Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Optimization of Solder Paste Printing for Ultra-High-Density-Interconnect (UHDI) Applications
The trend of miniaturization of electronics requires the creation of Ultra-high-density solder joints. Semiconductor manufacturing, flip chip, package-on-package (PoP), system in package (Si
.. read more
A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within 3D CAD Environment
Our contribution concerns advances in electronics design software, achieved by linking popular Electronic Computer-Aided Design (ECAD) and full-wave electromagnetic (EM) simulations (here, w
.. read more
Best PCB Design for Manufacturing Practices to Avoid Fabrication Defects
Manufacturing defects in printed circuit boards (PCB) can significantly impact the quality, reliability, and cost. The design for manufacturing (DFM) process can help identify such errors be
.. read more
An Industry Survey to Report and Compare the Understanding of Failure Mechanisms of and Protection Measures against High Voltage Induced...
With the global progress of the electrification in the automotive world, the number of applications with high voltage is increasing, as well as the level of the voltage itself. Many companie
.. read more
Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder Paste
A novel mixed-alloy solder paste IHR, has been developed to enable low voiding in soldering processes while maintaining high-reliability (Hi-Rel) thermal cycling performance. During reflow,
.. read more
Additive Printed PCB Manufacturing for More Sustainable Electronics
The environmental impact of printed circuit boards (PCBs) is a growing concern due to the rapid increase of electronics integration in everyday life objects, resulting in a significant incre
.. read more
Capabilities and Challenges in Taking the Step from HDI to Advanced HDI
Across most, if not all electronics applications, there has been a continual drive to increase complexity while reducing size, weight and power consumption. In order to achieve this, there h
.. read more
Pure Palladium Plating for ENEPIG – How Bath Properties Impact the Process Handling and Final Finish Performance
For high reliability applications in the HDI and Package Substrate industry the electroless nickel/electroless palladium/immersion gold (ENEPIG) finish provides a reliable solderable and wir
.. read more
The Economics of Electronic Component Salvage and Reuse
The economic and environmental implications of electronic component salvage and reuse are increasingly significant in the context of rising semiconductor and artificial intelligence chip cos
.. read more
Exploring the Feasibility and Challenges of a Low-Temperature Alloy in Wave Soldering Applications
The use of low-temperature (LT) solder alloys in wave soldering applications has remained largely unutilized, despite their potential benefits in reducing energy consumption and material cos
.. read more
Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device sold
.. read more
Methods Used to Qualify Soldering and Cleaning Materials and Processes
Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean f
.. read more
3D X-ray of CTBGA228 Assembly from –105℃ to +105℃
This paper presents the 3D X-ray of fine-pitch ball grid array (FPBGA) assemblies at steps from hot to cryogenic temperatures to determine deformation behavior of the individual balls with t
.. read more
Detection of HiP of Burn-in FCBGA by Thermal Cycle
This paper presents thermal cycle reliability of a 1657 I/O flip-chip ball grid array (FCBGA1657), which is developed for high-reliability (HR) applications. It also presents the effect of i
.. read more
Conformally Coated QFN Assemblies under TC and a New HALT
This paper presents the effect of standard single- and double- thickness of polyurethane coating on various sizes of Quad Flat No-Lead (QFN) solder joint assemblies. This coating is commonly
.. read more
Large Panel Substrate and PCB Manufacturing Comparisons Between MSAP, SAP, and FAP Processing
MSAP, Modified Semi-Additive Processing and SAP, Semi-Additive Processing are used in high volume in both Substrate and PCB manufacturing. These processes were developed to limit the impact
.. read more
Influence of Cleaner Saturation on the Wash Efficiency under Bottom Terminated Components
Modern electronics use bottom-terminated components (BTC) for short interconnections and many IOs. Distances between poles are small. Based on experience, cleaning is the best option to ensu
.. read more
Evaluation on Retrieval-Augmented Generation for Engineering Document Summarization
The rapid growing availability and maturity of generative AI and associated LLMs (Large Language Model) is creating new paradigm in enterprise transformation initiatives such as smart manufa
.. read more
High Voltage Temperature-Humidity-Bias Testing of Electronic Materials on the Outer Layer of a PCB – A Round Robin Study and...
The automotive industry is currently facing new challenges resulting from the transformation of the powertrain and the development of e-Mobility solutions. In this context, a technology shif
.. read more
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. read more
Accounting for Scope 3 Category 1 Greenhouse Gas Emissions
The Global Electronics Association and the Responsible Business Alliance (RBA) have joined forces to cut through the confusion of Scope 3.1 greenhouse gas (GHG) emissions accounting. This ca
.. read more
The Software Ecosystem Powering Electronics Manufacturing
In November 2024, the Global Electronics Association surveyed EMS and OEM companies to understand the software tools driving their operations, uncovering trends in adoption, satisfaction, an
.. read more
Powering the U.S. Economy: The Economic Reach of Electronics Manufacturing
Electronics are the unseen infrastructure of our modern world. Whether it is the phone in your hand, the car you drive, the medical device that keeps you healthy, or the constellation of sat
.. read more
From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing
Mexico plays a vital role in U.S. manufacturing. The two nations share one of the world’s most deeply integrated and strategically aligned trade relationships, particularly in electronics, w
.. read more
The New Transatlantic Trade Agreement
On July 27, 2025, the European Union and United States reached a landmark agreement restructuring tariffs across the world’s largest trade and investment relationship. Most EU electronics ex
.. read more
Interconnected: Global Electronics Trade in an Age of Disruption
Electronics manufacturing is the most globally interconnected industry in the world. Trade in electronics inputs and finished goods has reached $4.5 trillion, representing more than 20% of g
.. read more
Monitoring the Pulse of the Global Electronics Industry July 2025
Persistent Cost Pressures Offset by Solid Demand Conditions: The global electronics manufacturing supply chain remains under pressure from rising input costs,with 61% of firms reporting
.. read more
How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
The use of inspection systems in production has increased as manufacturers use automated inspection technologies to capture defects in the production process. The benefits of utilizing the i
.. read more
Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
With the high power density and miniaturization of electronic products, printed circuit boards need to have more efficient thermal dissipation. In the thermal design of printed circuit board
.. read more
Optimization of Solder Paste Printing for Ultra-High-Density-Interconnect (UHDI) Applications
The trend of miniaturization of electronics requires the creation of Ultra-high-density solder joints. Semiconductor manufacturing, flip chip, package-on-package (PoP), system in package (Si
.. read more
A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within 3D CAD Environment
Our contribution concerns advances in electronics design software, achieved by linking popular Electronic Computer-Aided Design (ECAD) and full-wave electromagnetic (EM) simulations (here, w
.. read more
Best PCB Design for Manufacturing Practices to Avoid Fabrication Defects
Manufacturing defects in printed circuit boards (PCB) can significantly impact the quality, reliability, and cost. The design for manufacturing (DFM) process can help identify such errors be
.. read more
An Industry Survey to Report and Compare the Understanding of Failure Mechanisms of and Protection Measures against High Voltage Induced...
With the global progress of the electrification in the automotive world, the number of applications with high voltage is increasing, as well as the level of the voltage itself. Many companie
.. read more
Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder Paste
A novel mixed-alloy solder paste IHR, has been developed to enable low voiding in soldering processes while maintaining high-reliability (Hi-Rel) thermal cycling performance. During reflow,
.. read more
Additive Printed PCB Manufacturing for More Sustainable Electronics
The environmental impact of printed circuit boards (PCBs) is a growing concern due to the rapid increase of electronics integration in everyday life objects, resulting in a significant incre
.. read more
Capabilities and Challenges in Taking the Step from HDI to Advanced HDI
Across most, if not all electronics applications, there has been a continual drive to increase complexity while reducing size, weight and power consumption. In order to achieve this, there h
.. read more
Pure Palladium Plating for ENEPIG – How Bath Properties Impact the Process Handling and Final Finish Performance
For high reliability applications in the HDI and Package Substrate industry the electroless nickel/electroless palladium/immersion gold (ENEPIG) finish provides a reliable solderable and wir
.. read more
The Economics of Electronic Component Salvage and Reuse
The economic and environmental implications of electronic component salvage and reuse are increasingly significant in the context of rising semiconductor and artificial intelligence chip cos
.. read more
Exploring the Feasibility and Challenges of a Low-Temperature Alloy in Wave Soldering Applications
The use of low-temperature (LT) solder alloys in wave soldering applications has remained largely unutilized, despite their potential benefits in reducing energy consumption and material cos
.. read more
Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device sold
.. read more
Methods Used to Qualify Soldering and Cleaning Materials and Processes
Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean f
.. read more
3D X-ray of CTBGA228 Assembly from –105℃ to +105℃
This paper presents the 3D X-ray of fine-pitch ball grid array (FPBGA) assemblies at steps from hot to cryogenic temperatures to determine deformation behavior of the individual balls with t
.. read more
Detection of HiP of Burn-in FCBGA by Thermal Cycle
This paper presents thermal cycle reliability of a 1657 I/O flip-chip ball grid array (FCBGA1657), which is developed for high-reliability (HR) applications. It also presents the effect of i
.. read more
Conformally Coated QFN Assemblies under TC and a New HALT
This paper presents the effect of standard single- and double- thickness of polyurethane coating on various sizes of Quad Flat No-Lead (QFN) solder joint assemblies. This coating is commonly
.. read more
Large Panel Substrate and PCB Manufacturing Comparisons Between MSAP, SAP, and FAP Processing
MSAP, Modified Semi-Additive Processing and SAP, Semi-Additive Processing are used in high volume in both Substrate and PCB manufacturing. These processes were developed to limit the impact
.. read more
Influence of Cleaner Saturation on the Wash Efficiency under Bottom Terminated Components
Modern electronics use bottom-terminated components (BTC) for short interconnections and many IOs. Distances between poles are small. Based on experience, cleaning is the best option to ensu
.. read more
Evaluation on Retrieval-Augmented Generation for Engineering Document Summarization
The rapid growing availability and maturity of generative AI and associated LLMs (Large Language Model) is creating new paradigm in enterprise transformation initiatives such as smart manufa
.. read more
High Voltage Temperature-Humidity-Bias Testing of Electronic Materials on the Outer Layer of a PCB – A Round Robin Study and...
The automotive industry is currently facing new challenges resulting from the transformation of the powertrain and the development of e-Mobility solutions. In this context, a technology shif
.. read more
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. read more
Accounting for Scope 3 Category 1 Greenhouse Gas Emissions
The Global Electronics Association and the Responsible Business Alliance (RBA) have joined forces to cut through the confusion of Scope 3.1 greenhouse gas (GHG) emissions accounting. This ca
.. read more
The Software Ecosystem Powering Electronics Manufacturing
In November 2024, the Global Electronics Association surveyed EMS and OEM companies to understand the software tools driving their operations, uncovering trends in adoption, satisfaction, an
.. read more
Powering the U.S. Economy: The Economic Reach of Electronics Manufacturing
Electronics are the unseen infrastructure of our modern world. Whether it is the phone in your hand, the car you drive, the medical device that keeps you healthy, or the constellation of sat
.. read more
From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing
Mexico plays a vital role in U.S. manufacturing. The two nations share one of the world’s most deeply integrated and strategically aligned trade relationships, particularly in electronics, w
.. read more
The New Transatlantic Trade Agreement
On July 27, 2025, the European Union and United States reached a landmark agreement restructuring tariffs across the world’s largest trade and investment relationship. Most EU electronics ex
.. read more
Interconnected: Global Electronics Trade in an Age of Disruption
Electronics manufacturing is the most globally interconnected industry in the world. Trade in electronics inputs and finished goods has reached $4.5 trillion, representing more than 20% of g
.. read more
Monitoring the Pulse of the Global Electronics Industry July 2025
Persistent Cost Pressures Offset by Solid Demand Conditions: The global electronics manufacturing supply chain remains under pressure from rising input costs,with 61% of firms reporting
.. read more
How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
The use of inspection systems in production has increased as manufacturers use automated inspection technologies to capture defects in the production process. The benefits of utilizing the i
.. read more
Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
With the high power density and miniaturization of electronic products, printed circuit boards need to have more efficient thermal dissipation. In the thermal design of printed circuit board
.. read more