Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Electrolytic Nickel Ultra-Thin Gold Finish for PCBs
An electrolytic plate ultra-thin gold (UTG) over 2.5 to 5 microns(μ) pure nickel is an economical and environmentally friendly printed circuit board (PCB) finish, tested over 100,000M2. UTG
.. read more
Understanding PCB Failure Mechanisms under High Voltage and Condensing Conditions
Miniaturization has exacerbated the issue of electronics failure due to humidity by reducing the spacing between components, increasing the possibility of droplet bridging to create pathways
.. read more
Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
Automated optical inspection (AOI) systems are commonly applied for in-line quality control of through hole technology (THT) solder joints. However, these systems usually rely on conventiona
.. read more
Unlocking the Promise of AI in Electronic Manufacturing
Manufacturing is getting smarter, with most processes and equipment generating vast volumes of data. Dynamic electronics manufacturers are adopting innovative solutions to increase output wh
.. read more
Thermal Characterization of Top Side Contacts in Ceramic Encapsulation Material for High Power Density Applications
The ever-increasing requirements in terms of power density and reliability of power electronic modules make packaging an ever-increasing challenge. Especially when upcoming vertical gallium
.. read more
Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness
The presented research is a ground-up investigation of PCBA climatic reliability starting with an insight into surface water layer formation under humid conditions, and progressing to unders
.. read more
Novel Thermosetting Material with High Thermal Conductivity, High Insulation Reliability and Demonstration of Heat Dissipation Performance of the PCBs
Printed circuit boards (PCBs) for automotive and electrical products are becoming smaller, higher density components, and embedded component technology is progressing. Components mounted on
.. read more
Futureproof PCBA Test with a Multi-Test Approach for Reduced Takt Time
The increasing complexity of printed circuit board assemblies (PCBA) necessitates more efficient and comprehensive testing methods to meet stringent quality and production targets. This pape
.. read more
Research and Improvement of Manufacturing Difficulty in Narrow Cap of Rigid-Flex Board
By comparing the design fine milling allowance of different milling tools and the chip removal ability of milling cutters, it is concluded that the design fine milling allowance of tools is
.. read more
Study on Influencing Factors of Flexibility and Tear Resistance of Flexible Board
In addition to the requirements of good bending performance, in the specific installation process, the flexible plate also needs to have good flexibility and tear resistance to facilitate as
.. read more
Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics
Corrosion issues of electronic devices under humid conditions heavily rely on the cleanliness of Printed Circuit Board Assemblies (PCBAs). Use of no-clean flux during diverse soldering techn
.. read more
Reliability and Value Proposition of Active and Passive Embedded Components in Consumer Applications
This study evaluated embedded components for use in printed circuit board assemblies to achieve miniaturization goals for wearable consumer products. Both passive and active components were
.. read more
Solder Graping Issue Analysis
A solder graping issue affected multiple units during the production process. Solder graping is a phenomenon where small, un-melted solder particles are trapped on the surface of the joint,
.. read more
Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features
The physical reliability of a printed circuit board (PCB) is often seen as more important than having the best dielectric performance. Hence, a great deal of research and development has bee
.. read more
Glass Type Comparison
Woven glass fabric has been used in PWB laminates since the 1960s as a replacement for paper reinforcements. It complements the resin system properties by adding high tensile strength, dimen
.. read more
A Review of Current and Future PCB Final Finishes
Printed Circuit Boards (PCBs) are essential components in modern electronics, serving as the backbone for electrical connections. The final finish of a PCB is crucial for reliable solder joi
.. read more
Applying Pre-trained Vision Transformer Models for PCB and Components Image Recognition at Scale
The iNEMI project on Artificial Intelligence (AI) Enhancement to Automated Optical Inspection (AOI) for Printed Circuit Boards Assembly (PCBA) has demonstrated the potential of AI technologi
.. read more
Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper on Laser-Induced Graphene
Flexible hybrid electronics (FHE) combine flexible substrates with traditional electronic components to create flexible circuits, which reduce form factor and increase mechanical stability.
.. read more
A Comprehensive Sustainability Comparison of Primary Metallization Processes
As sustainability becomes a top priority at companies around the globe, OEMs and Printed Circuit Board fabricators alike are turning to their supply chains to assist in quantifying their gre
.. read more
Reliability of Microvias
Interconnect Stress Testing (IST) is used to assess the reliability of microvia interfaces in printed circuit boards. To better understand the failure mechanisms, samples from different desi
.. read more
From the Corrosion to Short Circuiting in Electronics: Investigation of the Detrimental Dendrite Development
With the development of electrification and digitalization in different fields, materials in electronic function units are also expected to work under exposed climatic condition as conventio
.. read more
Enhancing Component Density in PCBs: A Study on Molded Interconnect Device Integration
The increasing demand for higher signal density and miniaturization in electronic devices has driven the use of multilayer printed circuit boards (PCBs), which stack multiple circuitry layer
.. read more
A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI Technology
This paper presents a real-time, AI-driven defect detection system designed to enhance quality control in electronic assembly, providing manufacturers with precise, customizable screening pa
.. read more
CFX Drives the Digital Strength of the Industry and Leads the New Era of Intelligent Manufacturing
Electronics assembly manufacturers, in pursuit of diverse products and sustainable development, continue to strive for efficient, energy-saving, and reliable products and solutions. Data col
.. read more
Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability in State-of-the-Art Server Technology
Artificial intelligence (AI) is driving significant growth in the server market, spurring an urgent need for innovative and efficient solutions in the production of integrated circuit substr
.. read more
Evaluating PCB Fabrication Capabilities for Compliance with SFF-TA-1002 and CEM Connector Specifications
As Input/Output (I/O) bandwidth continues to double every three years[1], the reduction in connector pitch to 0.6 mm, exemplified by SFF TA-1002 [2], imposes stringent design requirements on
.. read more
High-Performance Phase Change Metal TIMs - Part II
Phase change metal (PCM) thermal interface materials (TIMs) are low melting point metal alloys that are solid at room temperature. The melting point of PCM TIMs should be below the operation
.. read more
Copper Salt-Based Sinter Paste for Use Under Air and Pressureless Conditions
In the field of power electronics, modern components have to resist increasing thermal stress and need a higher life expectancy even under harsh conditions. Even if temperature-stable compon
.. read more
Wearable Device Friendly Light and Moisture Dual Curable Conformal Coating
Encapsulants and conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable m
.. read more
Design and Performance Study of Low Carbon Footprint Bio-based Copper Clad Laminates
Petroleum-based polymer resins are widely used in electronic base materials for their excellent insulation, heat resistance, chemical resistance, and processability. In recent years, the inc
.. read more
Electrolytic Nickel Ultra-Thin Gold Finish for PCBs
An electrolytic plate ultra-thin gold (UTG) over 2.5 to 5 microns(μ) pure nickel is an economical and environmentally friendly printed circuit board (PCB) finish, tested over 100,000M2. UTG
.. read more
Understanding PCB Failure Mechanisms under High Voltage and Condensing Conditions
Miniaturization has exacerbated the issue of electronics failure due to humidity by reducing the spacing between components, increasing the possibility of droplet bridging to create pathways
.. read more
Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
Automated optical inspection (AOI) systems are commonly applied for in-line quality control of through hole technology (THT) solder joints. However, these systems usually rely on conventiona
.. read more
Unlocking the Promise of AI in Electronic Manufacturing
Manufacturing is getting smarter, with most processes and equipment generating vast volumes of data. Dynamic electronics manufacturers are adopting innovative solutions to increase output wh
.. read more
Thermal Characterization of Top Side Contacts in Ceramic Encapsulation Material for High Power Density Applications
The ever-increasing requirements in terms of power density and reliability of power electronic modules make packaging an ever-increasing challenge. Especially when upcoming vertical gallium
.. read more
Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness
The presented research is a ground-up investigation of PCBA climatic reliability starting with an insight into surface water layer formation under humid conditions, and progressing to unders
.. read more
Novel Thermosetting Material with High Thermal Conductivity, High Insulation Reliability and Demonstration of Heat Dissipation Performance of the PCBs
Printed circuit boards (PCBs) for automotive and electrical products are becoming smaller, higher density components, and embedded component technology is progressing. Components mounted on
.. read more
Futureproof PCBA Test with a Multi-Test Approach for Reduced Takt Time
The increasing complexity of printed circuit board assemblies (PCBA) necessitates more efficient and comprehensive testing methods to meet stringent quality and production targets. This pape
.. read more
Research and Improvement of Manufacturing Difficulty in Narrow Cap of Rigid-Flex Board
By comparing the design fine milling allowance of different milling tools and the chip removal ability of milling cutters, it is concluded that the design fine milling allowance of tools is
.. read more
Study on Influencing Factors of Flexibility and Tear Resistance of Flexible Board
In addition to the requirements of good bending performance, in the specific installation process, the flexible plate also needs to have good flexibility and tear resistance to facilitate as
.. read more
Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics
Corrosion issues of electronic devices under humid conditions heavily rely on the cleanliness of Printed Circuit Board Assemblies (PCBAs). Use of no-clean flux during diverse soldering techn
.. read more
Reliability and Value Proposition of Active and Passive Embedded Components in Consumer Applications
This study evaluated embedded components for use in printed circuit board assemblies to achieve miniaturization goals for wearable consumer products. Both passive and active components were
.. read more
Solder Graping Issue Analysis
A solder graping issue affected multiple units during the production process. Solder graping is a phenomenon where small, un-melted solder particles are trapped on the surface of the joint,
.. read more
Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features
The physical reliability of a printed circuit board (PCB) is often seen as more important than having the best dielectric performance. Hence, a great deal of research and development has bee
.. read more
Glass Type Comparison
Woven glass fabric has been used in PWB laminates since the 1960s as a replacement for paper reinforcements. It complements the resin system properties by adding high tensile strength, dimen
.. read more
A Review of Current and Future PCB Final Finishes
Printed Circuit Boards (PCBs) are essential components in modern electronics, serving as the backbone for electrical connections. The final finish of a PCB is crucial for reliable solder joi
.. read more
Applying Pre-trained Vision Transformer Models for PCB and Components Image Recognition at Scale
The iNEMI project on Artificial Intelligence (AI) Enhancement to Automated Optical Inspection (AOI) for Printed Circuit Boards Assembly (PCBA) has demonstrated the potential of AI technologi
.. read more
Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper on Laser-Induced Graphene
Flexible hybrid electronics (FHE) combine flexible substrates with traditional electronic components to create flexible circuits, which reduce form factor and increase mechanical stability.
.. read more
A Comprehensive Sustainability Comparison of Primary Metallization Processes
As sustainability becomes a top priority at companies around the globe, OEMs and Printed Circuit Board fabricators alike are turning to their supply chains to assist in quantifying their gre
.. read more
Reliability of Microvias
Interconnect Stress Testing (IST) is used to assess the reliability of microvia interfaces in printed circuit boards. To better understand the failure mechanisms, samples from different desi
.. read more
From the Corrosion to Short Circuiting in Electronics: Investigation of the Detrimental Dendrite Development
With the development of electrification and digitalization in different fields, materials in electronic function units are also expected to work under exposed climatic condition as conventio
.. read more
Enhancing Component Density in PCBs: A Study on Molded Interconnect Device Integration
The increasing demand for higher signal density and miniaturization in electronic devices has driven the use of multilayer printed circuit boards (PCBs), which stack multiple circuitry layer
.. read more
A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI Technology
This paper presents a real-time, AI-driven defect detection system designed to enhance quality control in electronic assembly, providing manufacturers with precise, customizable screening pa
.. read more
CFX Drives the Digital Strength of the Industry and Leads the New Era of Intelligent Manufacturing
Electronics assembly manufacturers, in pursuit of diverse products and sustainable development, continue to strive for efficient, energy-saving, and reliable products and solutions. Data col
.. read more
Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability in State-of-the-Art Server Technology
Artificial intelligence (AI) is driving significant growth in the server market, spurring an urgent need for innovative and efficient solutions in the production of integrated circuit substr
.. read more
Evaluating PCB Fabrication Capabilities for Compliance with SFF-TA-1002 and CEM Connector Specifications
As Input/Output (I/O) bandwidth continues to double every three years[1], the reduction in connector pitch to 0.6 mm, exemplified by SFF TA-1002 [2], imposes stringent design requirements on
.. read more
High-Performance Phase Change Metal TIMs - Part II
Phase change metal (PCM) thermal interface materials (TIMs) are low melting point metal alloys that are solid at room temperature. The melting point of PCM TIMs should be below the operation
.. read more
Copper Salt-Based Sinter Paste for Use Under Air and Pressureless Conditions
In the field of power electronics, modern components have to resist increasing thermal stress and need a higher life expectancy even under harsh conditions. Even if temperature-stable compon
.. read more
Wearable Device Friendly Light and Moisture Dual Curable Conformal Coating
Encapsulants and conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable m
.. read more
Design and Performance Study of Low Carbon Footprint Bio-based Copper Clad Laminates
Petroleum-based polymer resins are widely used in electronic base materials for their excellent insulation, heat resistance, chemical resistance, and processability. In recent years, the inc
.. read more