Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
The Needs for, and Problems Experienced While Developing a Successful Low Palladium Activation System for Electroless Copper Deposition.
The electroless deposition of Copper is widely used within the printed circuit board industry as it offers a simple and reliable method for metallizing holes, which subsequently enable multi
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Process Characterization that Results in Acceptable Levels of Flux and Other Residues
Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di
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Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp
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Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
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Discrete Event Simulation in Electronics Manufacturing Operations
Every year, billions and billions of products are made and sold across the world. Each of these products, regardless of volume, are made in facilities that follow certain steps to assemble,
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Single Device Traceability in Assembly without ECID
Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and
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Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices
Machine Learning
Edge Computing
Edge AI
Demonstrated using a Case Study on HiP (Head in Pillow) defect detection
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Achieving Solder Reliability for LGA Ceramic Image Sensors Through Refinement of SMT Soldering Processes
New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro
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Temperature Cycling with Bending to Reproduce Typical Product Loads
In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests
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System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
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Jet-Dispensed SMT Adhesives for Durable Printed Electronics
Polymer Thick Film(PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. This pap
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Improved Process Yield with Dynamic “real-time” Dual Head Dispensing
Today’s unique assembly challenges are comprised of complex PCB panelization, involving identical PCBs with a goal towards increased production capability, due to a reduced footprint of the
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Industrial Beta Deployment of 1st Domestic, High Volume SAP Process for Resolving HDI Technologies Down to 25 Micron Space and Trace
The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the vo
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Advanced Interconnect Process Enables Very High-DensityPCB Structures
The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fa
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Industry 4.0 - How we transform a Buzzword into Manufacturing Excellence in Electronics: Case Study for Improving the PCB Print Process Using Factory Data
The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged
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The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing
The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service o
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Optimization of Robotic Soldering Process: A Focus on Solder Spread and Spattering
Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient th
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Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
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Structural Electronics for Automotive Interiors
This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics a
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Vibration Testing of Harsh Environment Solder Alloys
Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. These loadings might affect the fatigue life of solder
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Materials Considerations for Automotive Radar Designs: Increasing Reliability in Automotive Safety Systems
Radio Detection and Ranging (radar) sensors require specialized materials and specific tolerances in order to optimize their function. However, although not new to many markets, such as the
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Hot AirBGARework Process Improvement with a Touchless Temperature-Dependent Live-Feedback Process
Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework t
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Get Rid of the Wooden Pick and Other Neanderthal Approaches for Rework of Underfilled Components
Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability.
Ball Grid Ar
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An Interesting Approach toYield Improvement
Whilst many forward-thinking companies invest time, effort and cost into up front work to fix snags which would lead to issues with yield during production, this paper shows the efforts of a
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Accuracy Validation Finds Hidden Problems Affecting DPMO
If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in surface mount technology (SMT)
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