Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry. Mid-chip solder ball
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Event
IPC APEX EXPO 2015
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
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Event
IPC APEX EXPO 2015
Circuit Technology Crossovers Where PCBs and Printed Electronics Meet
Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that makeconnections. Both PCB and PE technologies have been in use for a long time in
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Event
IPC APEX EXPO 2015
Options for Assembly using High Temperature Interconnection Technologies
There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics
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Event
IPC APEX EXPO 2015
Solder Joint Embrittlement Mechanisms,Solutions and Standards
The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component
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Event
IPC APEX EXPO 2015
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
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Event
IPC APEX EXPO 2015
pH Neutral Cleaning Agents - Market Expectation & Field Performance
With regard to precision cleaning applications within electronics manufacturing,pH neutral product development was a major breakthrough in recent years. The impetus for this development resulte
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Event
IPC APEX EXPO 2015
Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposur
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Event
IPC APEX EXPO 2015
Assembly Cleanliness and Whisker Formation
This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH)
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Event
IPC APEX EXPO 2015
Electroplated Copper Filling of Through Holes on Varying Substrate Thickness
This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th
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Event
IPC APEX EXPO 2015
CVS Control of a Via Fill Acid Copper Electroplating Baths
Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This pape
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Event
IPC APEX EXPO 2015
Corrosion Resistant Servers for Free-Air Cooling Data Centers
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce
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Event
IPC APEX EXPO 2015
Characterization,Prevention and Removal of Particulate Matter on Printed Circuit Boards
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH)
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Event
IPC APEX EXPO 2015
Dissolution of Metal Foils in Common Beverages
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e
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Event
IPC APEX EXPO 2015
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
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Event
IPC APEX EXPO 2015
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil
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Event
IPC APEX EXPO 2015
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication
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Event
IPC APEX EXPO 2015
Evaluation of Under-Stencil-Cleaning-Papers
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen
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Event
IPC APEX EXPO 2015
Selecting Stencil Technologies to Optimize Print Performance
The SMT stencil is a key factor in the solder paste printing process. It has been shown repeatedly that print quality has the largest impact on end-of-line quality,and a good print process can
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Event
IPC APEX EXPO 2015
Enabling High-Speed Printing Using Low Cost Materials: Process Stability is Paramount
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. As manufacturers d
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Event
IPC APEX EXPO 2015
A High Reliability,Stress-free Copper Deposit for FPC,Polyimide,and Rigid-Flex
Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a
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Event
IPC APEX EXPO 2015
Reliability Implications of Pinhole Defects in Soldermask
What are the Raw Material Risks?
-Today PCB Suppliers handle a range of customers with different end use environments
-Telecommunications
-Automotive
-Consumer electronics
-
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Event
IPC APEX EXPO 2015
A Novel Conformal Back-Up Material and Process for Drilling Plated Circuit Boards
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte
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Event
IPC APEX EXPO 2015
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
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Event
IPC APEX EXPO 2015
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
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Event
IPC APEX EXPO 2015
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
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Event
IPC APEX EXPO 2015
Streamlining PCB Assembly and Test NPI with Shared Component Libraries
PCB assembly designs become more complex year-on-year,yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge.
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Event
IPC APEX EXPO 2015
Flexibility Testing of Printed and Wearable Electronics
•Introduction to printed and wearable electronics
•Flexibility testing challenges
•Proposals for flexibility testing
•Validation case studies
•Future work
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Event
IPC APEX EXPO 2015
Sustainable Product Design and Supplier Material Disclosure
Sustainable product design and the task of bringing new,earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance
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Event
IPC APEX EXPO 2015
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t
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Event
IPC APEX EXPO 2015
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
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Event
IPC APEX EXPO 2015
Effectiveness of Different Materials as Heat Shields during Reflow/Rework
As device density continues to maximize the PCB real estate the reflowing of neighboring components or damaging of heat-sensitive components in the rework process continues to cause problems. D
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Event
IPC APEX EXPO 2015
Investigation into Challenges of using .BSDL Files: iNEMI Survey Results and Conclusions
The number one issue identified by the 2009 International Electronics Manufacturing Initiative (iNEMI) Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan descr
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Event
IPC APEX EXPO 2015
Causes and Costs of No Fault Found Events
No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor
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Event
IPC APEX EXPO 2015
3D Assembly Processes a Look at Today and Tomorrow
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi
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Event
IPC APEX EXPO 2015
New Approaches to Develop a Scalable 3D IC Assembly Method
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi
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Event
IPC APEX EXPO 2015
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
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Event
IPC APEX EXPO 2015
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
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Event
IPC APEX EXPO 2015
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is to Deliver Optimum Balance Between Landed Cost and Time to Market
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo
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Event
IPC APEX EXPO 2015
How Reshoring Drives Profitability
For many years,manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essen
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Event
IPC APEX EXPO 2015
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
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Event
IPC APEX EXPO 2015
Refining Stencil Design to Counter HiP Defects
Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone
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Event
IPC APEX EXPO 2015
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2A
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). In phase 1 of the proj
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Event
IPC APEX EXPO 2015
How Clean is Clean Enough - At What Level Does Each of the Individual Contaminants Cause Leakage and Corrosion Failures in SIR
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6,10 and 50 mil spacing): 12 ionic con
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Event
IPC APEX EXPO 2015
IPC-CC-830B Versus the 'Real World': Part 2
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal
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Event
IPC APEX EXPO 2015
Ultrathin Fluoropolymer Coatings to Mitigate Damage of Printed Circuit Boards Due to Environmental Exposure
As consumers become more reliant on their handheld electronic devices and take them into new environments,devices are increasingly exposed to situations that can cause failure. In response,the
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Event
IPC APEX EXPO 2015
Influence of Plating Quality on Reliability of Microvias
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi
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Event
IPC APEX EXPO 2015
Long term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose,methodology,and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliab
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Event
IPC APEX EXPO 2015
Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technolo
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Event
IPC APEX EXPO 2015