Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
A Comparison of Registration Errors Amongst Suppliers of Printed Circuit boards
Misregistration of holes is the maximum amount of variation between the centerlines of all terminal pads within one plated through hole in a printed circuit board. The impacts of misregistratio
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Event
IPC APEX EXPO 2018
SLP+
As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be
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Event
IPC APEX EXPO 2018
Embedded Inductors with Laser Machined Gap
This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. Design calculations are presented for a test coupon of
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Event
IPC APEX EXPO 2018
Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board
Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa
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Event
IPC APEX EXPO 2018
Thermo-mechanical Characterization of Next Generation Substrate Like Printed Circuit Board (SLP) Materials
Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material
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Event
IPC APEX EXPO 2018
Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
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Event
IPC APEX EXPO 2018
Investigating the Influence of Corner Radius within Rectangular Aperture Designs
The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology
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Event
IPC APEX EXPO 2018
Stencil Nano-Coatings - Do They Improve Repeatability and Uniformity in the Print Process
Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo
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Event
IPC APEX EXPO 2018
RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
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Event
IPC APEX EXPO 2018
Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e
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Event
IPC APEX EXPO 2018
Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
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Event
IPC APEX EXPO 2018
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
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Event
IPC APEX EXPO 2018
Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
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Event
IPC APEX EXPO 2018
Hybrid S-Parameters Behavior of Weak and Strong Edge-Coupled Differential Lines on PCBs
Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S
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Event
IPC APEX EXPO 2018
Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils
Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou
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Event
IPC APEX EXPO 2018
Study and Recommendation for Increasing PCB Surface Finish Shelf Life
Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting
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Event
IPC APEX EXPO 2018
Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
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Event
IPC APEX EXPO 2018
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN
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Event
IPC APEX EXPO 2018
Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
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Event
IPC APEX EXPO 2018
Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
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Event
IPC APEX EXPO 2018
X-ray Inspection of Radiation Sensitive Devices Recommended Best Practices for Preprogramed Managed NAND
Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def
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Event
IPC APEX EXPO 2018
Electric Field Control - EOS Mystery Solved
A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo
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Event
IPC APEX EXPO 2018
PCBA Redesigns Done in the Right Way
Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life
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Event
IPC APEX EXPO 2018
Improved Interoperability Between MCAD and ECAD Design Tools
During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be
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Event
IPC APEX EXPO 2018
Library Management for an Ever-Evolving Diverse EDA Tool Industry
Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and
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Event
IPC APEX EXPO 2018
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
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Event
IPC APEX EXPO 2018
Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes
In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi
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Event
IPC APEX EXPO 2018
Water Resistant,Sprayable and Dippable Nano-Coatings for Printed Circuit Assemblies
The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res
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Event
IPC APEX EXPO 2018
Development of a High Temperature Protective Coating to Enable Organic Printed Circuit Boards to Operate at Higher Temperatures
Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co
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Event
IPC APEX EXPO 2018
Analyzing a Printed Circuit Board Weave Exposure Condition and its Effects on Printed Wiring Assembly Functional Performance
Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe
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Event
IPC APEX EXPO 2018
Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
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Event
IPC APEX EXPO 2018
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
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Event
IPC APEX EXPO 2018
Zero-Fault Production in Soldering Processes: Quality Management Based on Quality Assurance
A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r
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Event
IPC APEX EXPO 2018
Advanced Non-Pressure Silver Sinter Process by Infrared
In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de
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Event
IPC APEX EXPO 2018
Investigation of the Assembly Process of m03015 and a Brief Look at m0201 Components
Components are still shrinking in the SMT world and the next evolution of the passive components are the m03015 (009005) and m0201 (008004). Today it is seen that the 01005 component is still r
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Event
IPC APEX EXPO 2018
Volume Repeatability for Non-Contact Jet Printing of Solder Paste
Solder paste is one of the most common materials used in surface mount technology (SMT) processes. Typical methods for applying solder paste to devices are needle dispensing or screen printing,
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Event
IPC APEX EXPO 2018
Implementing Two-Component Conformal Coatings into Production
Conformal coating formulators are developing two-component solutions that improve protection,adhesion,and cure speed. Multi-component coatings are not new to the industry. Some of the oldest co
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Event
IPC APEX EXPO 2018
Innovative Plasmacoatings for High Volume Conformal Coating of Electronics
Plasma is considered to be the 4th state of matter. Decomposed molecules interact with all exposed surfaces of the material,even the inner surfaces of open cell structures. In low pressure plas
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Event
IPC APEX EXPO 2018
Comparison of Finite Elements Based Thermal Shock Test Reliability Assessment with a Specimen Based Test Approach
When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task.
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Event
IPC APEX EXPO 2018
Enhancing Printed Circuit Board Layout Using Thermo-Mechanical Analysis
The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse
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Event
IPC APEX EXPO 2018
Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing
Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled,defects can be produced,which may no
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Event
IPC APEX EXPO 2017
Optimization of Stencil Apertures to Compensate for Scooping During Printing
This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d
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Event
IPC APEX EXPO 2017
Advanced Flexible Substrate Technology for Improved Accuracy,Definition,and Conductivity of Screen Printed Conductors
One of the major concerns with screen printing of low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the overwhelming spread of the paste bey
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Event
IPC APEX EXPO 2017
Screen Making for Printed Electronics - Specification and Tolerancing
Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known
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Event
IPC APEX EXPO 2017
Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates
Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve
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Event
IPC APEX EXPO 2017
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
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Event
IPC APEX EXPO 2017
Flowers of Sulfur Creep Corrosion Testing of Populated Printed Circuit Boards
Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch
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Event
IPC APEX EXPO 2017
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
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Event
IPC APEX EXPO 2017
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may
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Event
IPC APEX EXPO 2017
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
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Event
IPC APEX EXPO 2017