Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Emerging Supply Chain Cybersecurity Requirements, Government Acronyms, and Actual Security
Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC
.. read more
IPC-1791, Cybersecurity Maturity Model Certification (CMMC), and the Printed Circuit Board Design, Fabrication, and Assembly Industry
This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the Unit
.. read more
CyberSecurity Concerns for the Printed Circuit Board Industry
This slide show discusses the cybersecurity risks associated with network integration. The supply chain is the most vulnerable, especially sub suppliers. A particular risk is whe
.. read more
Present Company Not Excluded – New Cybersecurity Regulations Will Affect Your Business (and make it safer)
Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual
.. read more
Circuit Board Security Vulnerabilities and Counteractions
Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. To demonstrate their vulnerability, a circuit
.. read more
DoD Cybersecurity: Where We Are Now and What Needs to Be Done to Be Compliant
This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically he
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. read more
Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction
The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications
The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
FIDES, Reliability Assessment of Electronics: A New Approach to the LeadFree Process Factor
The reliability control in airborne electronics products is essential due to safety and business reasons. As users do not have confidence in raw results provided by previous reliability pred
.. read more
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. read more
Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague
Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n
.. read more
A Framework for Large-Scale AI-Assisted Quality Inspection Implementation in Manufacturing Using Edge Computing
In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. Manufacturing indust
.. read more
The Case for an Electronics Supply Chain Blockchain
Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized
.. read more
Enriching Test Equipment Analytics with Structured Logging
Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a pa
.. read more
A Guide to Manufacturing Data Analytics
Data is the New Oil
Clive Humby, UK Mathematician and architect of Tesco’s Clubcard is widely credited as the first to coin the phrase in 2006: “Data is the new oil. It’s valuable,
.. read more
Advanced, Non-Real-Time Uses of Machine Data for Factory Operational Improvement
EMS factories have collected and used machine data for many decades. Over that time, much of the value derived from machine data collection has come from three operational use cases: allowin
.. read more
A Structured Approach for Providing well-formed Maintenance Data for SMT Machines
Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. A simple approach for equipment maintenance,
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Implementing a Global Machine Data Collection System Across Many EMS Factories
As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. Managing
.. read more
Implementation of IPC CFX Using Surface Mount Legacy Equipment
The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. The Man
.. read more
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Emerging Supply Chain Cybersecurity Requirements, Government Acronyms, and Actual Security
Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC
.. read more
IPC-1791, Cybersecurity Maturity Model Certification (CMMC), and the Printed Circuit Board Design, Fabrication, and Assembly Industry
This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the Unit
.. read more
CyberSecurity Concerns for the Printed Circuit Board Industry
This slide show discusses the cybersecurity risks associated with network integration. The supply chain is the most vulnerable, especially sub suppliers. A particular risk is whe
.. read more
Present Company Not Excluded – New Cybersecurity Regulations Will Affect Your Business (and make it safer)
Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual
.. read more
Circuit Board Security Vulnerabilities and Counteractions
Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. To demonstrate their vulnerability, a circuit
.. read more
DoD Cybersecurity: Where We Are Now and What Needs to Be Done to Be Compliant
This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically he
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. read more
Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction
The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications
The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
FIDES, Reliability Assessment of Electronics: A New Approach to the LeadFree Process Factor
The reliability control in airborne electronics products is essential due to safety and business reasons. As users do not have confidence in raw results provided by previous reliability pred
.. read more
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. read more
Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague
Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n
.. read more
A Framework for Large-Scale AI-Assisted Quality Inspection Implementation in Manufacturing Using Edge Computing
In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. Manufacturing indust
.. read more
The Case for an Electronics Supply Chain Blockchain
Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized
.. read more
Enriching Test Equipment Analytics with Structured Logging
Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a pa
.. read more
A Guide to Manufacturing Data Analytics
Data is the New Oil
Clive Humby, UK Mathematician and architect of Tesco’s Clubcard is widely credited as the first to coin the phrase in 2006: “Data is the new oil. It’s valuable,
.. read more
Advanced, Non-Real-Time Uses of Machine Data for Factory Operational Improvement
EMS factories have collected and used machine data for many decades. Over that time, much of the value derived from machine data collection has come from three operational use cases: allowin
.. read more
A Structured Approach for Providing well-formed Maintenance Data for SMT Machines
Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. A simple approach for equipment maintenance,
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Implementing a Global Machine Data Collection System Across Many EMS Factories
As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. Managing
.. read more
Implementation of IPC CFX Using Surface Mount Legacy Equipment
The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. The Man
.. read more