Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
.. read more
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
.. read more
Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
.. read more
Hybrid S-Parameters Behavior of Weak and Strong Edge-Coupled Differential Lines on PCBs
Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S
.. read more
Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils
Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou
.. read more
Study and Recommendation for Increasing PCB Surface Finish Shelf Life
Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting
.. read more
Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
.. read more
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN
.. read more
Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
.. read more
Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
.. read more
X-ray Inspection of Radiation Sensitive Devices Recommended Best Practices for Preprogramed Managed NAND
Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def
.. read more
Electric Field Control - EOS Mystery Solved
A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo
.. read more
PCBA Redesigns Done in the Right Way
Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life
.. read more
Improved Interoperability Between MCAD and ECAD Design Tools
During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be
.. read more
Library Management for an Ever-Evolving Diverse EDA Tool Industry
Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and
.. read more
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. read more
Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes
In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi
.. read more
Water Resistant,Sprayable and Dippable Nano-Coatings for Printed Circuit Assemblies
The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res
.. read more
Development of a High Temperature Protective Coating to Enable Organic Printed Circuit Boards to Operate at Higher Temperatures
Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co
.. read more
Analyzing a Printed Circuit Board Weave Exposure Condition and its Effects on Printed Wiring Assembly Functional Performance
Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe
.. read more
Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
.. read more
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
.. read more
Zero-Fault Production in Soldering Processes: Quality Management Based on Quality Assurance
A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r
.. read more
Advanced Non-Pressure Silver Sinter Process by Infrared
In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de
.. read more
Investigation of the Assembly Process of m03015 and a Brief Look at m0201 Components
Components are still shrinking in the SMT world and the next evolution of the passive components are the m03015 (009005) and m0201 (008004). Today it is seen that the 01005 component is still r
.. read more
Volume Repeatability for Non-Contact Jet Printing of Solder Paste
Solder paste is one of the most common materials used in surface mount technology (SMT) processes. Typical methods for applying solder paste to devices are needle dispensing or screen printing,
.. read more
Implementing Two-Component Conformal Coatings into Production
Conformal coating formulators are developing two-component solutions that improve protection,adhesion,and cure speed. Multi-component coatings are not new to the industry. Some of the oldest co
.. read more
Innovative Plasmacoatings for High Volume Conformal Coating of Electronics
Plasma is considered to be the 4th state of matter. Decomposed molecules interact with all exposed surfaces of the material,even the inner surfaces of open cell structures. In low pressure plas
.. read more
Comparison of Finite Elements Based Thermal Shock Test Reliability Assessment with a Specimen Based Test Approach
When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task.
.. read more
Enhancing Printed Circuit Board Layout Using Thermo-Mechanical Analysis
The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse
.. read more
Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
.. read more
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
.. read more
Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
.. read more
Hybrid S-Parameters Behavior of Weak and Strong Edge-Coupled Differential Lines on PCBs
Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S
.. read more
Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils
Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou
.. read more
Study and Recommendation for Increasing PCB Surface Finish Shelf Life
Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting
.. read more
Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
.. read more
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN
.. read more
Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
.. read more
Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
.. read more
X-ray Inspection of Radiation Sensitive Devices Recommended Best Practices for Preprogramed Managed NAND
Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def
.. read more
Electric Field Control - EOS Mystery Solved
A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo
.. read more
PCBA Redesigns Done in the Right Way
Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life
.. read more
Improved Interoperability Between MCAD and ECAD Design Tools
During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be
.. read more
Library Management for an Ever-Evolving Diverse EDA Tool Industry
Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and
.. read more
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. read more
Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes
In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi
.. read more
Water Resistant,Sprayable and Dippable Nano-Coatings for Printed Circuit Assemblies
The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res
.. read more
Development of a High Temperature Protective Coating to Enable Organic Printed Circuit Boards to Operate at Higher Temperatures
Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co
.. read more
Analyzing a Printed Circuit Board Weave Exposure Condition and its Effects on Printed Wiring Assembly Functional Performance
Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe
.. read more
Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
.. read more
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
.. read more
Zero-Fault Production in Soldering Processes: Quality Management Based on Quality Assurance
A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r
.. read more
Advanced Non-Pressure Silver Sinter Process by Infrared
In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de
.. read more
Investigation of the Assembly Process of m03015 and a Brief Look at m0201 Components
Components are still shrinking in the SMT world and the next evolution of the passive components are the m03015 (009005) and m0201 (008004). Today it is seen that the 01005 component is still r
.. read more
Volume Repeatability for Non-Contact Jet Printing of Solder Paste
Solder paste is one of the most common materials used in surface mount technology (SMT) processes. Typical methods for applying solder paste to devices are needle dispensing or screen printing,
.. read more
Implementing Two-Component Conformal Coatings into Production
Conformal coating formulators are developing two-component solutions that improve protection,adhesion,and cure speed. Multi-component coatings are not new to the industry. Some of the oldest co
.. read more
Innovative Plasmacoatings for High Volume Conformal Coating of Electronics
Plasma is considered to be the 4th state of matter. Decomposed molecules interact with all exposed surfaces of the material,even the inner surfaces of open cell structures. In low pressure plas
.. read more
Comparison of Finite Elements Based Thermal Shock Test Reliability Assessment with a Specimen Based Test Approach
When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task.
.. read more
Enhancing Printed Circuit Board Layout Using Thermo-Mechanical Analysis
The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse
.. read more