Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Thermal Profiling of Pre-heater Configurations with Added Convection to Determine Heating Effectiveness for Selective Soldering
The quality of through-hole soldering joints is determined by the percentage of solder fill within a printed circuit board (PCB) hole. Good wetting is required to achieve this via heating an
.. read more
Fatigue Evaluation of FPC under Torsional Bending for Wearable Devices
Flexible printed circuits (FPCs) are electrical substrate composed of a copper cladding laminated with an insulating material and a copper foil. Because of their favorable fatigue characteri
.. read more
Advanced Corrosion Protection for Electronics using Atomic Layer Deposition (ALD) +Parylene Multilayer Nanocoatings
The use of flexible and miniaturized electronic devices is continuously growing with the advancement of interconnect, microvia and microBGA technologies. While these advancements have offere
.. read more
Warpage mitigation, Board Assembly and Solder Joint Reliability for Antenna-in-Package Targeted for 6G applications at 92-100 GHz
A phased array Antenna-in-Package (AiP) has been developed in an applied research collaboration between several companies. The AiP is designed and manufactured using a highly integrated pack
.. read more
A Universal AI-Powered Segmentation Model for PCBA and Semi-Conductor
The integration of artificial intelligence (AI) in automated optical inspection (AOI) systems for printed circuit board assemblies (PCBAs) and semiconductors has garnered significant attenti
.. read more
Extended Analysis of Temperature Behavior of FR4 Substrates when Processing during Laser Depaneling
Laser depaneling is driven by the clear industry trend to further improve performance and thus the cost-benefit ratio with ever more powerful lasers. As a result of this development, laser p
.. read more
The Mechanism of Voiding in Resin Plugged Back-Drilled Hole
With the development of high-speed PCB, the control requirements of signal transmission for via stub are more and more strict. The back drilled metallized stub has to be controlled within th
.. read more
Plated Through Hole Via Stub Length Reduction and Control in Printed Circuit Boards
High-speed product segments, such as servers and network switches, are rapidly increasing data rate requirements in the electronics industry. With bandwidth requirements doubling every gener
.. read more
Spring-Probe Technologies for End-of-Line Test, History, Design and Latest Trends and Applications
Spring-loaded test probes for in-circuit or functional test are not new. However, with modern applications those designs have evolved a lot over the years. A traditional test probe consists
.. read more
Influence of Accurate Thermal Profiling on Reflow Process Control
A complex Printed Circuit Board (PCB), such as those in advanced electronics can house 500 to 1500 components. High-end systems like servers or telecommunications equipment can have thousand
.. read more
Optimization of Solder Paste Printing for Ultra-High-Density-Interconnect (UHDI) Applications
The trend of miniaturization of electronics requires the creation of Ultra-high-density solder joints. Semiconductor manufacturing, flip chip, package-on-package (PoP), system in package (Si
.. read more
A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within 3D CAD Environment
Our contribution concerns advances in electronics design software, achieved by linking popular Electronic Computer-Aided Design (ECAD) and full-wave electromagnetic (EM) simulations (here, w
.. read more
Best PCB Design for Manufacturing Practices to Avoid Fabrication Defects
Manufacturing defects in printed circuit boards (PCB) can significantly impact the quality, reliability, and cost. The design for manufacturing (DFM) process can help identify such errors be
.. read more
An Industry Survey to Report and Compare the Understanding of Failure Mechanisms of and Protection Measures against High Voltage Induced...
With the global progress of the electrification in the automotive world, the number of applications with high voltage is increasing, as well as the level of the voltage itself. Many companie
.. read more
Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder Paste
A novel mixed-alloy solder paste IHR, has been developed to enable low voiding in soldering processes while maintaining high-reliability (Hi-Rel) thermal cycling performance. During reflow,
.. read more
Additive Printed PCB Manufacturing for More Sustainable Electronics
The environmental impact of printed circuit boards (PCBs) is a growing concern due to the rapid increase of electronics integration in everyday life objects, resulting in a significant incre
.. read more
Capabilities and Challenges in Taking the Step from HDI to Advanced HDI
Across most, if not all electronics applications, there has been a continual drive to increase complexity while reducing size, weight and power consumption. In order to achieve this, there h
.. read more
Pure Palladium Plating for ENEPIG – How Bath Properties Impact the Process Handling and Final Finish Performance
For high reliability applications in the HDI and Package Substrate industry the electroless nickel/electroless palladium/immersion gold (ENEPIG) finish provides a reliable solderable and wir
.. read more
The Economics of Electronic Component Salvage and Reuse
The economic and environmental implications of electronic component salvage and reuse are increasingly significant in the context of rising semiconductor and artificial intelligence chip cos
.. read more
Exploring the Feasibility and Challenges of a Low-Temperature Alloy in Wave Soldering Applications
The use of low-temperature (LT) solder alloys in wave soldering applications has remained largely unutilized, despite their potential benefits in reducing energy consumption and material cos
.. read more
Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device sold
.. read more
Methods Used to Qualify Soldering and Cleaning Materials and Processes
Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean f
.. read more
3D X-ray of CTBGA228 Assembly from –105℃ to +105℃
This paper presents the 3D X-ray of fine-pitch ball grid array (FPBGA) assemblies at steps from hot to cryogenic temperatures to determine deformation behavior of the individual balls with t
.. read more
Detection of HiP of Burn-in FCBGA by Thermal Cycle
This paper presents thermal cycle reliability of a 1657 I/O flip-chip ball grid array (FCBGA1657), which is developed for high-reliability (HR) applications. It also presents the effect of i
.. read more
Conformally Coated QFN Assemblies under TC and a New HALT
This paper presents the effect of standard single- and double- thickness of polyurethane coating on various sizes of Quad Flat No-Lead (QFN) solder joint assemblies. This coating is commonly
.. read more
Large Panel Substrate and PCB Manufacturing Comparisons Between MSAP, SAP, and FAP Processing
MSAP, Modified Semi-Additive Processing and SAP, Semi-Additive Processing are used in high volume in both Substrate and PCB manufacturing. These processes were developed to limit the impact
.. read more
Influence of Cleaner Saturation on the Wash Efficiency under Bottom Terminated Components
Modern electronics use bottom-terminated components (BTC) for short interconnections and many IOs. Distances between poles are small. Based on experience, cleaning is the best option to ensu
.. read more
Evaluation on Retrieval-Augmented Generation for Engineering Document Summarization
The rapid growing availability and maturity of generative AI and associated LLMs (Large Language Model) is creating new paradigm in enterprise transformation initiatives such as smart manufa
.. read more
High Voltage Temperature-Humidity-Bias Testing of Electronic Materials on the Outer Layer of a PCB – A Round Robin Study and...
The automotive industry is currently facing new challenges resulting from the transformation of the powertrain and the development of e-Mobility solutions. In this context, a technology shif
.. read more
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. read more
Thermal Profiling of Pre-heater Configurations with Added Convection to Determine Heating Effectiveness for Selective Soldering
The quality of through-hole soldering joints is determined by the percentage of solder fill within a printed circuit board (PCB) hole. Good wetting is required to achieve this via heating an
.. read more
Fatigue Evaluation of FPC under Torsional Bending for Wearable Devices
Flexible printed circuits (FPCs) are electrical substrate composed of a copper cladding laminated with an insulating material and a copper foil. Because of their favorable fatigue characteri
.. read more
Advanced Corrosion Protection for Electronics using Atomic Layer Deposition (ALD) +Parylene Multilayer Nanocoatings
The use of flexible and miniaturized electronic devices is continuously growing with the advancement of interconnect, microvia and microBGA technologies. While these advancements have offere
.. read more
Warpage mitigation, Board Assembly and Solder Joint Reliability for Antenna-in-Package Targeted for 6G applications at 92-100 GHz
A phased array Antenna-in-Package (AiP) has been developed in an applied research collaboration between several companies. The AiP is designed and manufactured using a highly integrated pack
.. read more
A Universal AI-Powered Segmentation Model for PCBA and Semi-Conductor
The integration of artificial intelligence (AI) in automated optical inspection (AOI) systems for printed circuit board assemblies (PCBAs) and semiconductors has garnered significant attenti
.. read more
Extended Analysis of Temperature Behavior of FR4 Substrates when Processing during Laser Depaneling
Laser depaneling is driven by the clear industry trend to further improve performance and thus the cost-benefit ratio with ever more powerful lasers. As a result of this development, laser p
.. read more
The Mechanism of Voiding in Resin Plugged Back-Drilled Hole
With the development of high-speed PCB, the control requirements of signal transmission for via stub are more and more strict. The back drilled metallized stub has to be controlled within th
.. read more
Plated Through Hole Via Stub Length Reduction and Control in Printed Circuit Boards
High-speed product segments, such as servers and network switches, are rapidly increasing data rate requirements in the electronics industry. With bandwidth requirements doubling every gener
.. read more
Spring-Probe Technologies for End-of-Line Test, History, Design and Latest Trends and Applications
Spring-loaded test probes for in-circuit or functional test are not new. However, with modern applications those designs have evolved a lot over the years. A traditional test probe consists
.. read more
Influence of Accurate Thermal Profiling on Reflow Process Control
A complex Printed Circuit Board (PCB), such as those in advanced electronics can house 500 to 1500 components. High-end systems like servers or telecommunications equipment can have thousand
.. read more
Optimization of Solder Paste Printing for Ultra-High-Density-Interconnect (UHDI) Applications
The trend of miniaturization of electronics requires the creation of Ultra-high-density solder joints. Semiconductor manufacturing, flip chip, package-on-package (PoP), system in package (Si
.. read more
A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within 3D CAD Environment
Our contribution concerns advances in electronics design software, achieved by linking popular Electronic Computer-Aided Design (ECAD) and full-wave electromagnetic (EM) simulations (here, w
.. read more
Best PCB Design for Manufacturing Practices to Avoid Fabrication Defects
Manufacturing defects in printed circuit boards (PCB) can significantly impact the quality, reliability, and cost. The design for manufacturing (DFM) process can help identify such errors be
.. read more
An Industry Survey to Report and Compare the Understanding of Failure Mechanisms of and Protection Measures against High Voltage Induced...
With the global progress of the electrification in the automotive world, the number of applications with high voltage is increasing, as well as the level of the voltage itself. Many companie
.. read more
Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder Paste
A novel mixed-alloy solder paste IHR, has been developed to enable low voiding in soldering processes while maintaining high-reliability (Hi-Rel) thermal cycling performance. During reflow,
.. read more
Additive Printed PCB Manufacturing for More Sustainable Electronics
The environmental impact of printed circuit boards (PCBs) is a growing concern due to the rapid increase of electronics integration in everyday life objects, resulting in a significant incre
.. read more
Capabilities and Challenges in Taking the Step from HDI to Advanced HDI
Across most, if not all electronics applications, there has been a continual drive to increase complexity while reducing size, weight and power consumption. In order to achieve this, there h
.. read more
Pure Palladium Plating for ENEPIG – How Bath Properties Impact the Process Handling and Final Finish Performance
For high reliability applications in the HDI and Package Substrate industry the electroless nickel/electroless palladium/immersion gold (ENEPIG) finish provides a reliable solderable and wir
.. read more
The Economics of Electronic Component Salvage and Reuse
The economic and environmental implications of electronic component salvage and reuse are increasingly significant in the context of rising semiconductor and artificial intelligence chip cos
.. read more
Exploring the Feasibility and Challenges of a Low-Temperature Alloy in Wave Soldering Applications
The use of low-temperature (LT) solder alloys in wave soldering applications has remained largely unutilized, despite their potential benefits in reducing energy consumption and material cos
.. read more
Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device sold
.. read more
Methods Used to Qualify Soldering and Cleaning Materials and Processes
Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean f
.. read more
3D X-ray of CTBGA228 Assembly from –105℃ to +105℃
This paper presents the 3D X-ray of fine-pitch ball grid array (FPBGA) assemblies at steps from hot to cryogenic temperatures to determine deformation behavior of the individual balls with t
.. read more
Detection of HiP of Burn-in FCBGA by Thermal Cycle
This paper presents thermal cycle reliability of a 1657 I/O flip-chip ball grid array (FCBGA1657), which is developed for high-reliability (HR) applications. It also presents the effect of i
.. read more
Conformally Coated QFN Assemblies under TC and a New HALT
This paper presents the effect of standard single- and double- thickness of polyurethane coating on various sizes of Quad Flat No-Lead (QFN) solder joint assemblies. This coating is commonly
.. read more
Large Panel Substrate and PCB Manufacturing Comparisons Between MSAP, SAP, and FAP Processing
MSAP, Modified Semi-Additive Processing and SAP, Semi-Additive Processing are used in high volume in both Substrate and PCB manufacturing. These processes were developed to limit the impact
.. read more
Influence of Cleaner Saturation on the Wash Efficiency under Bottom Terminated Components
Modern electronics use bottom-terminated components (BTC) for short interconnections and many IOs. Distances between poles are small. Based on experience, cleaning is the best option to ensu
.. read more
Evaluation on Retrieval-Augmented Generation for Engineering Document Summarization
The rapid growing availability and maturity of generative AI and associated LLMs (Large Language Model) is creating new paradigm in enterprise transformation initiatives such as smart manufa
.. read more
High Voltage Temperature-Humidity-Bias Testing of Electronic Materials on the Outer Layer of a PCB – A Round Robin Study and...
The automotive industry is currently facing new challenges resulting from the transformation of the powertrain and the development of e-Mobility solutions. In this context, a technology shif
.. read more
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. read more