Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Comparative Corrosion: Engineered Aqueous Cleaner vs. Ph Neutral -Round 1
The corrosion mechanism in the aqueous cleaning process is poorly understood. Much of the prior work is theoretical, based solely on Pourbaix Diagrams. These diagrams are based on the thermo
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Solder Mask and Low Standoff Component Cleaning – A Connection?
Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre
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Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
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Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With
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Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
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Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
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Cure Temperature Impact on Silicone Properties
Most dispensable thermosetting products are supplied as blends of monomers or pre-polymers. Curing involves a complicated chemical “dance” with a precise sequence of polymerization of one or
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High Performance Light and Moisture Dual Curable Encapsulant
Light-curable materials can provide significant benefits over conventional technologies, including very fast tack free curing, lower operating costs driven by lower labor needs, space saving
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Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
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01005 Rework – Barricades and Technological Processes
Chip components are important elements in electronic production since surface mount technology was introduced. Over the years, package size has constantly decreased. The small resistors and
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PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
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The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
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High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
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Lessons Learned While Investigating Microvia Reliability Failures.
Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi
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Functional Testing of Complex Circuits with Automatic Test Equipment in Manufacturing and Support
Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem
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A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
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Testing and Implementation of Direct Imaging and Direct Jetting of Solder Mask
Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. This trend is mot
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Detect PCB Stack-up Error with Machine Learning Methods
In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o
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The IPC CFX Standard as it Applies to Reflow Soldering
The advent of the Industry 4.0 Revolution and Internet of Manufacturing (IoM) has started to yield Smart factories, intelligent machines and networked processes, that have brought us improve
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Optimizing Throughput and Cost with Manufacturing Simulation
Electronics assembly can be delivered at competitive market prices only as long as the manufacturing process is continuously improved. Manufacturing companies are mastering with the help of
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Interfacing Machines with Manufacturing Software: What Exactly Does It Entail and Is It Worth the Hassle?
With the ascent of Industry 4.0, the urgency of connecting to equipment on a manufacturing line is increasing. This article focuses on the electronics industry and summarizes what that inter
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A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
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Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat
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Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
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Innovative Panel Plating for Heterogeneous Integration
The migration to large panel substrates in advanced packaging applications is principally motivated by cost considerations. However, it is occurring at a time when package processing is beco
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