Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Pick-and-Place Feeder density within SMT and Electronics Assembly
With the growth of Surface Mount Technology (SMT) driven by new technological innovations and next generation products, machine feeder density becomes extremely important in electronics manu
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Impact of PCB Manufacturing, Design, and Material to PCB Warpage
Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of
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California Proposition 65 Review
Warning required to be provided for exposing person to a listed chemical, unless “person in the course of doing business” can demonstrate it does not pose “significant risk” •App
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Update on Proposition 65
California
Clear and reasonable warnings
•Overview of new warning regulation •Retailer warnings accompanying sale •Warnings website •Listings•Compliance assis
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Pb-free BGAs in a SnPb Assembly: An Overview of ARP6415
Intended for use as technical guidance by ADHP (Aerospace, Defense, and High-Performance) electronics system customers to provide the technical structure needed to allow the designer to eval
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Qualified Manufacturing Process Development by Applying IPC J-STD-001G Cleanliness Standard
J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b
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Transient AMR Project for Semiconductor Products: Phase 1
Findings and recommendations are reported from phase 1 of the Transient AMR(absolute maximum ratings) project, which is sponsored by the EOS/ESD Association and Industry Council on ESD Targe
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Measuring the Impact of Test Methodsfor High-Frequency Circuit Materials
High-frequency materials are characterized by several important parameters, including the dielectric constant or relative permittivity (εr) and the dissipation factor (Df). For those paramet
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A Cost-Effective Method for Accurate PCB Impedance Simulation of Any Specific Stack-Ups
This paper analyzes the reasons of inaccurate PCB impedance simulation of the traditional simulator and introduces a novel and cost-effective method for accurate PCB impedance simulation of
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Optimization of PCB SI Coupon Design that Minimizes Discontinuity through Via-In-Pad Plated Over (VIPPO) Technique
The importance of signal integrity is emphasized as signal speed increases, and higher frequencies are applied. The PCB manufacturer uses SI coupons that can replace the in-product circuit t
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Acid Copper Electroplating Processes With Excellent V-Pit Resistance for Flash Etching
Driven by rapid changes and markets, the electronics industry has seen massive growth over the past few decades. The short product life cycle has pushed PCB fabrication technology to its lim
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Non‐Destructive Measurement Improvements in Determining the Phosphorus Content in Electroless Nickel Deposits for ENIG And ENEPIG Using XRF
Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme
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Comparing the Reliability Performance of Electroless Palladium and Autocatalytic Gold in Production Environment
The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman
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ENEPIG -How the Process Characteristics Influence the Layer Performance
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai
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Reliable Nickel-Free Surface Finish Solution for High-Frequency-HDIPCB Applications
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the pri
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Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
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Fill The Void V - Mitigation of Voiding for Bottom Terminated Components
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, s
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WECC Global PCB Production Report 2020
WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o
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WECC Global PCB Production Report
WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o
.. read more
Dispensing EMI Shielding Materials: An Alternative to Sputtering
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards,wireless charging of mobile electronics,in-pack
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Robust Reliability Testing for Drop-on-Demand Jet Printing
In this study,the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids,such as solder paste and conductive adh
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Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
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Innovative Electroplating Processes for IC Substrates - Via Fill,Through Hole Fill and Embedded Trench Fill
In this era of electronics miniaturization,high yield and low cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip
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Evaluating the Recess Depths of Recess-in-Motherboards using Different Metrologies
The demand to produce smaller electronic devices and products to meet the needs of consumer electronic applications has resulted in thinner ball grid array (BGA) packages with finer pitches. Du
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D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess
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