Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Moving Towards Failure-free and Higher Efficient PCB Depaneling Methods with Laser Technology
Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin
.. read more
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. read more
Solvent Free Copper Extraction
Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To
.. read more
Enabling KCN-Free Stabilization for Mixed Reaction Gold Electrolytes
In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold
.. read more
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. read more
Advanced Processes for Improving Performance of Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) combines additive and subtractive manufacturing methods to fully fabricate Printed Circuit Structures (PCS). Harnessing the flexibility of additive methods
.. read more
TCT and Cross Section Analysis of Combined Alloy and Flux Approach Towards Cost-Effective, High Reliable Solder Joints for Automotive Applications
High reliable lead-free alloys are suitable for high operating temperatures and longer temperature-cycling time. The Innolot alloy,for example, is based on the tin-silver-copper (SAC) metall
.. read more
Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications
When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re
.. read more
Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more
Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. read more
Novel Automatic Repair of Populated PCBs in a Cost-Effective and Adaptive Way
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of th
.. read more
Non-Destructive BGA Rework Using Infrared Heating Technology
During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r
.. read more
Quality Assurance for Advanced Packaging Prototyping: Solder Paste Behavior as Key Monitoring Parameter
Highly reliable and high-yield prototyping in the early stages of development is crucial for innovations in next generation microelectronic systems to demonstrate the results of research. Th
.. read more
QFN Thermal Pad Design for Void Minimization
Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation.
The larg
.. read more
A Novel Copper Via Filling Electrolyte for Plating on IC Substrates
The Semi-Additive Process (SAP) is a standard process to enable very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and
.. read more
Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. read more
Reassessing Surface Finish Performance for Next Generation Technology
PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti
.. read more
A High Thermal Performance Die Attaching Paste based on Hybrid Pressure-less Silver Sintering Technology for Aerospace Application
Aerospace and defense applications present unique challenges for material suppliers. As increasingly adoption of wide bandgap semiconductor materials and advanced diverse accessible heteroge
.. read more
Failure Characteristics of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness
The rapid change to and steep rise of electric vehicles (EV) results in many challenges for the design, manufacturing, testing, and the understanding of reliability and robustness for printe
.. read more
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. read more
Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. read more
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. read more
Photonic Soldering of Wafer-level Chip-scale Packaged Components on Polyethylene Terephthalate Flex Board
Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. Candidate materials that meet these
.. read more
Gold Brush Plating Rework of Power Logic Circuit Card Assembly in an Aerospace Electronic Application
Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). The localized rep
.. read more
iNEMI General Purpose Flowers of Sulfur Corrosion Chamber
The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive
.. read more
Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns
Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of
.. read more
Electronic Board Defect Classification and Detection with Deep Learning
Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im
.. read more
Beyond The Hype -The Digital Twin Demystified
Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company
.. read more
Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers
As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin
.. read more
Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. read more
Moving Towards Failure-free and Higher Efficient PCB Depaneling Methods with Laser Technology
Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin
.. read more
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. read more
Solvent Free Copper Extraction
Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To
.. read more
Enabling KCN-Free Stabilization for Mixed Reaction Gold Electrolytes
In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold
.. read more
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. read more
Advanced Processes for Improving Performance of Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) combines additive and subtractive manufacturing methods to fully fabricate Printed Circuit Structures (PCS). Harnessing the flexibility of additive methods
.. read more
TCT and Cross Section Analysis of Combined Alloy and Flux Approach Towards Cost-Effective, High Reliable Solder Joints for Automotive Applications
High reliable lead-free alloys are suitable for high operating temperatures and longer temperature-cycling time. The Innolot alloy,for example, is based on the tin-silver-copper (SAC) metall
.. read more
Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications
When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re
.. read more
Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more
Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. read more
Novel Automatic Repair of Populated PCBs in a Cost-Effective and Adaptive Way
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of th
.. read more
Non-Destructive BGA Rework Using Infrared Heating Technology
During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r
.. read more
Quality Assurance for Advanced Packaging Prototyping: Solder Paste Behavior as Key Monitoring Parameter
Highly reliable and high-yield prototyping in the early stages of development is crucial for innovations in next generation microelectronic systems to demonstrate the results of research. Th
.. read more
QFN Thermal Pad Design for Void Minimization
Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation.
The larg
.. read more
A Novel Copper Via Filling Electrolyte for Plating on IC Substrates
The Semi-Additive Process (SAP) is a standard process to enable very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and
.. read more
Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. read more
Reassessing Surface Finish Performance for Next Generation Technology
PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti
.. read more
A High Thermal Performance Die Attaching Paste based on Hybrid Pressure-less Silver Sintering Technology for Aerospace Application
Aerospace and defense applications present unique challenges for material suppliers. As increasingly adoption of wide bandgap semiconductor materials and advanced diverse accessible heteroge
.. read more
Failure Characteristics of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness
The rapid change to and steep rise of electric vehicles (EV) results in many challenges for the design, manufacturing, testing, and the understanding of reliability and robustness for printe
.. read more
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. read more
Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. read more
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. read more
Photonic Soldering of Wafer-level Chip-scale Packaged Components on Polyethylene Terephthalate Flex Board
Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. Candidate materials that meet these
.. read more
Gold Brush Plating Rework of Power Logic Circuit Card Assembly in an Aerospace Electronic Application
Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). The localized rep
.. read more
iNEMI General Purpose Flowers of Sulfur Corrosion Chamber
The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive
.. read more
Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns
Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of
.. read more
Electronic Board Defect Classification and Detection with Deep Learning
Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im
.. read more
Beyond The Hype -The Digital Twin Demystified
Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company
.. read more
Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers
As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin
.. read more
Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. read more