Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
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Event
IPC APEX EXPO 2017
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive
For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all
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Event
IPC APEX EXPO 2017
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
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Event
IPC APEX EXPO 2017
Unlocking the Mystery of Aperture Architecture for Fine Line Printing
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h
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Event
IPC APEX EXPO 2017
"0201 Parts (0.25 Mm X 0.125 Mm,008004") "Arrived on the Scene in Order to Make the Technology for Future Device Terminals Possible
To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and m
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Event
IPC APEX EXPO 2017
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
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Event
IPC APEX EXPO 2017
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
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Event
IPC APEX EXPO 2017
Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essenti
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Event
IPC APEX EXPO 2017
New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
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Event
IPC APEX EXPO 2017
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
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Event
IPC APEX EXPO 2017
Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha
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Event
IPC APEX EXPO 2017
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
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Event
IPC APEX EXPO 2017
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High Reliability Applications
In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable.
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Event
IPC APEX EXPO 2017
Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past th
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Event
IPC APEX EXPO 2017
Counterfeit Electronic Components Identification: A Case Study
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This pa
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Event
IPC APEX EXPO 2017
Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
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Event
IPC APEX EXPO 2017
Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations
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Event
IPC APEX EXPO 2017
3D Printed Electronics for Printed Circuit Structures
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o
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Event
IPC APEX EXPO 2017
Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el
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Event
IPC APEX EXPO 2017
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app
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Event
IPC APEX EXPO 2017
High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process
Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manu
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Event
IPC APEX EXPO 2017
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
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Event
IPC APEX EXPO 2017
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
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Event
IPC APEX EXPO 2017
Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i
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Event
IPC APEX EXPO 2017
Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the t
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Event
IPC APEX EXPO 2017
Process Control of Ionic Contamination Achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series produ
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Event
IPC APEX EXPO 2017
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of
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Event
IPC APEX EXPO 2017
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
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Event
IPC APEX EXPO 2017
Surface Mount Signed Warpage Case Study
Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a sin
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Event
IPC APEX EXPO 2017
Process Optimization for Fine Feature Solder Paste Dispensing
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such
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Event
IPC APEX EXPO 2017
Jetting of Isotropic Conductive Adhesives with Silver Coated Polymer Particles
The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding
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Event
IPC APEX EXPO 2017
Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or
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Event
IPC APEX EXPO 2017
An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated so
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Event
IPC APEX EXPO 2017
Rework Challenges for Leading Edge Components BGA,QFN,and LED in Today's Fast Moving Industry
The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density
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Event
IPC APEX EXPO 2017
AOI Capabilities Study with 03015 Component
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the speci
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Event
IPC APEX EXPO 2017
Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor
Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically,the d
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Event
IPC APEX EXPO 2017
High Frequency Dk and Df Test Methods Comparison,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc
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Event
IPC APEX EXPO 2017
Influence of Copper Conductor Surface Treatment for High Reliability PCB on Electrical Properties and Reliability
Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r
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Event
IPC APEX EXPO 2017
The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ
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Event
IPC APEX EXPO 2017
Use of High Purity Water to Eliminate Contamination and Achieve Cleanliness - A Discussion of Performance and Costs
PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on productio
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Event
IPC APEX EXPO 2017
SIR Test Vehicles - Comparison from a Cleaning Perspective
PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great
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Event
IPC APEX EXPO 2017
Does Cleaning the PCB Before Conformal Coating Add Value
Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. The reliability of
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Event
IPC APEX EXPO 2017
Application Methods and Thermal Mechanical Reliability of Polymeric Solder Joint Encapsulation Materials (SJEM) on SnAgCu Solder Joints
With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing signific
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Event
IPC APEX EXPO 2017
An Investigation into the Durability of Stencil Coating Technologies
It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide
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Event
IPC APEX EXPO 2017
Evaluation,Selection and Qualification of Replacement Reworkable Underfill Materials
A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d
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Event
IPC APEX EXPO 2017
Effect of Encapsulation Materials on Tensile Stress During Thermo-Mechanical Cycling of Pb-Free Solder Joints
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec
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Event
IPC APEX EXPO 2017
Database Driven Multi Media Work Instructions
Work instructions are time consuming to generate for engineers,often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail,with
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Event
IPC APEX EXPO 2017
Embracing a New Paradigm: Electronic Work Instructions (EWI)
While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation a
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Event
IPC APEX EXPO 2017
Soldering Immersion Tin
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the r
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Event
IPC APEX EXPO 2017
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free
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Event
IPC APEX EXPO 2017