Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Advanced, Non-Real-Time Uses of Machine Data for Factory Operational Improvement
EMS factories have collected and used machine data for many decades. Over that time, much of the value derived from machine data collection has come from three operational use cases: allowin
.. read more
A Structured Approach for Providing well-formed Maintenance Data for SMT Machines
Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. A simple approach for equipment maintenance,
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Implementing a Global Machine Data Collection System Across Many EMS Factories
As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. Managing
.. read more
Implementation of IPC CFX Using Surface Mount Legacy Equipment
The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. The Man
.. read more
The Role for Automation and Robotics in Electronics Manufacturing
Why use robotics?
Precision -> improved quality
Consistency -> improved quality
Traceability -> improved quality
Dexterity -> to handl
.. read more
Working with Augmented Realityin Electronics Manufacturing
This paper discusses the automation of inspection using Augmented Reality (AR). Machine vision is used to find small components since it reduces the amount of time needed for ins
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. read more
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
Technology Verification for Reliable Smart Surfaces
The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well
.. read more
Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice
The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a
.. read more
Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. read more
Comparative Corrosion: Engineered Aqueous Cleaner vs. Ph Neutral -Round 1
The corrosion mechanism in the aqueous cleaning process is poorly understood. Much of the prior work is theoretical, based solely on Pourbaix Diagrams. These diagrams are based on the thermo
.. read more
Solder Mask and Low Standoff Component Cleaning – A Connection?
Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With
.. read more
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. read more
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. read more
Cure Temperature Impact on Silicone Properties
Most dispensable thermosetting products are supplied as blends of monomers or pre-polymers. Curing involves a complicated chemical “dance” with a precise sequence of polymerization of one or
.. read more
High Performance Light and Moisture Dual Curable Encapsulant
Light-curable materials can provide significant benefits over conventional technologies, including very fast tack free curing, lower operating costs driven by lower labor needs, space saving
.. read more
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. read more
01005 Rework – Barricades and Technological Processes
Chip components are important elements in electronic production since surface mount technology was introduced. Over the years, package size has constantly decreased. The small resistors and
.. read more
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. read more
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Lessons Learned While Investigating Microvia Reliability Failures.
Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi
.. read more
Functional Testing of Complex Circuits with Automatic Test Equipment in Manufacturing and Support
Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem
.. read more
Advanced, Non-Real-Time Uses of Machine Data for Factory Operational Improvement
EMS factories have collected and used machine data for many decades. Over that time, much of the value derived from machine data collection has come from three operational use cases: allowin
.. read more
A Structured Approach for Providing well-formed Maintenance Data for SMT Machines
Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. A simple approach for equipment maintenance,
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Implementing a Global Machine Data Collection System Across Many EMS Factories
As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. Managing
.. read more
Implementation of IPC CFX Using Surface Mount Legacy Equipment
The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. The Man
.. read more
The Role for Automation and Robotics in Electronics Manufacturing
Why use robotics?
Precision -> improved quality
Consistency -> improved quality
Traceability -> improved quality
Dexterity -> to handl
.. read more
Working with Augmented Realityin Electronics Manufacturing
This paper discusses the automation of inspection using Augmented Reality (AR). Machine vision is used to find small components since it reduces the amount of time needed for ins
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. read more
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
Technology Verification for Reliable Smart Surfaces
The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well
.. read more
Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice
The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a
.. read more
Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. read more
Comparative Corrosion: Engineered Aqueous Cleaner vs. Ph Neutral -Round 1
The corrosion mechanism in the aqueous cleaning process is poorly understood. Much of the prior work is theoretical, based solely on Pourbaix Diagrams. These diagrams are based on the thermo
.. read more
Solder Mask and Low Standoff Component Cleaning – A Connection?
Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With
.. read more
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. read more
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. read more
Cure Temperature Impact on Silicone Properties
Most dispensable thermosetting products are supplied as blends of monomers or pre-polymers. Curing involves a complicated chemical “dance” with a precise sequence of polymerization of one or
.. read more
High Performance Light and Moisture Dual Curable Encapsulant
Light-curable materials can provide significant benefits over conventional technologies, including very fast tack free curing, lower operating costs driven by lower labor needs, space saving
.. read more
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. read more
01005 Rework – Barricades and Technological Processes
Chip components are important elements in electronic production since surface mount technology was introduced. Over the years, package size has constantly decreased. The small resistors and
.. read more
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. read more
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Lessons Learned While Investigating Microvia Reliability Failures.
Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi
.. read more
Functional Testing of Complex Circuits with Automatic Test Equipment in Manufacturing and Support
Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem
.. read more