Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing
Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled,defects can be produced,which may no
.. read more
Optimization of Stencil Apertures to Compensate for Scooping During Printing
This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d
.. read more
Advanced Flexible Substrate Technology for Improved Accuracy,Definition,and Conductivity of Screen Printed Conductors
One of the major concerns with screen printing of low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the overwhelming spread of the paste bey
.. read more
Screen Making for Printed Electronics - Specification and Tolerancing
Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known
.. read more
Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates
Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve
.. read more
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
.. read more
Flowers of Sulfur Creep Corrosion Testing of Populated Printed Circuit Boards
Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may
.. read more
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
.. read more
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. read more
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive
For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all
.. read more
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. read more
Unlocking the Mystery of Aperture Architecture for Fine Line Printing
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h
.. read more
"0201 Parts (0.25 Mm X 0.125 Mm,008004") "Arrived on the Scene in Order to Make the Technology for Future Device...
To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and m
.. read more
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. read more
Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essenti
.. read more
New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. read more
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. read more
Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha
.. read more
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. read more
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High...
In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable.
.. read more
Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past th
.. read more
Counterfeit Electronic Components Identification: A Case Study
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This pa
.. read more
Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. read more
Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations
.. read more
3D Printed Electronics for Printed Circuit Structures
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o
.. read more
Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el
.. read more
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app
.. read more
Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing
Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled,defects can be produced,which may no
.. read more
Optimization of Stencil Apertures to Compensate for Scooping During Printing
This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d
.. read more
Advanced Flexible Substrate Technology for Improved Accuracy,Definition,and Conductivity of Screen Printed Conductors
One of the major concerns with screen printing of low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the overwhelming spread of the paste bey
.. read more
Screen Making for Printed Electronics - Specification and Tolerancing
Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known
.. read more
Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates
Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve
.. read more
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
.. read more
Flowers of Sulfur Creep Corrosion Testing of Populated Printed Circuit Boards
Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may
.. read more
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
.. read more
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. read more
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive
For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all
.. read more
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. read more
Unlocking the Mystery of Aperture Architecture for Fine Line Printing
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h
.. read more
"0201 Parts (0.25 Mm X 0.125 Mm,008004") "Arrived on the Scene in Order to Make the Technology for Future Device...
To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and m
.. read more
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. read more
Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essenti
.. read more
New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. read more
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. read more
Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha
.. read more
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. read more
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High...
In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable.
.. read more
Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past th
.. read more
Counterfeit Electronic Components Identification: A Case Study
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This pa
.. read more
Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. read more
Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations
.. read more
3D Printed Electronics for Printed Circuit Structures
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o
.. read more
Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el
.. read more
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app
.. read more