Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Energy Consumption Reduction Using Low-Temperature Solder Alloys
There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Challenge: Sourcing ELIC Substrates in the U.S.
Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi
.. read more
Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. read more
Selectively Assembling High Value Components Based on Warpage in Order to Improve Reliability
Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u
.. read more
Real-time X-ray Video Imaging of Pb-Free Solders Under Simulated SMT Reflow
Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical s
.. read more
Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. read more
Security, Data Archiving and CI/CD for Quality Inspection in Manufacturing Using Edge Computing
In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has succe
.. read more
An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. read more
High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. read more
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and
.. read more
Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. read more
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. read more
Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)
The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges
.. read more
Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. read more
Development of Low Loss Adhesive Film for Multilayer PTFE Substrate
Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising
.. read more
Hybrid Adhesion Enhancement Systems and its Quality Control for Low Loss PCB Inner Layer Bonding
The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment indu
.. read more
A Microvia Damage Model
An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy
.. read more
High Resolution Physical Analyses of Microvia - Target Pad Interfaces
Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal
.. read more
Soft and Pliable Circuit Boards Made with a Novel Thermoset Polymer
The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p
.. read more
Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs
Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with C
.. read more
Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling
The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s
.. read more
Moving Towards Failure-free and Higher Efficient PCB Depaneling Methods with Laser Technology
Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin
.. read more
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. read more
Solvent Free Copper Extraction
Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To
.. read more
Enabling KCN-Free Stabilization for Mixed Reaction Gold Electrolytes
In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold
.. read more
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. read more
Energy Consumption Reduction Using Low-Temperature Solder Alloys
There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Challenge: Sourcing ELIC Substrates in the U.S.
Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi
.. read more
Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. read more
Selectively Assembling High Value Components Based on Warpage in Order to Improve Reliability
Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u
.. read more
Real-time X-ray Video Imaging of Pb-Free Solders Under Simulated SMT Reflow
Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical s
.. read more
Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. read more
Security, Data Archiving and CI/CD for Quality Inspection in Manufacturing Using Edge Computing
In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has succe
.. read more
An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. read more
High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. read more
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and
.. read more
Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. read more
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. read more
Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)
The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges
.. read more
Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. read more
Development of Low Loss Adhesive Film for Multilayer PTFE Substrate
Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising
.. read more
Hybrid Adhesion Enhancement Systems and its Quality Control for Low Loss PCB Inner Layer Bonding
The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment indu
.. read more
A Microvia Damage Model
An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy
.. read more
High Resolution Physical Analyses of Microvia - Target Pad Interfaces
Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal
.. read more
Soft and Pliable Circuit Boards Made with a Novel Thermoset Polymer
The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p
.. read more
Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs
Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with C
.. read more
Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling
The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s
.. read more
Moving Towards Failure-free and Higher Efficient PCB Depaneling Methods with Laser Technology
Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin
.. read more
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. read more
Solvent Free Copper Extraction
Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To
.. read more
Enabling KCN-Free Stabilization for Mixed Reaction Gold Electrolytes
In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold
.. read more
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. read more