Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Electronic Textile Evaluation Methods for Product Engineers and Designers
On December 14, 2022, Madison Maxey, founder and technical lead of Loomia, shared highlights of her IPC APEX EXPO 2023 professional development course. The course provided a primer for elect
.. read more
Gold-Aluminum Wire Bonding Process, Quality and Reliability
This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad,
.. read more
Wired for Change: Electronics Industry Sentiment on Sustainability
In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a
.. read more
NAVIGATING E-MOBILITY SUSTAINABILITY: EVOLVING COMPLIANCE AND ESG REQUIREMENTS FOR ELECTRONICS SUPPLIERS
This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background abou
.. read more
Unlocking AI for Automated Optical Inspection
Artificial intelligence (AI) is the theory and development of computer systems able to perform tasks that normally require human intelligence. This includes visual perception and pattern rec
.. read more
Why Double Materiality Assessments Matter: Compliance and Competitive Advantage
IPC International, Inc. recognizes the challenges and opportunities facing companies in the electronics industry in the evolving practice of sustainability, most notably, the obligations est
.. read more
AI-BASED DATA CENTERS FOR THE UNITED STATES
As the United States turns to generative artificial intelligence (AI) to drive a wide range of manufacturing applications, it is critical to ensure the strength of assembly capabilities to r
.. read more
ADVANCED PACKAGING TO BOARD LEVEL INTEGRATION – NEEDS AND CHALLENGES
HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with ex
.. read more
BUILDING ELECTRONICS BETTER: A PLAN TO ADDRESS THE WORKFORCE CHALLENGES FACING THE ELECTRONICS MANUFACTURING INDUSTRY
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. read more
BETTER ELECTRONICS BY DESIGN: NEXT GENERATION DESIGN NEEDS
In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skille
.. read more
Complex Integrated Systems - The Future of Electronics Manufacturing
Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best soluti
.. read more
OUTLOOK FOR DATA ANALYTICS IN THE ELECTRONICS MANUFACTURING INDUSTRY
The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status qu
.. read more
ELECTRONIC DESIGN AND MANUFACTURING SUSTAINABILITY
Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being
.. read more
MAXIMIZING RETURNS: THE ROI OF TRAINING IN ELECTRONICS MANUFACTURING
The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training prog
.. read more
Workforce Whitepaper
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. read more
Private Wireless Networks for Digital Transformation of Manufacturing
To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real
.. read more
Raising the Level of Supply Chain Trust for the Future Factory
Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. However, little progress has been mad
.. read more
A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
Prediction of Drop Impact Reliability for Electronics Using Finite Element Analyses
This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit
.. read more
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation
Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d
.. read more
CPH – The Hidden Loss
The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de
.. read more
Synchronizing the Stencil Printing Process for Successful Central Database Recipe Control
This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more
.. read more
Line Controller as Collaborative Agent to Orchestrate Processes and Taking Automation to the Next Level
SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
Low Outgassing and Ionic Content, High-Performance Light and Moisture Dual Curable Conformal Coating
Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable conforma
.. read more
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more
Electronic Textile Evaluation Methods for Product Engineers and Designers
On December 14, 2022, Madison Maxey, founder and technical lead of Loomia, shared highlights of her IPC APEX EXPO 2023 professional development course. The course provided a primer for elect
.. read more
Gold-Aluminum Wire Bonding Process, Quality and Reliability
This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad,
.. read more
Wired for Change: Electronics Industry Sentiment on Sustainability
In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a
.. read more
NAVIGATING E-MOBILITY SUSTAINABILITY: EVOLVING COMPLIANCE AND ESG REQUIREMENTS FOR ELECTRONICS SUPPLIERS
This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background abou
.. read more
Unlocking AI for Automated Optical Inspection
Artificial intelligence (AI) is the theory and development of computer systems able to perform tasks that normally require human intelligence. This includes visual perception and pattern rec
.. read more
Why Double Materiality Assessments Matter: Compliance and Competitive Advantage
IPC International, Inc. recognizes the challenges and opportunities facing companies in the electronics industry in the evolving practice of sustainability, most notably, the obligations est
.. read more
AI-BASED DATA CENTERS FOR THE UNITED STATES
As the United States turns to generative artificial intelligence (AI) to drive a wide range of manufacturing applications, it is critical to ensure the strength of assembly capabilities to r
.. read more
ADVANCED PACKAGING TO BOARD LEVEL INTEGRATION – NEEDS AND CHALLENGES
HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with ex
.. read more
BUILDING ELECTRONICS BETTER: A PLAN TO ADDRESS THE WORKFORCE CHALLENGES FACING THE ELECTRONICS MANUFACTURING INDUSTRY
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. read more
BETTER ELECTRONICS BY DESIGN: NEXT GENERATION DESIGN NEEDS
In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skille
.. read more
Complex Integrated Systems - The Future of Electronics Manufacturing
Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best soluti
.. read more
OUTLOOK FOR DATA ANALYTICS IN THE ELECTRONICS MANUFACTURING INDUSTRY
The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status qu
.. read more
ELECTRONIC DESIGN AND MANUFACTURING SUSTAINABILITY
Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being
.. read more
MAXIMIZING RETURNS: THE ROI OF TRAINING IN ELECTRONICS MANUFACTURING
The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training prog
.. read more
Workforce Whitepaper
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. read more
Private Wireless Networks for Digital Transformation of Manufacturing
To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real
.. read more
Raising the Level of Supply Chain Trust for the Future Factory
Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. However, little progress has been mad
.. read more
A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
Prediction of Drop Impact Reliability for Electronics Using Finite Element Analyses
This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit
.. read more
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation
Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d
.. read more
CPH – The Hidden Loss
The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de
.. read more
Synchronizing the Stencil Printing Process for Successful Central Database Recipe Control
This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more
.. read more
Line Controller as Collaborative Agent to Orchestrate Processes and Taking Automation to the Next Level
SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
Low Outgassing and Ionic Content, High-Performance Light and Moisture Dual Curable Conformal Coating
Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable conforma
.. read more
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more