentation Model for PCBA and Semi-Conductor
The integration of artificial intelligence (AI) in automated optical inspection (AOI) systems for printed circuit board assemblies (PCBAs) and semiconductors has garnered significant attenti
.. read more
Extended Analysis of Temperature Behavior of FR4 Substrates when Processing during Laser Depaneling
Laser depaneling is driven by the clear industry trend to further improve performance and thus the cost-benefit ratio with ever more powerful lasers. As a result of this development, laser p
.. read more
The Mechanism of Voiding in Resin Plugged Back-Drilled Hole
With the development of high-speed PCB, the control requirements of signal transmission for via stub are more and more strict. The back drilled metallized stub has to be controlled within th
.. read more
Plated Through Hole Via Stub Length Reduction and Control in Printed Circuit Boards
High-speed product segments, such as servers and network switches, are rapidly increasing data rate requirements in the electronics industry. With bandwidth requirements doubling every gener
.. read more
Spring-Probe Technologies for End-of-Line Test, History, Design and Latest Trends and Applications
Spring-loaded test probes for in-circuit or functional test are not new. However, with modern applications those designs have evolved a lot over the years. A traditional test probe consists
.. read more
Influence of Accurate Thermal Profiling on Reflow Process Control
A complex Printed Circuit Board (PCB), such as those in advanced electronics can house 500 to 1500 components. High-end systems like servers or telecommunications equipment can have thousand
.. read more