Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Mobile Electronics,How to Protect Internal Circuitry from A Harsh Environment
The portable electronics market has driven steep-slope growth for over a decade and continues to deliver amazing handheld electronic devices; manufacturers of these products are facing challeng
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Evaluating Corrosion Resistance of Ceramic Resistors: Mixed Flowing Gas versus Flower of Sulfur Tests
Multi-layer organic laminates which make up over 90% of the present types of interconnecting substrates in today’s electronics can develop a loss of insulation resistance between two biased con
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New High-Performance Organophosphorus Flame Retardant
A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This
non-reactive phosphorus-based material satisfies fire safety needs for a
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Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
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Potential Global Warming Contribution from a Typical Electronics
Examination of historical data for a defunct electronics manufacturing plant in Ontario,Canada has allowed the
determination of the potential global warming contribution by the plant for the ye
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Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
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QFN Flux Entrapment Case Study
The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan
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Printing and Assembly Challenges for QFN Devices
QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ
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Pad Cratering
Lead-free assembly has introduced many challenges and non-conformances. One of the more troubling non-conformances is “Pad Cratering”. Pad cratering is when the copper pad completely separates
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Consideration for Selection and Implementation of Low VOC Conformal Coating into High Reliability Electronics Manufacturing Operation
The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co
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Multifunctional Nanocomposite Liquid-Repellent Coatings/Films for the Electronics Industry
Recent advances in polymer science and nanomaterials have fueled a frenzy of scientific activity in multifunctional coatings and films. This rich subject area encompasses several scientific dis
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Lead Free Die Attach Technology for High Power Applications
TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materia
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Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
There has been increasing interest in the development of capillary ion chromatography (IC) systems and methods for determination of ionic species. The practice of ion chromatography in capillar
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Moisture Diffusion in Electronic Packaging Materials
Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a
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Is the ENIG Process Evil,or is it Maybe QA,Engineer or Sales Guy?
The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG h
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Jetting Solder Paste Opens Up New Possibilities in Your SMT Production
Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advan
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NPI Step Stencils- A New Approach
There are a variety of stencil approaches in which the new product process engineer can deal with the assembly of both high solder paste and low solder paste volume in an SMT assembly environme
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Dual Solvent Electronic Assembly Cleaning
Electronic Assemblies are cleaned in order to remove contaminations that may affect yields,service life and reliability. Highly dense interconnects entrap flux residues under the Z-axis. Volati
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Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
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The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper
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New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
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Environmental Compliance Reporting – Mastering a Moving Target
Companies that have initiated internal resources to obtain compliance data have realized that collecting,and more importantly,maintaining the currency of that data requires more resources than
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Scaling LCA with IPC-175x
- Live Cycle Assessment
- Early Product Analysis / “DFX” Challenge
- Keys to Scaling #1: Processes and Systems
- Systems can Extend “Traditional” LCA
- Keys to Scaling #2: Data Exchange Standar
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