Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Pick-and-Place Feeder density within SMT and Electronics Assembly
With the growth of Surface Mount Technology (SMT) driven by new technological innovations and next generation products, machine feeder density becomes extremely important in electronics manu
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Event
IPC APEX EXPO 2020
Impact of PCB Manufacturing, Design, and Material to PCB Warpage
Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of
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Event
IPC APEX EXPO 2020
California Proposition 65 Review
Warning required to be provided for exposing person to a listed chemical, unless “person in the course of doing business” can demonstrate it does not pose “significant risk” •App
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Event
IPC APEX EXPO 2020
Update on Proposition 65
California
Clear and reasonable warnings
•Overview of new warning regulation •Retailer warnings accompanying sale •Warnings website •Listings•Compliance assis
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Event
IPC APEX EXPO 2020
Pb-free BGAs in a SnPb Assembly: An Overview of ARP6415
Intended for use as technical guidance by ADHP (Aerospace, Defense, and High-Performance) electronics system customers to provide the technical structure needed to allow the designer to eval
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Event
IPC APEX EXPO 2020
Qualified Manufacturing Process Development by Applying IPC J-STD-001G Cleanliness Standard
J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b
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Event
IPC APEX EXPO 2020
Transient AMR Project for Semiconductor Products: Phase 1
Findings and recommendations are reported from phase 1 of the Transient AMR(absolute maximum ratings) project, which is sponsored by the EOS/ESD Association and Industry Council on ESD Targe
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Event
IPC APEX EXPO 2020
Measuring the Impact of Test Methodsfor High-Frequency Circuit Materials
High-frequency materials are characterized by several important parameters, including the dielectric constant or relative permittivity (εr) and the dissipation factor (Df). For those paramet
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Event
IPC APEX EXPO 2020
A Cost-Effective Method for Accurate PCB Impedance Simulation of Any Specific Stack-Ups
This paper analyzes the reasons of inaccurate PCB impedance simulation of the traditional simulator and introduces a novel and cost-effective method for accurate PCB impedance simulation of
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Event
IPC APEX EXPO 2020
Optimization of PCB SI Coupon Design that Minimizes Discontinuity through Via-In-Pad Plated Over (VIPPO) Technique
The importance of signal integrity is emphasized as signal speed increases, and higher frequencies are applied. The PCB manufacturer uses SI coupons that can replace the in-product circuit t
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Event
IPC APEX EXPO 2020
Acid Copper Electroplating Processes With Excellent V-Pit Resistance for Flash Etching
Driven by rapid changes and markets, the electronics industry has seen massive growth over the past few decades. The short product life cycle has pushed PCB fabrication technology to its lim
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Event
IPC APEX EXPO 2020
Non‐Destructive Measurement Improvements in Determining the Phosphorus Content in Electroless Nickel Deposits for ENIG And ENEPIG Using XRF
Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme
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Event
IPC APEX EXPO 2020
Comparing the Reliability Performance of Electroless Palladium and Autocatalytic Gold in Production Environment
The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman
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Event
IPC APEX EXPO 2020
ENEPIG -How the Process Characteristics Influence the Layer Performance
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai
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Event
IPC APEX EXPO 2020
Reliable Nickel-Free Surface Finish Solution for High-Frequency-HDIPCB Applications
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the pri
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Event
IPC APEX EXPO 2020
Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
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Event
IPC APEX EXPO 2020
Fill The Void V - Mitigation of Voiding for Bottom Terminated Components
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, s
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Event
IPC APEX EXPO 2020
WECC Global PCB Production Report 2020
WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o
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Event
WECC
WECC Global PCB Production Report
WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o
.. read more
Event
WECC
Dispensing EMI Shielding Materials: An Alternative to Sputtering
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards,wireless charging of mobile electronics,in-pack
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Event
IPC APEX EXPO 2019
Robust Reliability Testing for Drop-on-Demand Jet Printing
In this study,the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids,such as solder paste and conductive adh
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Event
IPC APEX EXPO 2019
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
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Event
IPC APEX EXPO 2019
Innovative Electroplating Processes for IC Substrates - Via Fill,Through Hole Fill and Embedded Trench Fill
In this era of electronics miniaturization,high yield and low cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip
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Event
IPC APEX EXPO 2019
Evaluating the Recess Depths of Recess-in-Motherboards using Different Metrologies
The demand to produce smaller electronic devices and products to meet the needs of consumer electronic applications has resulted in thinner ball grid array (BGA) packages with finer pitches. Du
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Event
IPC APEX EXPO 2019
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess
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Event
IPC APEX EXPO 2019
Head-on-Pillow Defect Detection - X-ray Inspection Limitations
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Pack
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Event
IPC APEX EXPO 2019
New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic micro
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Event
IPC APEX EXPO 2019
Mixed Metal Oxide "MMO" Insoluble Anode System for Enhanced Operational Acid Copper Plating of Printed Wire Boards "PWB"
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
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Event
IPC APEX EXPO 2018
Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
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Event
IPC APEX EXPO 2018
Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important tec
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Event
IPC APEX EXPO 2018
From Leaded to Leadless SMD (DFN) Packages. Enabling Automatic Optical Inspection (AOI) for Leadless (DFN) Packages Via Side Wettable Flanks
Leadless semiconductor plastic packages (QFN) is a growing package category in terms of market share and diversity. This is also valid for low pin count semiconductors (e.g.: transistors and di
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Event
IPC APEX EXPO 2018
Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are
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Event
IPC APEX EXPO 2018
Cleaning Flux Residue Under Leadless Components Using Objective Evidence to Determine Cleaning Performance
Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf
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Event
IPC APEX EXPO 2018
Evaluation of Novel Thermosetting Stretchable Conductive Inks and Substrates for "Stretchtronics" Applications
Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf
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Event
IPC APEX EXPO 2018
Washability of E-Textile Materials
E-textiles,also known as electronic textiles,smart textiles,smart clothing,smart garments,or smart fabrics,are fabrics with electronic components and sensors embedded in them. Key components of
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Event
IPC APEX EXPO 2018
Overview of XR in a Manufacturing Environment
The Augmented Reality and Virtual Reality market is expected to cross $44 billion by the year 2025 according to various industry experts. This exciting new technology is not exactly new,but has
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Event
IPC APEX EXPO 2018
Full Material Declarations: Removing Barriers to Environmental Data Reporting
Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o
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Event
IPC APEX EXPO 2018
Reaching Across Data Silos in the Electronics Supply Chain to Achieve Parts-Per-Billion Quality Levels
With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri
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Event
IPC APEX EXPO 2018
Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
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Event
IPC APEX EXPO 2018
Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
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Event
IPC APEX EXPO 2018
Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards
There are numerous techniques to singulate printed circuit boards after assembly including break-out,routing,wheel cutting and now laser cutting. Lasers have several desirable advantages such a
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Event
IPC APEX EXPO 2018
How Detrimental Production Concerns Related to Solder Mask Residues Can be Countered by Simple Operational Adaptations
The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective
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Event
IPC APEX EXPO 2018
Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used
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Event
IPC APEX EXPO 2018
Effects of Temperature Uniformity on Package Warpage
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa
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Event
IPC APEX EXPO 2018
Bond Strength Optimization of Silicone Thermally Conductive Adhesives for Heatsink Attachment
Silicone thermal interface materials (TIM) are used to bond heatsinks on many critical components in server card assemblies in typical industry systems. Silicone TIMs have excellent high temper
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Event
IPC APEX EXPO 2018
Fill the Void IV: Elimination of Inter-Via Voiding
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void.
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Event
IPC APEX EXPO 2018
Voids in SMT Solder Joints - Myths Revisited
Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format
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Event
IPC APEX EXPO 2018
Residue Analysis of Masking Alternatives for Advanced Electronics
Prior to any conformal or chemically vapor deposited coating process,specific areas and components-often called “keep out zones”-on the printed circuit board (PCB) assembly are generally masked
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Event
IPC APEX EXPO 2018
The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin Based No-Clean Solder Paste Flux Residues
Rosin-based no-clean solder pastes are the most widely used solder pastes in the world and dominate consumer electronics assembly. The most common rosin-based no-clean solder paste reflow envir
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Event
IPC APEX EXPO 2018
Correlations of Salt Composition and Surface Insulation Resistance Results
Sixteen simple inorganic salts were separately dissolved in water to a specific concentration,applied to separate Surface Insulation Resistance (SIR) coupons,dried and then the coupons were sub
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Event
IPC APEX EXPO 2018